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1.发明公开公开(公告)号：US20230328350A1
公开(公告)日：2023-10-12
申请号：US18203731
申请日：2023-05-31
发明人： Zhen HUANG , Qimin MEI , Bojie ZHAO , Zhewen MEI , Li LIU , Jiawei CHEN , Chenxiang XU
CPC分类号： H04N23/55 , B29C43/18 , H04N23/54 , H04N23/57 , B29L2011/00
摘要： A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.
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公开(公告)号：US20230161082A1
公开(公告)日：2023-05-25
申请号：US18074882
申请日：2022-12-05
发明人： Mingzhu WANG , Bojie ZHAO , Chunmei LIU , Feifan CHEN , Zhenyu CHEN
CPC分类号： G02B3/00 , G02B13/004 , H04N23/55 , H04N23/54 , G02B2003/0093
摘要： A lens (10) and a camera module (100) and a manufacturing method thereof, wherein the lens (10) comprises an edge-cut lens sheet (114), wherein the edge-cut lens sheet (14) includes at least one chord edge (1141) and at least one circular edge (1142), wherein the chord edge (1141) and the circular edge (1142) are adjacently connected to each other, and wherein the chord edge (1141) and the circular edge (1142) have different curvatures, so that the lens sheet (114) becomes narrow and the width of the lens (10) become narrow, to form an ultra-narrow camera module (100).
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公开(公告)号：US20230019091A1
公开(公告)日：2023-01-19
申请号：US17847569
申请日：2022-06-23
发明人： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Zhongyu LUAN , Zhenyu CHEN , Zhen HUANG
IPC分类号： H01L27/146 , H01L23/10 , H04N5/225 , H05K1/02 , H05K1/11
摘要： A camera module and photosensitive component or unit thereof and manufacturing method therefor are provided. The photosensitive unit includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.
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公开(公告)号：US20220345602A9
公开(公告)日：2022-10-27
申请号：US16919065
申请日：2020-07-01
发明人： Mingzhu WANG , Bojie ZHAO , Takehiko Tanaka , Feifan CHEN , Qimin MEI , Liang DING , Heng JIANG
IPC分类号： H04N5/225 , H01L27/146 , H04N13/239
摘要： A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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公开(公告)号：US20220303437A1
公开(公告)日：2022-09-22
申请号：US17829721
申请日：2022-06-01
发明人： Mingzhu WANG , Zhenyu CHEN , Zhongyu LUAN , Zhen HUANG , Nan GUO , Fengsheng XI , Takehiko TANAKA , Bojie ZHAO , Heng JIANG , Ye WU , Zilong DENG
摘要： A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.
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公开(公告)号：US20220286592A1
公开(公告)日：2022-09-08
申请号：US17824415
申请日：2022-05-25
发明人： Mingzhu WANG , Zhenyu CHEN , Nan GUO , Takehiko TANAKA , Bojie ZHAO , Zilong DENG
IPC分类号： H04N5/225 , B29C45/14 , B29C33/44 , G02B19/00 , G02B7/10 , B29C70/72 , B29C70/88 , G02B13/00 , H05K1/02 , H05K1/18 , H05K3/28 , B29C43/18 , B29C43/36 , B29C43/52 , G02B7/02
摘要： A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
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公开(公告)号：US20220268968A1
公开(公告)日：2022-08-25
申请号：US17740887
申请日：2022-05-10
发明人： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Nan GUO , Zhenyu CHEN , Heng JIANG , Zhongyu LUAN , Fengsheng XI , Feifan CHEN , Liang DING
摘要： A molded photosensitive assembly includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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公开(公告)号：US20220224808A1
公开(公告)日：2022-07-14
申请号：US16497433
申请日：2018-03-22
发明人： Mingzhu WANG , Shoujie WANG , Nan GUO , Liang DING , Bojie ZHAO , Feifan CHEN , Chunmei LIU , Qimin MEI
摘要： A split lens includes a first lens group including a first set of lenses, a second lens group including a second set of lenses, and at least one light shielding element. The light shielding element is disposed between the lens at the bottom position of the first lens group and the lens at the top position of the second lens group, such that a predetermined light path is formed between the first lens group and the second lens group, thereby conforming to the structure of the split lens.
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公开(公告)号：US20220223633A1
公开(公告)日：2022-07-14
申请号：US17707051
申请日：2022-03-29
发明人： Takehiko TANAKA , Bojie ZHAO , Zhewen MEI , Nan GUO
IPC分类号： H01L27/146 , H04N5/225
摘要： Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to said third portion surface; a third angle between the third partial surface and the optical axis is greater than a fourth angle between the fourth partial surface and the optical axis.
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10.发明申请公开(公告)号：US20210289112A1
公开(公告)日：2021-09-16
申请号：US17262359
申请日：2019-06-28
发明人： Zhewen MEI , Qimin MEI , Bojie ZHAO
摘要： A molded assembly, a camera module, a jointed board of molded assembly, and a manufacturing method are provided. The molded assembly includes a circuit board and a molded portion, wherein the circuit board has a molding region, a mounting region and at least two pad regions, the molding region surrounds the mounting region, the pad regions are arranged at corners of the circuit board and located outside corresponding corners of the molding region so as to electrically connect to an actuator, and the pad region has an avoidance boundary, and an angle formed by the avoidance boundary is greater than 90 degrees; wherein the molded portion embeds the molding region, surrounds the mounting region, and has a light window, and the molded portion avoids the pad regions along the avoidance boundary so as to reduce defective rate during production.
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