Semiconductor pressure sensor decreasing creep stress in <110> crystalline axis direction
    81.
    发明授权
    Semiconductor pressure sensor decreasing creep stress in <110> crystalline axis direction 失效
    半导体压力传感器在<110>晶轴方向减小蠕变应力

    公开(公告)号:US06649988B2

    公开(公告)日:2003-11-18

    申请号:US10122377

    申请日:2002-04-16

    IPC分类号: H01L2982

    摘要: Metal wiring segments, which are located at peripheral positions of a diaphragm, are formed on a main surface of a thick portion of a semiconductor substrate. A ratio S/d is larger than 100, where an area of the diaphragm is S &mgr;m2 and a thickness thereof is d &mgr;m. Further, a total area of the metal wiring segments arranged on first sides of the substrate is larger than total area of the metal wiring segments arranged on second sides of the substrate, where the first sides indicate the sides in parallel with crystalline axis and the second sides indicate the sides in parallel with crystalline axis.

    摘要翻译: 位于隔膜的周边位置的金属配线段形成在半导体衬底的厚部的主表面上。 比例S / d大于100,其中隔膜的面积为S mum 2,其厚度为d mum。 此外,布置在基板的第一侧上的金属布线段的总面积大于布置在基板的第二侧上的金属布线段的总面积,其中第一侧表示与<110>晶轴平行的边 第二面表示与<100>晶轴平行的两侧。

    Capacitance type humidity sensor and manufacturing method of the same

    公开(公告)号:US06580600B2

    公开(公告)日:2003-06-17

    申请号:US10157197

    申请日:2002-05-30

    IPC分类号: H01G900

    CPC分类号: G01N27/225 Y10T29/417

    摘要: A capacitance type humidity detecting sensor has two electrodes opposing each other with a gap interposed therebetween to form a capacitor on a silicon substrate with a silicon oxide film formed on a surface thereof. A moisture-sensitive film is formed so as to cover the two electrodes with a silicon nitride film interposed therebetween. The silicon nitride film protects the two electrodes from moisture passing through the moisture-sensitive film. The capacitance formed between the two electrodes changes in accordance with ambient humidity. A switched capacitor circuit formed in a circuit element portion processes a signal indicative of a change in the capacitance formed between the two electrodes.

    Optical sensor with directivity controlled
    83.
    发明授权
    Optical sensor with directivity controlled 有权
    具有方向性控制的光学传感器

    公开(公告)号:US06521882B1

    公开(公告)日:2003-02-18

    申请号:US09522604

    申请日:2000-03-10

    IPC分类号: G01J142

    摘要: Plural photodetectors for receiving light and generating detection signals. A light amount controlling portion is arranged above the photodetectors for controlling an amount of the light to the photodetectors according to an incident angle. A weighting portion for weighting sensitivities of the photodetectors respectively. The sensitivities are weighted to provide a total output characteristic of the weighted detection signals of which magnitude varies according to the incident angle. Weighting is provided by a signal processing circuit by controlling gains, or a translucent film on the photodetectors for controlling transparencies portions above respective photodetectors, or opaque films on the photodetectors for controlling amounts of the light to respective photodetectors. A first function signal may be obtained from a part of photodetectors for an air conditioner and a second function signal may be obtained from all of photodetectors for head lamp on/off controlling. Each coaxially arranged photodetector is divided to provide a semicircle or a semi-ring shape arranged with respect to the front direction of the vehicle to provide orientation angle data to control the air conditioner.

    摘要翻译: 用于接收光并产生检测信号的多个光电探测器。 光量控制部分布置在光电检测器的上方,用于根据入射角度控制对光电检测器的光量。 用于分别对光电检测器的灵敏度进行加权的加权部分。 对灵敏度进行加权,以提供加权检测信号的总输出特性,其加权检测信号的大小根据入射角度而变化。 通过控制增益由信号处理电路提供加权,或者在光电检测器上用于控制透镜上的各个光电检测器上的部分的半透明膜,或光电检测器上的不透明膜,以控制光量到各个光电检测器。 可以从空调的一部分光电检测器获得第一功能信号,并且可以从用于头灯开/关控制的所有光电检测器获得第二功能信号。 每个同轴布置的光电检测器被分割以提供相对于车辆的前方向布置的半圆形或半环形状,以提供用于控制空调的定向角度数据。

    Sensing apparatus having a sensing bridge circuit and a temperature detecting bridge circuit for detecting a physical quantity and a related temperature compensating method
    84.
    发明授权
    Sensing apparatus having a sensing bridge circuit and a temperature detecting bridge circuit for detecting a physical quantity and a related temperature compensating method 有权
    具有感测桥接电路和用于检测物理量的温度检测桥接电路和相关温度补偿方法的检测装置

    公开(公告)号:US06329825B1

    公开(公告)日:2001-12-11

    申请号:US09440886

    申请日:1999-11-16

    IPC分类号: G01R1702

    CPC分类号: G01D3/0365 G01L9/065

    摘要: A pressure detecting bridge circuit produces a sensor signal Sd. A temperature detecting bridge circuit produces a temperature signal St. A reference voltage generating circuit produces a reference signal Sa. An analog multiplexer processes these signals Sd, St and Sa in a time-divisional manner. A differential amplification circuit and an A/D conversion circuit are commonly used to obtain the digital data corresponding to the sensor signal Sd, the temperature signal St and the reference signal Sa. The temperature detecting bridge circuit includes reference resistance elements. By adjusting the design resistance values of the reference resistance elements, the variation width of the sensor signal Sd in a pressure measuring range of the pressure detecting bridge circuit is substantially equalized in advance with the variation width of the temperature signal St in a temperature measuring range of the temperature detecting bridge circuit.

    摘要翻译: 压力检测桥电路产生传感器信号Sd。 温度检测桥接电路产生温度信号St.A参考电压产生电路产生参考信号Sa. 模拟多路复用器以时分方式处理这些信号Sd,St和Sa。 差分放大电路和A / D转换电路通常用于获得对应于传感器信号Sd,温度信号St和参考信号Sa.的数字数据。 温度检测桥电路包括参考电阻元件。 通过调整基准电阻元件的设计电阻值,压力检测桥电路的压力测量范围内的传感器信号Sd的变化幅度与温度测量范围内的温度信号St的变化宽度预先基本相等 的温度检测桥接电路。

    Sensor apparatus and method of manufacturing the same
    85.
    发明申请
    Sensor apparatus and method of manufacturing the same 有权
    传感器装置及其制造方法

    公开(公告)号:US20090199632A1

    公开(公告)日:2009-08-13

    申请号:US12320957

    申请日:2009-02-10

    申请人: Inao Toyoda

    发明人: Inao Toyoda

    IPC分类号: G01F1/692 B32B38/00

    摘要: A sensor apparatus and a method of manufacturing the same are disclosed. The sensor apparatus includes: a sensor chip; a housing receiving the sensor chip; an electric conductive member connected with a terminal of the senor chip; and a molded member covering a covered portion including a connection portion where the terminal and the electric conductive member are connected. The senor chip is bonded to a bonding member of the housing via an adhesive member. A surface of the housing, a surface of the adhesive member, and a front surface of the sensor chip are in the same plane at a boundary part of the covered portion.

    摘要翻译: 公开了传感器装置及其制造方法。 传感器装置包括:传感器芯片; 接收传感器芯片的壳体; 与传感器芯片的端子连接的导电构件; 以及覆盖包括端子和导电构件连接的连接部分的覆盖部分的模制构件。 传感器芯片经由粘接部件与外壳的接合部件接合。 壳体的表面,粘合构件的表面和传感器芯片的前表面在被覆盖部分的边界部分处于同一平面。

    Temperature detecting device
    86.
    发明授权
    Temperature detecting device 有权
    温度检测装置

    公开(公告)号:US07540658B2

    公开(公告)日:2009-06-02

    申请号:US11785275

    申请日:2007-04-17

    IPC分类号: G01K5/66

    摘要: A temperature detecting device includes a heat receiving plate, a displacement transmitting part, a deforming part, a deformation generating part and a displacement detecting part. The heat receiving plate is restrained at its rim portion to generate a displacement of a central portion in its thickness direction with respect to the rim portion in accordance with the temperature of an atmospheric gas. The displacement transmitting part is displaced in accordance with the displacement of the central portion of the heat receiving plate. The deforming part is deformed by the displacement transmitting part. The deformation generating part maintains a distance between the rim portion of the heat receiving plate and the deforming part. The displacement detecting part detects a deformation of the deforming part and outputs an electric signal.

    摘要翻译: 温度检测装置包括受热板,位移传递部分,变形部分,变形产生部分和位移检测部分。 受热板被限制在其边缘部分处,以根据大气气体的温度产生相对于边缘部分在其厚度方向上的中心部分的位移。 位移传递部分根据受热板的中心部分的位移而移位。 变形部由位移传递部变形。 变形产生部件保持热接收板的边缘部分和变形部分之间的距离。 位移检测部检测变形部的变形并输出电信号。

    Pressure sensor and attaching mechanism thereof
    87.
    发明授权
    Pressure sensor and attaching mechanism thereof 有权
    压力传感器及其连接机构

    公开(公告)号:US07464604B2

    公开(公告)日:2008-12-16

    申请号:US11905523

    申请日:2007-10-02

    IPC分类号: B23Q17/00

    摘要: A pressure sensor is attached to an engine by inserting a cylindrical metal case having a hollow part into an attaching hole formed in the engine in which engine oil flows. An oil passage is formed in the cylindrical metal case, and oil passages are formed in the housing. The pressure sensor is connected to the engine through an oil transmitting pipe and an oil returning pipe in order to radiate thermal energy of a pressure sensing diaphragm and a pressure sensing chip by flowing the engine oil from the engine to the hollow part of the metal case and by returning the engine oil from the hollow part to the engine.

    摘要翻译: 压力传感器通过将具有中空部分的圆筒形金属壳插入形成在发动机油中的发动机中的安装孔中而附接到发动机。 在圆筒形金属外壳中形成油路,在壳体内形成油路。 压力传感器通过传油管和回油管连接到发动机,以通过使发动机油从发动机流到金属壳体的中空部分来辐射压力感测膜片和压力感测芯片的热能 并且将发动机油从中空部返回到发动机。

    Compact pressure sensor with high corrosion resistance and high accuracy
    88.
    发明授权
    Compact pressure sensor with high corrosion resistance and high accuracy 有权
    紧凑型压力传感器,具有高耐腐蚀性和高精度

    公开(公告)号:US07168326B2

    公开(公告)日:2007-01-30

    申请号:US11079475

    申请日:2005-03-15

    IPC分类号: F02P5/00

    摘要: A pressure sensor mainly includes a sensor chip, a circuit chip, and a substrate. The sensor chip is configured to generate an electrical signal representative of a pressure being sensed and includes a sensing area and a plurality of contact pads. The circuit chip includes a circuit configured to process the electrical signal and a plurality of contact pads. The substrate includes a resin sheet having an opening and a plurality of conductors within the resin sheet. The substrate is joined to both the sensor chip and circuit chip so that the sensing area of the sensor chip is to be exposed to the pressure being sensed through the opening of the resin sheet, the contact pads of the sensor chip and circuit chip are electrically connected to the conductors of the substrate, and all the contact pads and conductors are hermetically embedded in the resin sheet of the substrate.

    摘要翻译: 压力传感器主要包括传感器芯片,电路芯片和基板。 传感器芯片被配置为产生代表正在感测的压力的电信号,并且包括感测区域和多个接触焊盘。 电路芯片包括被配置为处理电信号的电路和多个接触焊盘。 基板包括在树脂片内具有开口和多个导体的树脂片。 基片连接到传感器芯片和电路芯片上,以使传感器芯片的感测区域暴露于通过树脂片的开口感测的压力,传感器芯片和电路芯片的接触垫电气 连接到基板的导体,并且所有接触焊盘和导体都气密地嵌入在基板的树脂片中。

    Pressure detecting device
    89.
    发明授权
    Pressure detecting device 有权
    压力检测装置

    公开(公告)号:US07002227B2

    公开(公告)日:2006-02-21

    申请号:US10759122

    申请日:2004-01-20

    IPC分类号: H01L29/84

    CPC分类号: G01L9/0098 G01L9/0052

    摘要: A pressure detecting device includes a semiconductor substrate (30, 200, 300, 400) for outputting an electrical signal corresponding to an applied pressure received from a pressure transmitting member (20) having electrically conductive properties disposed on the front surface of the semiconductor substrate (30, 200, 300, 400). The substrate (30, 200, 300, 400) and the pressure transmitting member (20) are accommodated in a housing (10). A lead member (50) electrically independent of the housing (10) is accommodated in the housing (10) at the back surface side of the semiconductor substrate (30, 200, 300, 400), and the lead member (50) and an electrode (35b) of the substrate (30, 200, 300, 400) are electrically connected to each other through conductive adhesive material (40). The housing (10) preferably includes a first portion (101), a second portion (102) having smaller thermal conductivity than the first portion, and an electrically conductive partition portion (103).

    摘要翻译: 压力检测装置包括半导体衬底(30,200,300,400),用于输出对应于从具有设置在半导体衬底的前表面上的导电性能的压力传递部件(20)接收的施加的压力的电信号( 30,200,300,400)。 衬底(30,200,300,400)和压力传递构件(20)容纳在壳体(10)中。 电气独立于壳体(10)的引线构件(50)在半导体衬底(30,200,300,400)的背面侧容纳在壳体(10)中,并且引线构件(50)和 基板(30,200,300,400)的电极(35b)通过导电粘合材料(40)彼此电连接。 壳体(10)优选地包括第一部分(101),具有比第一部分更小的热导率的第二部分(102)和导电分隔部分(103)。

    Pressure-detecting device and method of manufacturing the same
    90.
    发明申请
    Pressure-detecting device and method of manufacturing the same 有权
    压力检测装置及其制造方法

    公开(公告)号:US20050274189A1

    公开(公告)日:2005-12-15

    申请号:US11142430

    申请日:2005-06-02

    申请人: Teruo Oda Inao Toyoda

    发明人: Teruo Oda Inao Toyoda

    摘要: One end of a rod-like pressure-conveying member is disposed in a sensing unit, and the other end extends into and through an insertion hole of an engine. A combustion pressure, to which the other end of the rod-like member is exposed, is conveyed to the sensing unit through the pressure-conveying member for the detection of the combustion pressure. The pressure-conveying member resonates at a knocking frequency fn of the engine and the knocking frequency fn is detected based on the resonance of the pressure-conveying member.

    摘要翻译: 杆状压力传送构件的一端设置在感测单元中,另一端伸入并穿过发动机的插入孔。 杆状构件的另一端露出的燃烧压力通过压力传送构件被传送到感测单元,用于检测燃烧压力。 压力传递部件以发动机的爆震频率f N n N谐振,并且基于压力传送部件的共振来检测爆震频率f N n N。