公开(公告)号：US20160286658A1

公开(公告)日：2016-09-29

申请号：US15178686

申请日：2016-06-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masashi MATSUBARA

IPC: H05K3/00 ,  H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H05K1/02 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K3/0052 ,  B28B11/14 ,  B28B11/243 ,  B28B17/0018 ,  B32B18/00 ,  C04B2237/64 ,  C04B2237/68 ,  H01L2224/97 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/181 ,  H05K3/007 ,  H05K3/303 ,  H05K3/4629 ,  H05K3/4644 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2203/0228

Abstract: In a method for manufacturing ceramic substrates and module components, an unfired mother ceramic substrate is cut at predetermined positions for division into separate unfired ceramic substrates. The cut unfired mother ceramic substrate is pressed such that pressure is applied parallel or substantially parallel to its main surfaces so that the cross-sectional end surfaces created in the cutting step are joined. The unfired mother ceramic substrate including end surface junctions, resulting from joining of the cross-sectional end surfaces, is fired. The fired mother ceramic substrate is broken along the end surface junctions to divide it into separate ceramic substrates.

Abstract translation: 在陶瓷基板和模块部件的制造方法中，在预定位置切割未烧成的母体陶瓷基板，分割成分离的未烧结陶瓷基板。 将未切割的未烧母母基板按压使其平行或基本平行于其主表面施加压力，使得在切割步骤中产生的横截面端面相连接。 烧结由包含由横截面端面的接合而形成的端面接合部的未烧制的母材陶瓷基板。 烧成的母体陶瓷衬底沿着端面接合部分断开，将其分成单独的陶瓷衬底。

公开(公告)号：US20170079137A1

公开(公告)日：2017-03-16

申请号：US15358241

申请日：2016-11-22

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Yukio MAEDA ,  Masashi MATSUBARA ,  Daigo MATSUBARA ,  Masatoshi KARIYA

IPC: H05K1/03 ,  H05K1/14 ,  H05K3/00 ,  H05K1/18 ,  H05K3/22

CPC classification number: H05K1/0306 ,  H05K1/14 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/22 ,  H05K3/4629 ,  H05K2201/04 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/1126

Abstract: Provided is a mother ceramic substrate that, when divided into individual substrates (ceramic substrates), can be divided to cause divided end surfaces to be perpendicular to principal surfaces of the individual substrates, and that can provide ceramic substrates with high form accuracy; an individual ceramic substrate obtained from the mother ceramic substrate; a module component including the ceramic substrate; and a method of manufacturing a mother ceramic substrate. In a mother ceramic substrate that can be divided at a predetermined position and separated into a plurality of individual substrates, a dividing groove that defines a division position is formed in a principal surface on one side, and a protruding thread is formed on a principal surface on another side at a position corresponding to a position of the dividing groove formed in the principal surface on the one side in view in a thickness direction of the mother ceramic substrate.

Abstract translation: 提供了一种母体陶瓷基板，当分割成单独的基板（陶瓷基板）时，可以分割成分开的端面垂直于各个基板的主表面，并且可以提供高形状精度的陶瓷基板; 从母体陶瓷基板获得的单个陶瓷基板; 包括陶瓷基板的模块部件; 以及母体陶瓷基板的制造方法。 在可以在预定位置分割并分离成多个单独基板的母陶瓷基板中，在一侧的主表面上形成限定分割位置的分隔槽，并且在主表面上形成突出螺纹 在与母陶瓷基板的厚度方向一侧的主面的形成的分隔槽的位置对应的位置的另一侧。

公开(公告)号：US20190164676A1

公开(公告)日：2019-05-30

申请号：US16201900

申请日：2018-11-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Keiichi TSUDUKI ,  Kenji TANAKA ,  Masashi MATSUBARA

IPC: H01F17/00 ,  H01F17/04 ,  H01F1/34

Abstract: A component main body has a multilayer structure having a thickness and in which a first dielectric glass layer in which an internal conductor is embedded and having a thickness is interposed between a pair of magnetic layers containing a ferrite material as a primary component, and each of a pair of second dielectric glass layers is disposed on one of principal surfaces of the pair of magnetic layers. First to fourth outer electrodes are disposed on both end portions of the component main body. The thickness of at least one of the pair of second dielectric glass layers that faces a mounting substrate is about 10 μm to 64 μm.

公开(公告)号：US20200227225A1

公开(公告)日：2020-07-16

申请号：US16833331

申请日：2020-03-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Eiji YOKOMIZO ,  Masatoshi KARIYA ,  Masashi MATSUBARA

IPC: H01H85/48 ,  H01H85/08 ,  H01H85/143

Abstract: A chip-type fuse includes a main body portion composed of an insulating material, a fuse conductor that is disposed inside the main body portion and that has both end portions exposed at the main body portion, and a pair of outer electrodes that cover respective end portions of the main body portion and that are connected to respective end portions of the fuse conductor. A hollow portion is present inside the main body portion, and the fuse conductor has a fusing portion disposed along the wall surface of the hollow portion.

公开(公告)号：US20190159344A1

公开(公告)日：2019-05-23

申请号：US16255902

申请日：2019-01-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masashi MATSUBARA

IPC: H05K3/00 ,  H05K3/30 ,  H05K1/18 ,  H05K1/11 ,  B28B11/24 ,  B32B18/00 ,  B28B17/00 ,  B28B11/14 ,  H05K1/03 ,  H05K3/46 ,  H05K1/02

Abstract: In a method for manufacturing ceramic substrates and module components, an unfired mother ceramic substrate is cut at predetermined positions for division into separate unfired ceramic substrates. The cut unfired mother ceramic substrate is pressed such that pressure is applied parallel or substantially parallel to its main surfaces so that the cross-sectional end surfaces created in the cutting step are joined. The unfired mother ceramic substrate including end surface junctions, resulting from joining of the cross-sectional end surfaces, is fired. The fired mother ceramic substrate is broken along the end surface junctions to divide it into separate ceramic substrates.