公开(公告)号：US06516816B1

公开(公告)日：2003-02-11

申请号：US09544660

申请日：2000-04-06

申请人： Anwar Husain ,  Brian J. Brown ,  David G. Andeen ,  Svetlana Sherman ,  John M. White ,  Michael Sugarman ,  Makoto Inagawa ,  Manoocher Birang

发明人： Anwar Husain ,  Brian J. Brown ,  David G. Andeen ,  Svetlana Sherman ,  John M. White ,  Michael Sugarman ,  Makoto Inagawa ,  Manoocher Birang

IPC分类号： B08B302

CPC分类号： H01L21/67028 ,  Y10S134/902

摘要： An inventive vertical spin-dryer is provided. The inventive spin-dryer may have a shield system positioned to receive fluid displaced from a substrate vertically positioned within the spin-dryer. The shield system may have one or more shields positioned to at least partially reflect fluid therefrom as the fluid impacts the shield. The one or more shields are angled to encourage the flow of fluid therealong, and are preferably hydrophilic to prevent droplets from forming. Preferably the shield system has three shields positioned in a horizontally and vertically staggered manner so that fluid is transferred from a substrate facing surface of a first shield to the top or non-substrate-facing surface of an adjacent shield, etc. A pressure gradient may be applied across the interior of the spin-dryer to create an air flow which encourages fluid to travel along the shield system in a desired direction. A sensor adapted to facilitate desired flywheel position, an openable gripper having a remote actuator, a radiused gripper and a source of inert drying gas are also provided in individual embodiments.

公开(公告)号：US06511367B2

公开(公告)日：2003-01-28

申请号：US10059519

申请日：2002-01-28

申请人： Steven M. Zuniga ,  Hung Chih Chen ,  Manoocher Birang ,  Kapila Wijekoon ,  Sen-Hou Ko

发明人： Steven M. Zuniga ,  Hung Chih Chen ,  Manoocher Birang ,  Kapila Wijekoon ,  Sen-Hou Ko

IPC分类号： B24B500

CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16

摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.

公开(公告)号：US06474712B1

公开(公告)日：2002-11-05

申请号：US09559889

申请日：2000-04-26

申请人： Boris I. Govzman ,  Manoocher Birang ,  Michael Sugarman ,  Anwar Husain

发明人： Boris I. Govzman ,  Manoocher Birang ,  Michael Sugarman ,  Anwar Husain

IPC分类号： B66C100

CPC分类号： H01L21/68707 ,  Y10S414/141

摘要： A gripper assembly is provided which supports a substrate in a vertical orientation. The gripper assembly's end effectors contact only the edge of the substrate. In a first aspect the end effectors each comprise a first pair of opposed surfaces and an second pair of opposed surfaces, all of which simultaneously contact the substrate, holding the substrate in a clamp-type manner. In a second aspect the end effectors each comprise a lower pair of opposed surfaces which simultaneously contact the substrate, and an upper pair of opposed surfaces, larger than the thickness of the substrate, which limit the substrate from horizontal tilting. In the second aspect the end effectors can close at a first elevation where they do not contact the substrate, and can then elevate to gently contact and support the substrate in a pocket-like manner. In a third aspect one of the end effectors has two pairs of opposed surfaces which simultaneously contact the substrate, and the other end effector has two pairs of opposed surfaces which limit the substrate from horizontal tilting. In any aspect no moving parts are required to limit the substrate's vertical and horizontal movement. In a further aspect, fingers to which the end effectors are coupled, are bent so that the gripper is not positioned above the substrate.

摘要翻译： 提供了一种夹持器组件，其以垂直取向支撑衬底。 夹持器组件的端部执行器仅接触基板的边缘。 在第一方面，端部执行器各自包括第一对相对表面和第二对相对表面，所述第二对相对表面同时接触基板，以夹紧方式保持基板。 在第二方面，端部执行器各自包括同时接触基板的下一对相对表面，以及大于基板厚度的上对对相对表面，其将基板限制为水平倾斜。 在第二方面，末端效应器可以在它们不接触衬底的第一高度处关闭，然后可以以袋状方式轻轻地接触和支撑衬底。 在第三方面中，一个端部执行器具有两对同时接触基板的相对表面，而另一端部执行器具有两对相对的表面，这些对面限制了基板的水平倾斜。 在任何方面，无需移动部件来限制基板的垂直和水平运动。 在另一方面，端部执行器耦合到的手指被弯曲，使得夹持器不位于衬底上方。

公开(公告)号：US06383058B1

公开(公告)日：2002-05-07

申请号：US09493859

申请日：2000-01-28

申请人： Manoocher Birang ,  Boguslaw Swedek

发明人： Manoocher Birang ,  Boguslaw Swedek

IPC分类号： B24B722

CPC分类号： B24B37/205 ,  B24B37/013 ,  G05B19/4163

摘要： An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad. A light beam is directed by an optical endpoint detection system to impinge the surface of the substrate. A signal from the optical endpoint detection system is monitored, and if a first endpoint criterion is not detected within a first time window, polishing is stopped at a default polishing time. If the first endpoint criterion is detected within the first time window, the signal is monitored for the second endpoint criterion, and polishing stops if the second endpoint criterion is detected.

摘要翻译： 一种装置以及一种方法使基板的表面与抛光垫接触。 光束由光学终点检测系统引导以撞击衬底的表面。 监测来自光学终点检测系统的信号，并且如果在第一时间窗口内未检测到第一端点标准，则在默认抛光时间停止抛光。 如果在第一时间窗口内检测到第一终点标准，则监视第二终点标准的信号，如果检测到第二终点标准，则抛光停止。

公开(公告)号：US6146259A

公开(公告)日：2000-11-14

申请号：US907810

申请日：1997-08-08

申请人： Steven M. Zuniga ,  Hung Chih Chen ,  Manoocher Birang ,  Kapila Wijekoon ,  Sen-Hou Ko

发明人： Steven M. Zuniga ,  Hung Chih Chen ,  Manoocher Birang ,  Kapila Wijekoon ,  Sen-Hou Ko

IPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16 ,  H01L21/304 ,  B24B47/02

CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16

摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the purpose.

摘要翻译： 用于化学机械抛光装置的载体头包括柔性膜，其下表面提供基板接收表面。 承载头可以包括与柔性膜的上表面接触的突起，以将增加的负载施加到基底的潜在的被抛光的区域。 流体射流可用于此目的。

公开(公告)号：US5646814A

公开(公告)日：1997-07-08

申请号：US276010

申请日：1994-07-15

申请人： Shamouil Shamouilian ,  Samuel Broydo ,  Manoocher Birang

发明人： Shamouil Shamouilian ,  Samuel Broydo ,  Manoocher Birang

IPC分类号： B23Q3/15 ,  H01L21/683 ,  H02N13/00

CPC分类号： H01L21/6875 ,  H01L21/6831 ,  H01L21/6833

摘要： A multi-electrode electrostatic chuck (20) for holding a substrate (42) such as a silicon wafer during processing is described. The electrostatic chuck (20) comprises (i) a first electrode (22), (ii) a second electrode (24), and (iii) an insulator (26) having a lower portion (26a), a middle portion (26b) and an upper portion (26c). The lower portion (26a) of the insulator (26) is below the first electrode (22) and has a bottom surface (28) suitable for resting the chuck (20) on a support (44) in a process chamber (41). The middle portion (26b) of the insulator (26) lies between the first and second electrodes (22), (24). The upper portion (26c) of the insulator (26) is on the second electrode (24), and has a top surface (30) suitable for holding a substrate (42). The first and second electrodes (22, 24) can have a unipolar or bipolar configurations. In operation, the chuck (20) is placed on a support (44) in a process chamber (41) so that the bottom surface (28) of the chuck (20) rests on the support (44). A substrate (42) is placed on the top surface (30) of the chuck (20). When the first electrode (22) of the chuck (20) is electrically biased with respect to the support (44), a first electrostatic force holds the chuck (20) onto the support (44). When the second electrode (24) of the chuck (20) is electrically biased with respect to the substrate (42) placed on the chuck (20), a second electrostatic force holds the substrate (42) to the chuck (20).

摘要翻译： 描述了用于在处理期间保持硅晶片等基板（42）的多电极静电卡盘（20）。 静电卡盘（20）包括（i）第一电极（22），（ii）第二电极（24）和（iii）具有下部分（26a）的绝缘体（26），中间部分（26b） 和上部（26c）。 绝缘体（26）的下部（26a）位于第一电极（22）的下面，并且具有适于将卡盘（20）放置在处理室（41）中的支撑件（44）上的底表面（28）。 绝缘体（26）的中间部分（26b）位于第一和第二电极（22），（24）之间。 绝缘体（26）的上部（26c）在第二电极（24）上，并且具有适于保持基板（42）的顶表面（30）。 第一和第二电极（22,24）可以具有单极或双极结构。 在操作中，卡盘（20）被放置在处理室（41）中的支撑件（44）上，使得卡盘（20）的底表面（28）搁置在支撑件（44）上。 基板（42）被放置在卡盘（20）的顶表面（30）上。 当卡盘（20）的第一电极（22）相对于支撑件（44）被电偏置时，第一静电力将卡盘（20）保持在支撑件（44）上。 当卡盘（20）的第二电极（24）相对于放置在卡盘（20）上的基板（42）电气偏置时，第二静电力将基板（42）保持在卡盘（20）上。

公开(公告)号：US5151584A

公开(公告)日：1992-09-29

申请号：US777770

申请日：1991-10-15

申请人： Peter Ebbing ,  Manoocher Birang

发明人： Peter Ebbing ,  Manoocher Birang

IPC分类号： B24B37/013 ,  B24D7/12 ,  G01B11/06 ,  G03F7/20 ,  H01L21/00 ,  H01L21/66

CPC分类号： B24B37/013 ,  B24D7/12 ,  G01B11/0683 ,  G03F7/70358 ,  H01L21/67253 ,  H01L22/26

摘要： A method for endpoint detection in a semiconductor wafer etching system characterized by the steps of: 1) scanning a semiconductor wafer with a narrowly focused laser beam; 2) analyzing a reflected portion of the beam to determine a preferred parking spot on a preferred flat area of the wafer; 3) parking the beam at the preferred spot; and 4) analyzing the reflected portion of the beam to determine when the preferred flat area has been etched through. The beam spot of the laser beam is smaller than the width of the preferred flat area to eliminate noise generated at the transition boundaries of the flat area. Preferably, the wafer is scanned several times along the same beam path to permit the comparison of several scans to determine the preferred parking spot. The apparatus includes a beam forming assembly; a scanning assembly which causes the laser beam to scan across the wafer; a detection assembly responsive to a portion of the laser beam which is reflected off of the wafer; and a controller which operates the laser and the scanning assembly and which is responsive to an output of the detection assembly. When output of the detection assembly indicates a cessation of the characteristic etching curve, the controller develops an endpoint detection signal which can automatically shut down the etching system.

摘要翻译： 一种用于半导体晶片蚀刻系统中端点检测的方法，其特征在于以下步骤：1）用窄聚焦的激光束扫描半导体晶片; 2）分析光束的反射部分以确定晶片的优选平坦区域上的优选停车点; 3）将梁停在优先位置; 以及4）分析光束的反射部分以确定何时优选的平坦区域被蚀刻通过。 激光束的光点小于优选平坦区域的宽度，以消除在平坦区域的过渡边界处产生的噪声。 优选地，晶片沿着相同的光束路径扫描多次，以允许比较几次扫描以确定优选的停车位。 该装置包括一个波束形成组件; 扫描组件，其使激光束跨过晶片扫描; 检测组件，其响应于从所述晶片反射的所述激光束的一部分; 以及控制器，其操作激光器和扫描组件，并且响应于检测组件的输出。 当检测组件的输出指示特征蚀刻曲线的停止时，控制器产生可以自动关闭蚀刻系统的端点检测信号。

公开(公告)号：US5097430A

公开(公告)日：1992-03-17

申请号：US464836

申请日：1990-01-16

申请人： Manoocher Birang

发明人： Manoocher Birang

IPC分类号： G06F17/00 ,  H01J37/32

CPC分类号： H01J37/3266 ,  H01J37/32935 ,  H01J37/32972

摘要： A method facilitates the display of a filtered signal which represents the variation of light intensity in a processing chamber over time. The filtered signal filters out the effects of a magnetic field which causes plasma within the processing chamber to rotate. The magnetic field is generated by a signal with a period T. Light intensity within the process chamber is detected to produce a voltage signal with a voltage amplitude which varies based on the light intensity within the process chamber. The voltage amplitude of the voltage signal is digitally sampled at a sampling interval to obtain sample values. Running averages of a preselected number of sample values are calculated. The period T is set equal to the preselected number of sample values times the sampling interval times an integer. For each newly displayed running average, a rectangular box may be superimposed over a graph of the running averages in order to graphically display changes in slope. The computer is programmed to look for an anticipated sequence of slopes.

摘要翻译： 一种方法有助于显示表示处理室中光强随时间变化的滤波信号。 经滤波的信号滤除导致处理室内的等离子体旋转的磁场的影响。 磁场由具有周期T的信号产生。处理室内的光强度被检测以产生电压幅度，其电压幅度基于处理室内的光强度而变化。 以采样间隔对电压信号的电压振幅进行数字采样，以获得采样值。 计算预选数量样本值的运行平均值。 周期T被设置为等于采样间隔的预选数量乘以整数。 对于每个新显示的跑步平均值，矩形框可以叠加在跑步平均线的图表上，以图形地显示斜率的变化。 计算机被编程以寻找预期的斜坡序列。

公开(公告)号：US4953982A

公开(公告)日：1990-09-04

申请号：US221979

申请日：1988-07-20

申请人： Peter Ebbing ,  Manoocher Birang

发明人： Peter Ebbing ,  Manoocher Birang

IPC分类号： G01B9/02 ,  B24B37/013 ,  B24D7/12 ,  G01B11/02 ,  G01B11/06 ,  G01M11/02 ,  G02B7/32 ,  G03F7/20 ,  G03F7/207 ,  H01L21/00 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/66

CPC分类号： B24B37/013 ,  B24D7/12 ,  G01B11/026 ,  G01B11/0683 ,  G02B7/32 ,  G03F7/70358 ,  H01L21/67069 ,  H01L21/67242 ,  H01L21/67253 ,  H01L22/26

摘要： A method for endpoint detection in a semiconductor wafer etching system characterized by the steps of: (1) scanning a semiconductor wafer with a narrowly focussed laser beam; (2) analyzing a reflected portion of the beam to determine a preferred parking spot on a preferred flat area of the wafer; (3) parking the beam at the preferred spot; and (4) analyzing the reflected portion of the beam to determine when the preferred flat area has been etched through. The beam spot of the laser beam is smaller than the width of the preferred flat area to eliminate noise generated at the transition boundaries of the flat area. Preferably, the wafer is scanned several times along the same beam path to permit the comparison of several scans to determine the preferred parking spot. The apparatus includes a beam forming assembly; a scanning assembly which causes the laser beam to scan across the wafer; a detection assembly reponsive to a portion of the laser beam which is reflected off of the wafer; and a controller which operates the laser and the scanning assembly and which is responsive to an output of the detection assembly. When output of the detection assembly indicates a cessation of the characteristic etching curve, the controller develops an endpoint detection signal which can automatically shut down the etching system.

公开(公告)号：US20120107971A1

公开(公告)日：2012-05-03

申请号：US13345487

申请日：2012-01-06

申请人： Manoocher Birang ,  Grigory Pyatigorsky

发明人： Manoocher Birang ,  Grigory Pyatigorsky

IPC分类号： H01L21/66

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B47/12 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  G01B11/06 ,  G01B11/0683

摘要： A polishing pad assembly for a chemical mechanical polishing apparatus includes a polishing pad having a polishing surface and a surface opposite the polishing surface for attachment to a platen, and a solid light-transmissive window formed in the polishing pad. The light-transmissive window is more transmissive to light than the polishing pad. The light-transmissive window has a light-diffusing bottom surface.

摘要翻译： 用于化学机械抛光装置的抛光垫组件包括抛光垫，抛光垫具有抛光表面和与抛光表面相对的表面，用于附接到压板，以及形成在抛光垫中的固体透光窗。 光透射窗比抛光垫更透光。 透光窗具有光扩散底面。