公开(公告)号：US07148709B2

公开(公告)日：2006-12-12

申请号：US10850921

申请日：2004-05-21

Applicant: January Kister

Inventor： January Kister

IPC: G01R31/32

CPC classification number: G01R1/07357 ,  G01R1/06733

Abstract: A rigid column and a suspension knee are combined in a probe held in assembly via its column. The suspension knee has a base arm laterally connecting at and propagating away from the column. The base arm extends up to a lateral knee extension where a reverse arm continues from the base arm back in direction towards a central axis of the column. The reverse arm terminates in a contact tip in a tip offset to the column axis that is smaller than the lateral knee extension. During application of a contacting force onto the contact tip, a first deflection of the base arm and a second deflection of the reverse arm counter act in conjunction with base and reverse arms' structural configurations. As a result, scrub motion may be well defined in direction and magnitude without need for additional guidance of the deflecting probe structure.

Abstract translation: 刚性柱和悬架膝盖组合在通过其柱固定在组件中的探针中。 悬架膝盖具有横向连接在柱上并从柱传播的基臂。 基部臂延伸到侧向膝部延伸部，其中反向臂从基部臂向后朝向柱的中心轴线延伸。 反向臂终止于尖端偏移到小于侧膝延伸部的列轴线的尖端中。 在将接触力施加到接触尖端上时，基部臂的第一偏转和反向臂反转器的第二偏转与底部和反向臂的结构结构相结合。 结果，擦洗运动可以在方向和幅度上很好地限定，而不需要额外的偏转探针结构的引导。

公开(公告)号：US07064564B2

公开(公告)日：2006-06-20

申请号：US09775676

申请日：2001-02-01

Applicant: January Kister ,  Krzysztof Dabrowiecki

Inventor： January Kister ,  Krzysztof Dabrowiecki

IPC: G01R27/08

CPC classification number: G01R1/06794 ,  G01R1/07307 ,  G01R31/2886

Abstract: A probe apparatus having probe groups comprising two or three probes that independently contact single terminals of tested chips. As a result, the probe apparatus is capable of recognizing voltage drops of a test signal applied prior to the chip testing onto a test path along two or three probes contacting, the terminal and the interfaces between them. The test path does not pass through the chip. An electronic circuit measures the voltage drops and compensated accordingly operational signals passing through the terminals, the probes and the interfaces during the chip testing. A first embodiment comprises two probes per group. A second embodiment comprises three probes per group. In the second embodiment, the variable resistance component of three resistance measurements of first/second, first/third and second/third resistance paths are compared by the electronic circuit, in order to determine absolute resistance values for each of the three signal paths. Consequently, in the second embodiment, the voltage drops may be individually adjusted for each of the three operational signal paths.

公开(公告)号：US20060068612A1

公开(公告)日：2006-03-30

申请号：US11281848

申请日：2005-11-17

Applicant: January Kister ,  James Jaquette ,  Steve Fahrner

Inventor： January Kister ,  James Jaquette ,  Steve Fahrner

IPC: H01R12/00

CPC classification number: H01R13/2407 ,  H01R12/714 ,  H01R13/2428 ,  H01R13/2485

Abstract: An interconnect assembly includes a number of interconnect stages combined in a carrier structure. Each interconnect stage includes at least two contact sets having an upwards pointing cantilever contact and a downwards pointing cantilever contact. The cantilever contacts are attached to the carrier structure and are arranged around openings in the carrier structure such that the downward pointing cantilevers may reach through the carrier structure. Each contact set defines an independent conductive path between a single pair of opposing chip and test apparatus contacts such that multiple conductive paths are available for each interconnect stage for increased transmission reliability and reduced resistance. The cantilever contacts have a meandering contour and are either combined in symmetrical pairs at their respective tips or are free pivoting. The meandering contour provides a maximum deflectable cantilever length within an available footprint defined by the pitch of the tested chip.

Abstract translation: 互连组件包括以载体结构组合的多个互连级。 每个互连级包括至少两个具有向上指向的悬臂接触和向下指向悬臂接触的触头组。 悬臂接触件附接到载体结构并且布置在载体结构中的开口周围，使得向下指向的悬臂可以穿过载体结构。 每个触点组限定了一对相对的芯片和测试装置触点之间的独立导电路径，使得多个导电路径可用于每个互连级，以增加传输可靠性和降低的电阻。 悬臂触点具有曲折的轮廓，并且在其各自的尖端处以对称对组合或者是自由枢转。 曲折轮廓提供了由测试芯片的间距所限定的可用占空比内的最大可偏转悬臂长度。

公开(公告)号：US20060001437A1

公开(公告)日：2006-01-05

申请号：US10883568

申请日：2004-06-30

Applicant: January Kister

Inventor： January Kister

IPC: G01R31/02

CPC classification number: G01R1/07314

Abstract: A probe for test connecting an apparatus contact of a probe apparatus with a test contact of a tested electronic device along a contacting axis has a top structure, a bottom structure a spring member and a guide. The guide may be an outer guide face of the spring member or be part of the bottom or top structure in the form of a circumferential recess or a snap finger. The probe may be guided either slidably in a rigid carrier structure and/or via its circumferential recess in one or two flexible membranes snapped on a rigid support frame. The probes may be simultaneously fabricated in large numbers by micro fabrication techniques with a fixed fabrication pitch and assembled in a probe apparatus with a probe pitch independently of the fabrication pitch.

Abstract translation: 用于将探针装置的装置接触与测试的电子装置沿着接触轴的测试接触连接的测试用探针具有顶部结构，底部结构，弹簧构件和引导件。 引导件可以是弹簧构件的外引导面，也可以是圆周凹部或卡扣指形式的底部或顶部结构的一部分。 探针可以被滑动地引导到刚性载体结构中，和/或通过其一个或两个弹性膜中的圆周凹槽被引导在刚性支撑框架上。 探针可以通过具有固定制造间距的微制造技术大量同时制造，并且组装在具有与制造间距无关的探针间距的探针装置中。

公开(公告)号：US20050258844A1

公开(公告)日：2005-11-24

申请号：US10850921

申请日：2004-05-21

Applicant: January Kister

Inventor： January Kister

IPC: G01R1/067 ,  G01R1/073 ,  G01R31/02

CPC classification number: G01R1/07357 ,  G01R1/06733

Abstract: A rigid column and a suspension knee are combined in a probe held in assembly via its column. The suspension knee has a base arm laterally connecting at and propagating away from the column. The base arm extends up to a lateral knee extension where a reverse arm continues from the base arm back in direction towards a central axis of the column. The reverse arm terminates in a contact tip in a tip offset to the column axis that is smaller than the lateral knee extension. During application of a contacting force onto the contact tip, a first deflection of the base arm and a second deflection of the reverse arm counter act in conjunction with base and reverse arms' structural configurations. As a result, scrub motion may be well defined in direction and magnitude without need for additional guidance of the deflecting probe structure.

Abstract translation: 刚性柱和悬架膝盖组合在通过其柱固定在组件中的探针中。 悬架膝盖具有横向连接在柱上并从柱传播的基臂。 基部臂延伸到侧向膝部延伸部，其中反向臂从基部臂向后朝向柱的中心轴线延伸。 反向臂终止于尖端偏移到小于侧膝延伸部的列轴线的尖端中。 在将接触力施加在接触尖端上时，基部臂的第一偏转和反向臂对中的第二偏转与底部和反向臂的结构结构相结合。 结果，擦洗运动可以在方向和幅度上很好地限定，而不需要额外的偏转探针结构的引导。

公开(公告)号：US06965245B2

公开(公告)日：2005-11-15

申请号：US10429275

申请日：2003-05-01

Applicant: January Kister ,  David Beatson ,  Edward Laurent

Inventor： January Kister ,  David Beatson ,  Edward Laurent

IPC: G01R1/073 ,  G01R31/02 ,  H01R12/00

CPC classification number: G01R1/07357 ,  Y10T29/49117

Abstract: A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and seperate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachment, each interconnect structure is combined with and/or held in a carrier structure from which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal. The interconnect assembly is preferably part of a probe apparatus.

Abstract translation: 互连组件具有冶金结合到更大结构的端子的预制互连结构。 互连结构的独立且独立于较大结构的制造使得能够使用为微型钣金零件而众所周知的经济大规模制造技术。 在制造，定位和附接期间，每个互连结构与载体结构组合和/或保持在载体结构中，在附接到终端之后，载体结构被分离。 互连结构被配置成使得附接工具可以靠近互连结构和端子之间的连接接口，以便将粘结能量短时间地直接传输到附接界面上。 连接接口提供了导电和弯曲应力，该互连结构与端子之间的机械连接相反。 互连组件优选地是探针装置的一部分。

公开(公告)号：US20050245142A1

公开(公告)日：2005-11-03

申请号：US10838873

申请日：2004-05-03

Applicant: January Kister

Inventor： January Kister

IPC: H01R4/48 ,  H01R13/24

CPC classification number: H01R13/2421 ,  H01R4/4872 ,  H01R2201/20

Abstract: Sheet metal radially and axially coiled around a coiling axis forms a resilient band spring with a base arc for interlocking with a base plate and a contacting tip for contacting with test contacts. The spring band coils in a fashion such that at least two adjacent coils overlap in axial direction radially supporting and conductively contacting each other at least in operationally deflected condition of the connector. A number of connectors may be held via their base arcs in correspondingly shaped fits of a base plate. The connectors may have one or two opposing tips and being either conductively connected with their base arc to a PCB or held in through holes thereby operating as interconnectors. The contacting tip may be centered, off centered or circumferentially and multiplicatively positioned for zero, radial or circumferential scrubbing action. Two or more independent connectors may be intertwined around a single coiling axis.

Abstract translation: 围绕卷绕轴线径向和轴向盘绕的钣金形成具有基弧的弹性带弹簧，用于与基板和用于与测试触点接触的接触尖端互锁。 弹簧带线圈使得至少两个相邻的线圈在轴向方向上重叠，至少在连接器的操作上偏转的状态下径向支撑并且彼此导电地接触。 多个连接器可以通过它们的基弧保持在基板的相应形状的配合中。 连接器可以具有一个或两个相对的尖端，并且与其基弧导电地连接到PCB或保持在通孔中，从而作为互连器进行操作。 接触尖端可以居中，离心定位或周向地并且被多次定位用于零，径向或周向擦洗动作。 两个或更多个独立的连接器可以缠绕在单个卷绕轴上。

公开(公告)号：US20050196980A1

公开(公告)日：2005-09-08

申请号：US11125035

申请日：2005-05-09

Applicant: January Kister ,  James Jaquette ,  Steve Fahrner

Inventor： January Kister ,  James Jaquette ,  Steve Fahrner

IPC: H01R12/04 ,  H01R13/24 ,  H01R12/00

CPC classification number: H01R13/2407 ,  H01R12/714 ,  H01R13/2428 ,  H01R13/2485

Abstract: An interconnect assembly includes a number of interconnect stages combined in a carrier structure. Each interconnect stage includes at least two contact sets having an upwards pointing cantilever contact and a downwards pointing cantilever contact. The cantilever contacts are attached to the carrier structure and are arranged around openings in the carrier structure such that the downward pointing cantilevers may reach through the carrier structure. Each contact set defines an independent conductive path between a single pair of opposing chip and test apparatus contacts such that multiple conductive paths are available for each interconnect stage for increased transmission reliability and reduced resistance. The cantilever contacts have a meandering contour and are either combined in symmetrical pairs at their respective tips or are free pivoting. The meandering contour provides a maximum deflectable cantilever length within an available footprint defined by the pitch of the tested chip.

Abstract translation: 互连组件包括以载体结构组合的多个互连级。 每个互连级包括至少两个具有向上指向的悬臂接触和向下指向悬臂接触的触头组。 悬臂接触件附接到载体结构并且布置在载体结构中的开口周围，使得向下指向的悬臂可以穿过载体结构。 每个触点组限定了一对相对的芯片和测试装置触点之间的独立导电路径，使得多个导电路径可用于每个互连级，以增加传输可靠性和降低的电阻。 悬臂触点具有曲折的轮廓，并且在其各自的尖端处以对称对组合或者是自由枢转。 曲折轮廓提供了由测试芯片的间距所限定的可用占空比内的最大可偏转悬臂长度。

公开(公告)号：USD507198S1

公开(公告)日：2005-07-12

申请号：US29190399

申请日：2003-09-19

Applicant: January Kister

Designer： January Kister

CPC classification number: G01R1/0675 ,  G01R1/07357

公开(公告)号：US06530148B1

公开(公告)日：2003-03-11

申请号：US09579718

申请日：2000-05-26

Applicant: January Kister

Inventor： January Kister

IPC: H05K300

CPC classification number: G01R1/07357 ,  G01R3/00 ,  H01L2924/00013 ,  H01R12/714 ,  H01R13/24 ,  H01R2201/20 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  H01L2224/29099

Abstract: The present invention provides a method for sanding heads of buckling beam probes while the probes are disposed within a probe assembly between a lower die and upper die. Sanding provides that all the probes within a probe assembly have the same total length from tip to head. The method calls for contacting the probe tips to a flat fiducial plate such as a glass plate to ensure that the probe tips are coplanar. Then, the heads are sanded to a plane which is parallel with the fiducial plate. Preferably, the heads are sanded by placing the assembly and fiducial plate onto a Z-stage capable of moving in a Z direction. The Z-stage is located under a top surface of a table having a hole directly above the Z-stage. Raising the Z-stage lifts the probe heads to extend above the top surface of the table. Then, an abrasive plate resting on the top surface of the table is rubbed on the heads. Material is removed from the heads until all the probes are the same length. Probe assemblies made according to the present invention have probe heads with characteristic sanded top surfaces and the probes have the same length, generally to within 0.0001 inches.

Abstract translation: 本发明提供了一种用于在探针设置在下模和上模之间的探针组件内的情况下对屈曲光束探头进行打磨头的方法。 砂光提供探头组件内的所有探头具有从头到头相同的总长度。 该方法要求将探针尖端接触到平坦的基准板（例如玻璃板），以确保探针尖端是共面的。 然后，头部被磨砂到与基准平面平行的平面上。 优选地，通过将​​组件和基准板放置在能够沿Z方向移动的Z台上来打磨头部。 Z级位于具有直接在Z级上方的孔的桌子的顶表面下方。 升高Z档升降机的探针头延伸到桌子的顶部表面之上。 然后，将搁置在桌子顶部表面上的研磨板摩擦在头部上。 将材料从头部移除，直到所有的探头长度相同。 根据本发明制造的探针组件具有具有特征砂形顶表面的探头，并且探头具有相同的长度，通常在0.0001英寸以内。