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81.
公开(公告)号:US11071858B2
公开(公告)日:2021-07-27
申请号:US16827171
申请日:2020-03-23
Applicant: Greatbatch Ltd.
Inventor: Robert A. Stevenson , Christine A. Frysz , Thomas Marzano , Keith W. Seitz , Marc Gregory Martino
IPC: A61N1/08 , H01G4/005 , H01G4/30 , H01G4/35 , A61N1/375 , H01G4/236 , H01G4/12 , H03H1/00 , A61N1/37
Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing a ferrule opening of an electrically conductive ferrule with a gold braze. A co-fired and electrically conductive sintered paste is disposed within and hermetically seals at least one via hole extending in the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects a capacitor active metallization and the sintered paste. A ground electrical connection electrically connects the gold braze to a capacitor ground metallization, wherein at least a portion of the ground electrical connection physically contacts the gold braze. The dielectric of the capacitor may be less than 1000 k. The ferrule may include an integrally formed peninsula portion extending into the ferrule opening spatially aligned with a ground passageway and metallization of an internally grounded feedthrough capacitor. The sintered paste may be of substantially pure platinum.
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公开(公告)号:US10828498B2
公开(公告)日:2020-11-10
申请号:US16854138
申请日:2020-04-21
Applicant: Greatbatch Ltd.
Inventor: Robert A. Stevenson , Keith W. Seitz , Jason Woods , Christine A. Frysz
Abstract: An enhanced RF switchable filtered feedthrough for real-time identification of the electrical and physical integrity of an implanted AIMD lead includes a DOUBLE POLE RF switch disposed on the device side. Additionally, the RF switchable filtered feedthrough can optionally include transient voltage suppressors (TVS) and an MRI mode. In an embodiment, a DOUBLE POLE RF switch selectively disconnects EMI filter capacitors so that an RF test/interrogation signal is sent from the AIMD down into an implanted lead(s). The reflected RF signal is then analyzed to assess implanted lead integrity including lead body anomalies, lead insulation defects, and/or lead conductor defects. The Double Pole switch is configured to be controlled by an AIMD control signal to switch between FIRST and SECOND THROW positions. In the FIRST THROW position a conductive leadwire hermetically sealed to and disposed through an insulator is electrically connected to a filter capacitor, which is then electrically connected to the ferrule of a hermetic feedthrough of an AIMD. In the FIRST THROW position, EMI energy imparted to a body fluid side implanted lead can be diverted to the housing of the AIMD. In the SECOND THROW position the conductive leadwire is electrically connected to an RF source disposed on the device side of the housing of the AIMD. While in the SECOND THROW position, a reflective return signal from the RF source is measured and analyzed to determine if the implanted AIMD lead exhibits any life-threatening performance issues, such as lead body anomalies, lead insulation defects or changes, or even defective, fractured or dislodged lead conductors. In another embodiment, a SINGLE POLE RF switch is configured to disconnect filter capacitors during the delivery of a high-voltage cardioversion shock from an implantable cardioverter defibrillator. Dis-connection of the filter capacitor either reduces or eliminates filter capacitor pulse inrush currents, which allows for the use of standard low-voltage filter capacitors instead of larger and more expensive high-voltage pulse rated filter capacitors. Dis-connection of the filter capacitor also allows for an RF interrogation pulse to be applied to the implanted lead in real-time (for example, pre-set intervals throughout the day).
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公开(公告)号:US10722706B2
公开(公告)日:2020-07-28
申请号:US16106937
申请日:2018-08-21
Applicant: Greatbatch Ltd.
Inventor: Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel
IPC: A61N1/08 , H05K9/00 , A61N1/37 , A61N1/375 , H05K5/00 , H05K1/18 , H03H7/01 , H03H1/00 , H01R13/7195 , H01G4/40 , H01G4/35 , H01G4/06
Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.
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公开(公告)号:US20200030613A1
公开(公告)日:2020-01-30
申请号:US16578476
申请日:2019-09-23
Applicant: Greatbatch Ltd.
Inventor: Robert A. Stevenson , Thomas Marzano , Keith W. Seitz , Christine A. Frysz , Dallas J. Rensel , Brian P. Hohl
IPC: A61N1/375 , A61N1/05 , B23K35/30 , A61N1/08 , H01R43/00 , H01G4/35 , C22C29/12 , H01G4/12 , H01G2/10 , H01G4/005 , H02G3/22 , H01G4/30 , C04B37/02 , C04B35/645 , B32B18/00
Abstract: A method for manufacturing a singulated feedthrough insulator for a hermetic seal of an active implantable medical device (AIMD) is described. The method begins with forming a green-state ceramic bar with a via hole filled with a conductive paste. The green-state ceramic bar is dried to convert the paste to an electrically conductive material filling via hole and then subjected to a pressing step. Following pressing, a green-state insulator is singulated from the green-state ceramic bar. The singulated green-state insulator in next sintered to form an insulator that is sized and shaped for hermetically sealing to close a ferrule opening. The thusly produced feedthrough is suitable installation in an opening in the housing of an active implantable medical device.
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85.
公开(公告)号:US10449375B2
公开(公告)日:2019-10-22
申请号:US15844683
申请日:2017-12-18
Applicant: Greatbatch Ltd.
Inventor: Dominick J. Frustaci , Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel , Jason Woods
IPC: A61N1/375 , H01G4/35 , H01R13/7195 , H01G2/22 , H01G2/10 , A61N1/08 , H01G4/40 , A61N1/05 , H05K1/02
Abstract: A hermetically sealed feedthrough subassembly attachable to an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first conductive leadwire first end disposed past a device side of an insulator body. A feedthrough filter capacitor is disposed on the device side. A second conductive leadwire is disposed on the device side having a second conductive leadwire first end at least partially disposed within a first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed past the feedthrough filter capacitor configured to be connectable to AIMD internal electronics. The second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end. A first electrically conductive material forms a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and a capacitor internal metallization.
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86.
公开(公告)号:US20190240482A1
公开(公告)日:2019-08-08
申请号:US16385338
申请日:2019-04-16
Applicant: Greatbatch Ltd.
Inventor: Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel
IPC: A61N1/08 , H05K1/18 , H05K9/00 , H03H1/00 , H01R13/7195 , H01G4/40 , A61N1/37 , A61N1/375 , H01G4/35 , H01G4/06 , H05K5/00 , H03H7/01
CPC classification number: A61N1/08 , A61N1/086 , A61N1/3718 , A61N1/375 , A61N1/3754 , H01G4/06 , H01G4/35 , H01G4/40 , H01R13/7195 , H03H1/0007 , H03H7/1766 , H03H2001/0042 , H03H2001/0085 , H05K1/181 , H05K5/0095 , H05K9/00 , H05K999/99 , H05K2201/10015
Abstract: A three-terminal flat-through EMI/energy dissipating filter comprises an active electrode plate through which a circuit current passes between a first terminal and a second terminal, a first shield plate on a first side of the active electrode plate, and second shield plate on a second side of the active electrode plate opposite the first shield plate. The first and second shield plates are conductively coupled to a grounded third terminal. Both the effective capacitance area or overlapping surface area of the active electrode plate and the surrounding ground shield plates and the dielectric constant of the insulating layers between the active electrode plate and the ground shield plates is raised to achieve a higher capacitance value for the three-terminal flat-through capacitor.
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公开(公告)号:US10272252B2
公开(公告)日:2019-04-30
申请号:US15603521
申请日:2017-05-24
Applicant: Greatbatch Ltd.
Inventor: Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel , Marc Gregory Martino
Abstract: An insulative feedthrough attachable to an active implantable medical device includes a feedthrough body having a material which is both electrically insulative, biocompatible and separates a body fluid side from a device side. A passageway is disposed through the feedthrough body. A composite conductor is disposed within the passageway and has a body fluid side metallic wire electrically conductive to a device side metallic wire. The body fluid side metallic wire extends from a first end disposed inside the passageway to a second end on the body fluid side. The device side metallic wire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side metallic wire is hermetically sealed to the feedthrough body. The body fluid side metallic wire is biocompatible and is not the same material as the device side metallic wire.
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88.
公开(公告)号:US20170333703A1
公开(公告)日:2017-11-23
申请号:US15651045
申请日:2017-07-17
Applicant: Greatbatch Ltd.
Inventor: Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel
IPC: A61N1/08 , H05K5/00 , H03H1/00 , H01G4/35 , H01G4/40 , A61N1/37 , H01R13/7195 , H05K9/00 , A61N1/375 , H03H7/01
CPC classification number: A61N1/08 , A61N1/086 , A61N1/3718 , A61N1/375 , A61N1/3754 , H01G4/06 , H01G4/35 , H01G4/40 , H01R13/7195 , H03H1/0007 , H03H7/1766 , H03H2001/0042 , H03H2001/0085 , H05K1/181 , H05K5/0095 , H05K9/00 , H05K2201/10015
Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the capacitor. A ground path electrically extends between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises a conductive pin electrically and mechanically connected to the ferrule by a third gold braze. The ground path comprises an internal ground plate disposed within the circuit board substrate, and the internal ground plate is electrically connected to both the conductive pin and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.
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公开(公告)号:USRE46494E1
公开(公告)日:2017-08-01
申请号:US14447747
申请日:2014-07-31
Applicant: Greatbatch Ltd.
Inventor: Ryan T. Bauer , Warren S. Dabney , Robert A. Stevenson
CPC classification number: A61N1/05 , A61N1/0551 , A61N1/056 , A61N1/057 , A61N1/086 , A61N1/3718 , G01R33/285 , G01R33/288 , H01F17/00 , H01F27/36 , H01F2017/065 , H01G4/35 , H01G4/40 , H03H2001/0042 , H03H2007/013
Abstract: A load-carrying body for reducing torsional and tensile loading on electrical components in an implantable medical electrical lead includes an electronic component disposed in-line with the implantable medical electrical lead, and a casing for the electronic component. The electronic component has a proximal end conductively coupled to a lead conductor and a distal end conductively coupled to a lead electrode. The casing is mechanically coupled to the lead so as to isolate the electrical component from torque or tensile loads applied to the lead, the lead electrode, or both.
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公开(公告)号:US09687662B2
公开(公告)日:2017-06-27
申请号:US14797123
申请日:2015-07-11
Applicant: Greatbatch Ltd.
Inventor: Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
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