RECYCLABLE PATCH-TYPE BONE CONDUCTION EARPHONE

    公开(公告)号:US20240244372A1

    公开(公告)日:2024-07-18

    申请号:US18544365

    申请日:2023-12-18

    IPC分类号: H04R5/033 H04R1/10

    摘要: A recyclable patch-type bone conduction earphone includes a casing structure, a circuit substrate, a control module, an audio signal receiving module, a wireless signal transmission module, a bone conduction module and a power supply module. The audio signal receiving module is configured to receive an environmental audio signal. The wireless signal transmission module is configured for wirelessly receiving a predetermined audio signal. The bone conduction module is configured to convert the predetermined audio signal into a predetermined vibration signal. The circuit substrate, the control module, the audio signal receiving module, the wireless signal transmission module and the bone conduction module can cooperate with each other to form an electronic assembly structure that is able to be recycled, so that the electronic assembly structure can be configured to be used in a new recyclable patch-type bone conduction earphone through a recycling process or related processing steps.

    APPARATUS AND METHODS FOR BONE CONDUCTION SPEAKER

    公开(公告)号:US20240244364A1

    公开(公告)日:2024-07-18

    申请号:US18621209

    申请日:2024-03-29

    IPC分类号: H04R1/10 H04R9/02

    摘要: A bone conduction speaker is provided herein. The bone conduction speaker may include a magnetic circuit component for providing a magnetic field, a vibration component located in the magnetic field, and a case. At least a part of the vibration component may convert an electrical signal into a mechanical vibration signal. The case may include a case panel facing a human body side and a case back opposite to the case panel, and accommodate the vibration component that causes the case panel and the case back to vibrate. A vibration of the case panel may have a first phase, and a vibration of the case back may have a second phase. When frequencies of the vibration of the case panel and the case back are within 2000 Hz to 3000 Hz, an absolute value of a difference between the first and the second phase(s) may be less than 60 degrees.

    EARPLUG
    75.
    发明公开
    EARPLUG 审中-公开

    公开(公告)号:US20240244360A1

    公开(公告)日:2024-07-18

    申请号:US18123322

    申请日:2023-03-19

    发明人: Being-Ruey Su

    IPC分类号: H04R1/10

    CPC分类号: H04R1/1016

    摘要: An earplug includes a hollow tube and a cover. The hollow tube has a top portion, a deformable curved portion and a first intermediate portion. The deformable curved portion is located between the top portion and the first intermediate portion. The deformable curved portion has an outer convex structure and an inner concave structure corresponding to the outer convex structure. The cover is connected to the top portion and surrounds the hollow tube.

    Method and apparatus for automatic correction of real ear measurements

    公开(公告)号:US12041418B2

    公开(公告)日:2024-07-16

    申请号:US17811467

    申请日:2022-07-08

    发明人: Wenyu Jin Tim Schoof

    IPC分类号: H04R25/00 H04R1/10 H04R3/04

    摘要: Disclosed herein are systems and methods for automatic correction of real ear measurements (REMs). A sound signal is produced through a receiver of a hearing device, and a sound pressure signal is sensed using a microphone placed inside the ear canal. The sound pressure signal is transformed to obtain a frequency response signal, a local minimum of the frequency response signal is detected above a programmable frequency level, and a spectral flatness of the frequency response signal is calculated in a selected frequency band surrounding the local minimum. If the spectral flatness is greater than a selected threshold value, acoustic correction is applied to the frequency response in the selected frequency band using an estimated transfer function to obtain a corrected sound pressure frequency response. The corrected sound pressure frequency response is used to modify, or make a recommendation to modify, a physical or operational characteristic of the hearing device.

    Cover for microphone-equipped earphone

    公开(公告)号:US12041403B2

    公开(公告)日:2024-07-16

    申请号:US17229380

    申请日:2021-04-13

    IPC分类号: H04R1/08 H04R1/10 A61F11/14

    摘要: A cover for microphone-equipped earphone having a microphone integral to an earphone used for communication equipment includes: a mouth-ear cover for covering a mouth while allowing speaking and covering one-side ear inserted with the earphone, wherein the mouth-ear cover having mouth and ear cover sections is configured such that: an internal space defined by the mouth cover section has a substantially hemispherical shape capable of covering the mouth, and has an edge of an opening capable of closely contacting a periphery of the mouth; an internal space defined by the ear cover section has a substantially semi-oval spherical shape capable of covering the one-side ear, and has an edge of an opening capable of closely contacting a periphery of the one-side ear; and the internal spaces defined by the mouth and ear cover sections are capable of communicating with each other via a voice passage through which voice is conveyable.

    Headphone adapter
    80.
    发明授权

    公开(公告)号:US12035095B2

    公开(公告)日:2024-07-09

    申请号:US17901373

    申请日:2022-09-01

    发明人: Jukka Manni

    IPC分类号: H04R1/10 G02B27/01 H04R5/033

    摘要: Disclosed is a headphone adapter (100, 204) having: first element (102) having first part (104) and second part (106) attached to first part, wherein recess (108) is defined between first part and second part; second element (110) having first end (112), second end (114) opposite to first end, and at least one third part (116) extending between first end and second end, wherein second element is rotatably attached to first element at first end; and third element (118) having fourth part (120) and attachment parts (122, 124) extending from fourth part, wherein fourth part is rotatably attached to second element at second end, and wherein headphone adapter, in use, enables attachment of a headphone device (216, 302) to a head-mounted device (208, 306) such that headband (206, 304) of head-mounted device passes through the recess defined in first element, and headband (214) of headphone device is attached to third element.