公开(公告)号：USD893490S1

公开(公告)日：2020-08-18

申请号：US29648093

申请日：2018-05-18

Applicant: Apple Inc.

Designer： Jody Akana ,  Molly Anderson ,  Bartley K. Andre ,  Shota Aoyagi ,  Anthony Michael Ashcroft ,  Marine C. Bataille ,  Jeremy Bataillou ,  Daniele De Iuliis ,  Markus Diebel ,  Ashley E. Fletcher ,  Douglas G. Fournier ,  M. Evans Hankey ,  Julian Hoenig ,  Richard P. Howarth ,  Jonathan P. Ive ,  Julian Jaede ,  Daniel W. Jarvis ,  Duncan Robert Kerr ,  Robert F. Meyer ,  David A. Pakula ,  Peter Russell-Clarke ,  Benjamin Andrew Shaffer ,  Mikael Silvanto ,  Christopher J. Stringer ,  Joe Sung Ho Tan ,  Tang Yew Tan ,  Clement Tissandier ,  Eugene Antony Whang ,  Rico Zörkendörfer

公开(公告)号：US10455738B2

公开(公告)日：2019-10-22

申请号：US15712071

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： David A. Pakula ,  Daniel W. Jarvis ,  Gregory N. Stephens ,  Ian A. Spraggs ,  Vu Thanh Vo ,  Amir Salehi ,  Dennis R. Pyper ,  Alex J. Crumlin ,  Corey S. Provencher ,  Derek J. Walters ,  Michael V. Yeh

IPC: H05K5/02 ,  H04B1/03 ,  H05K7/20 ,  G06F3/041 ,  H01M2/10 ,  H05K1/02 ,  H05K1/14 ,  G06F1/16 ,  H05K9/00 ,  H01M2/08 ,  H02J7/00 ,  G06F3/044

Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.

公开(公告)号：USD849010S1

公开(公告)日：2019-05-21

申请号：US29655032

申请日：2018-06-29

Applicant: Apple Inc.

Designer： Jody Akana ,  Molly Anderson ,  Bartley K. Andre ,  Shota Aoyagi ,  Anthony Michael Ashcroft ,  Marine C. Bataille ,  Jeremy Bataillou ,  Daniele De Iuliis ,  Markus Diebel ,  M. Evans Hankey ,  Julian Hoenig ,  Lee E. Hooton ,  Richard P. Howarth ,  Jonathan P. Ive ,  Julian Jaede ,  Daniel W. Jarvis ,  Duncan Robert Kerr ,  Robert F. Meyer ,  David A. Pakula ,  Michael D. Quinones ,  Marwan Rammah ,  Peter Russell-Clarke ,  Benjamin Andrew Shaffer ,  Mikael Silvanto ,  Ian Spraggs ,  Christopher J. Stringer ,  Joe Sung Ho Tan ,  Tang Yew Tan ,  Clement Tissandier ,  Eugene Antony Whang ,  Rico Zörkendörfer

公开(公告)号：USD843934S1

公开(公告)日：2019-03-26

申请号：US29612830

申请日：2017-08-04

Applicant: Apple Inc.

Designer： Tang Yew Tan ,  David A. Pakula ,  Daniel W. Jarvis ,  Gregory Nicolaus Stephens

公开(公告)号：US10244659B2

公开(公告)日：2019-03-26

申请号：US15712069

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： Daniel W. Jarvis ,  David A. Pakula ,  David J. Dunsmoor ,  Ian A. Spraggs ,  Lee E. Hooton ,  Marwan Rammah ,  Matthew D. Hill ,  Robert F. Meyer ,  James A. Bertin ,  Eric M. Bennett ,  Simon C. Helmore ,  Melissa A. Wah ,  Jon F. Housour ,  Douglas G. Fournier ,  Christopher S. Tomasetta

IPC: H05K7/20 ,  H05K1/02 ,  G06F3/041 ,  H01M2/10 ,  H05K1/14 ,  G06F1/16 ,  H01M2/08 ,  H02J7/00 ,  G06F3/044

Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.

公开(公告)号：US10219057B2

公开(公告)日：2019-02-26

申请号：US15699064

申请日：2017-09-08

Applicant: Apple Inc.

Inventor： Thomas R. Luce ,  Anthony P. Grazian ,  Hongdan Tao ,  Christopher Wilk ,  Daniel W. Jarvis ,  David A. Pakula

IPC: H04R1/02 ,  H04R1/28 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06

Abstract: An electronic device is disclosed that includes one or more sealed audio modules that are unaffected by changes in the internal pressure within the electronic device. The audio modules can also include one or more features that increase the audible bandwidth of the electronic device.

公开(公告)号：USD832266S1

公开(公告)日：2018-10-30

申请号：US29612831

申请日：2017-08-04

Applicant: Apple Inc.

Designer： Jody Akana ,  Molly Anderson ,  Bartley K. Andre ,  Shota Aoyagi ,  Anthony Michael Ashcroft ,  Marine C. Bataille ,  Jeremy Bataillou ,  Daniele De Iuliis ,  Markus Diebel ,  Douglas G. Fournier ,  M. Evans Hankey ,  Julian Hoenig ,  Richard P. Howarth ,  Jonathan P. Ive ,  Julian Jaede ,  Daniel W. Jarvis ,  Duncan Robert Kerr ,  Robert F. Meyer ,  David A. Pakula ,  Peter Russell-Clarke ,  Benjamin Andrew Shaffer ,  Mikael Silvanto ,  Ian Spraggs ,  Christopher J. Stringer ,  Joe Sung Ho Tan ,  Tang Yew Tan ,  Clement Tissandier ,  Eugene Antony Whang ,  Rico Zörkendörfer

公开(公告)号：US09750152B2

公开(公告)日：2017-08-29

申请号：US14456943

申请日：2014-08-11

Applicant: Apple Inc.

Inventor： Daniel W. Jarvis ,  Benjamin J. Pope ,  Jason S. Sloey ,  Jonathan C. Denby ,  Ian A. Spraggs ,  Shayan Malek

IPC: H04M1/02 ,  H05K7/14 ,  H01R43/20 ,  H05K7/02 ,  H05K7/06 ,  H01H23/04 ,  H01H23/14

CPC classification number: H05K7/14 ,  H01H23/04 ,  H01H23/148 ,  H01R43/205 ,  H04M1/026 ,  H04M1/0274 ,  H04M1/0277 ,  H05K7/026 ,  H05K7/06

Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment a number of insert molded retaining members are utilized to prevent outward deformation of sidewalls of the portable computing device during a drop event. In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.

公开(公告)号：US09583821B2

公开(公告)日：2017-02-28

申请号：US14253779

申请日：2014-04-15

Applicant: Apple Inc.

Inventor： Matthew D. Hill ,  Scott A. Myers ,  Jared M. Kole ,  Liane J. Fang ,  Benjamin J. Pope ,  Daniel W. Jarvis

IPC: H01Q1/38 ,  H01Q1/24 ,  H01Q9/14 ,  H01Q1/22

CPC classification number: H01Q1/38 ,  H01Q1/2258 ,  H01Q1/2291 ,  H01Q1/243 ,  H01Q9/14

Abstract: Antenna related features of a mobile phone or computing device are disclosed. In one embodiment, wireless control and signal are fed separately through difference types of flexes to optimize performance and cost. In one embodiment, active switching and processing of differing conductive trace lengths are performed on an antenna flex so that antenna performance can be optimized for multiple wireless technologies covering a wide range of wavelengths. In one embodiment, a cantilever arm affixed to a ground screw can provide double grounding in a region with no available screw points due to high z constraint. In one embodiment, a device can provide double feed for antenna through a single screw. In one embodiment, a short pin can be configured to support thinner metal. In one embodiment, a “vibrator bracket/LDS short pin” structure can be used to share a common screw point.

Abstract translation: 公开了一种移动电话或计算设备的天线相关特征。 在一个实施例中，无线控制和信号通过不同类型的挠曲单独馈送以优化性能和成本。 在一个实施例中，在天线弯曲上执行不同导电迹线长度的有源切换和处理，使得能够针对覆盖宽范围波长的多种无线技术优化天线性能。 在一个实施例中，固定在接地螺钉上的悬臂可以由于高z约束而在没有可用螺钉点的区域中提供双重接地。 在一个实施例中，设备可以通过单个螺钉提供用于天线的双馈。 在一个实施例中，短销可以被配置为支撑更薄的金属。 在一个实施例中，可以使用“振动器支架/ LDS短针”结构来共享共同的螺钉点。

公开(公告)号：US20160363154A1

公开(公告)日：2016-12-15

申请号：US15246476

申请日：2016-08-24

Applicant: Apple Inc.

Inventor： Stefan C. Mag ,  Miguel C. Christophy ,  Daniel W. Jarvis

IPC: F16B37/04 ,  B23C3/30

CPC classification number: F16B37/048 ,  B23C3/10 ,  B23C3/30 ,  B23C2220/04 ,  F16B37/122 ,  Y10T29/49883

Abstract: The described embodiments relate to embedding a threaded insert into a thin-walled housing. A recess can be formed with a machining tool that forms a recess in a thickened portion of the thin-walled housing. In some embodiments, the recess can be formed along one of the walls of the thin-walled housing in a location having highly a constrained amount of space available. Once the recess is formed a threaded insert can be pressed into the recess. An interference fit can be utilized to lodge the press-nut securely within the recess. Alternatively, a retaining member can be positioned across a front portion of the recess to trap the threaded insert between the retaining member and a rear surface of the recess.

Abstract translation: 所描述的实施例涉及将螺纹插入件嵌入到薄壁壳体中。 凹槽可以用在该薄壁壳体的加厚部分形成凹部的加工工具形成。 在一些实施例中，凹部可以沿着薄壁壳体的一个壁形成在具有高度限制的可用空间的位置。 一旦形成凹槽，就可以将螺纹插入件压入凹槽中。 可以利用过盈配合将紧固螺母牢固地放置在凹槽内。 或者，可以将保持构件定位成跨越凹部的前部，以将螺纹插入物捕获在保持构件和凹部的后表面之间。