CIRCUIT BOARD ASSEMBLY, PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE, AND PREPARATION METHODS FOR CIRCUIT BOARD ASSEMBLY AND PHOTOSENSITIVE ASSEMBLY

    公开(公告)号:US20220367556A1

    公开(公告)日:2022-11-17

    申请号:US17770744

    申请日:2020-10-21

    IPC分类号: H01L27/146

    摘要: The present application relates to a circuit board assembly, a photosensitive assembly, a camera module, and preparation methods for the circuit board assembly and the photosensitive assembly. The photosensitive assembly includes a circuit board and a photosensitive chip. The circuit board includes a circuit board main body, a through hole formed through the circuit board main body, a set of circuit board electrical connecting terminals disposed on the lower surface of the circuit board main body, a conducting medium disposed on the circuit board electrical connecting terminals, and a non-conducting adhesive covering the conducting medium. The photosensitive chip includes chip electrical connecting terminals disposed in a non-photosensitive area. The chip electrical connecting terminals of the photosensitive chip is in contact with the conducting medium to be electrically connected to the circuit board electrical connecting terminals, and the photosensitive chip is bonded to the lower surface of the circuit board via the non-conducting adhesive, so that the photosensitive chip is electrically connected to the circuit board. In this way, the photosensitive chip is stably electrically connected to the circuit board with relatively low costs and relatively low process difficulty.

    PERISCOPIC CAMERA MODULE AND ELECTRONIC DEVICE

    公开(公告)号:US20220357567A1

    公开(公告)日:2022-11-10

    申请号:US17761351

    申请日:2020-08-31

    IPC分类号: G02B23/08 H04N5/225

    摘要: Provided is a periscopic camera module, which includes a first reflective element mounted on a first base, an optical lens mounted on a second substrate, a second reflective element mounted on a third substrate, and a photosensitive chip mounted on a fourth substrate. Particularly, the first reflective element is used to reflect the incident light to make it longitudinally turned; the optical lens is used to receive the reflected light which is longitudinally turned and output an imageable light beam; the second reflective element is a second prism, which is adapted to laterally turn the imageable light beam at least once and has a reflecting surface located on a side surface of the second prism; and the photosensitive chip is adapted to receive the imageable light beam laterally turned by the second reflective element. Also provided is a corresponding electronic device. The length of the periscopic camera module according to the present application may be reduced to be suitable for mass production on a large scale, thereby facilitating to improve production efficiency and yield.

    Adjustable Optical Lens and Camera Module and Manufacturing Method and Applications Thereof

    公开(公告)号:US20220308310A1

    公开(公告)日:2022-09-29

    申请号:US17377343

    申请日:2021-07-15

    摘要: An adjustable optical lens and camera module, and manufacturing method and applications thereof is disclosed. The camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens includes an optical structural member and at least two lenses, wherein each of the lenses is arranged in an internal space of the optical structural member. Along a vertical direction of the optical structural member, at least one lens is adapted to be adjustably pre-mounted to an internal space of the optical structural member serving as an adjustable lens. The side wall of the optical structural member is provided with at least one adjustment channel, which is positioned corresponding to the adjustable lens, so that an assembling position of the adjustable lens can be adjusted through the adjustment channel so as to align a central axis line of the adjustable optical lens with a central axis line of the optical sensor.

    Camera module and manufacturing method thereof

    公开(公告)号:US11412117B2

    公开(公告)日:2022-08-09

    申请号:US17195816

    申请日:2021-03-09

    摘要: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.

    Optical lens head, camera module and assembling method therefor

    公开(公告)号:US11378722B2

    公开(公告)日:2022-07-05

    申请号:US16073671

    申请日:2017-01-18

    摘要: An optical lens head, an camera module, and an assembling method therefor, wherein the camera module comprises a photosensitive chip (23) and an optical lens head (10); said optical lens head (10) comprises a plurality of optical lenses (111); the assembly position of one of the optical lenses (111) is adjustable; each of the optical lenses (111) is black-lacquered and matte-treated; a connecting portion (1113), a light-beam entrance hole (1114) and a light-shielding portion (1115) are formed on the corresponding optical lenses (111), such that the individual optical lenses (111) can be successively and jointly assembled together, eliminating the need of a spacing ring, a diaphragm, a lens barrel and other structural components used in a conventional camera module, thereby improving manufacture precision, production yield and imaging quality of the camera module.