摘要:
Metal wiring segments, which are located at peripheral positions of a diaphragm, are formed on a main surface of a thick portion of a semiconductor substrate. A ratio S/d is larger than 100, where an area of the diaphragm is S &mgr;m2 and a thickness thereof is d &mgr;m. Further, a total area of the metal wiring segments arranged on first sides of the substrate is larger than total area of the metal wiring segments arranged on second sides of the substrate, where the first sides indicate the sides in parallel with crystalline axis and the second sides indicate the sides in parallel with crystalline axis.
摘要:
A capacitance type humidity detecting sensor has two electrodes opposing each other with a gap interposed therebetween to form a capacitor on a silicon substrate with a silicon oxide film formed on a surface thereof. A moisture-sensitive film is formed so as to cover the two electrodes with a silicon nitride film interposed therebetween. The silicon nitride film protects the two electrodes from moisture passing through the moisture-sensitive film. The capacitance formed between the two electrodes changes in accordance with ambient humidity. A switched capacitor circuit formed in a circuit element portion processes a signal indicative of a change in the capacitance formed between the two electrodes.
摘要:
Plural photodetectors for receiving light and generating detection signals. A light amount controlling portion is arranged above the photodetectors for controlling an amount of the light to the photodetectors according to an incident angle. A weighting portion for weighting sensitivities of the photodetectors respectively. The sensitivities are weighted to provide a total output characteristic of the weighted detection signals of which magnitude varies according to the incident angle. Weighting is provided by a signal processing circuit by controlling gains, or a translucent film on the photodetectors for controlling transparencies portions above respective photodetectors, or opaque films on the photodetectors for controlling amounts of the light to respective photodetectors. A first function signal may be obtained from a part of photodetectors for an air conditioner and a second function signal may be obtained from all of photodetectors for head lamp on/off controlling. Each coaxially arranged photodetector is divided to provide a semicircle or a semi-ring shape arranged with respect to the front direction of the vehicle to provide orientation angle data to control the air conditioner.
摘要:
A pressure detecting bridge circuit produces a sensor signal Sd. A temperature detecting bridge circuit produces a temperature signal St. A reference voltage generating circuit produces a reference signal Sa. An analog multiplexer processes these signals Sd, St and Sa in a time-divisional manner. A differential amplification circuit and an A/D conversion circuit are commonly used to obtain the digital data corresponding to the sensor signal Sd, the temperature signal St and the reference signal Sa. The temperature detecting bridge circuit includes reference resistance elements. By adjusting the design resistance values of the reference resistance elements, the variation width of the sensor signal Sd in a pressure measuring range of the pressure detecting bridge circuit is substantially equalized in advance with the variation width of the temperature signal St in a temperature measuring range of the temperature detecting bridge circuit.
摘要:
A sensor apparatus and a method of manufacturing the same are disclosed. The sensor apparatus includes: a sensor chip; a housing receiving the sensor chip; an electric conductive member connected with a terminal of the senor chip; and a molded member covering a covered portion including a connection portion where the terminal and the electric conductive member are connected. The senor chip is bonded to a bonding member of the housing via an adhesive member. A surface of the housing, a surface of the adhesive member, and a front surface of the sensor chip are in the same plane at a boundary part of the covered portion.
摘要:
A temperature detecting device includes a heat receiving plate, a displacement transmitting part, a deforming part, a deformation generating part and a displacement detecting part. The heat receiving plate is restrained at its rim portion to generate a displacement of a central portion in its thickness direction with respect to the rim portion in accordance with the temperature of an atmospheric gas. The displacement transmitting part is displaced in accordance with the displacement of the central portion of the heat receiving plate. The deforming part is deformed by the displacement transmitting part. The deformation generating part maintains a distance between the rim portion of the heat receiving plate and the deforming part. The displacement detecting part detects a deformation of the deforming part and outputs an electric signal.
摘要:
A pressure sensor is attached to an engine by inserting a cylindrical metal case having a hollow part into an attaching hole formed in the engine in which engine oil flows. An oil passage is formed in the cylindrical metal case, and oil passages are formed in the housing. The pressure sensor is connected to the engine through an oil transmitting pipe and an oil returning pipe in order to radiate thermal energy of a pressure sensing diaphragm and a pressure sensing chip by flowing the engine oil from the engine to the hollow part of the metal case and by returning the engine oil from the hollow part to the engine.
摘要:
A pressure sensor mainly includes a sensor chip, a circuit chip, and a substrate. The sensor chip is configured to generate an electrical signal representative of a pressure being sensed and includes a sensing area and a plurality of contact pads. The circuit chip includes a circuit configured to process the electrical signal and a plurality of contact pads. The substrate includes a resin sheet having an opening and a plurality of conductors within the resin sheet. The substrate is joined to both the sensor chip and circuit chip so that the sensing area of the sensor chip is to be exposed to the pressure being sensed through the opening of the resin sheet, the contact pads of the sensor chip and circuit chip are electrically connected to the conductors of the substrate, and all the contact pads and conductors are hermetically embedded in the resin sheet of the substrate.
摘要:
A pressure detecting device includes a semiconductor substrate (30, 200, 300, 400) for outputting an electrical signal corresponding to an applied pressure received from a pressure transmitting member (20) having electrically conductive properties disposed on the front surface of the semiconductor substrate (30, 200, 300, 400). The substrate (30, 200, 300, 400) and the pressure transmitting member (20) are accommodated in a housing (10). A lead member (50) electrically independent of the housing (10) is accommodated in the housing (10) at the back surface side of the semiconductor substrate (30, 200, 300, 400), and the lead member (50) and an electrode (35b) of the substrate (30, 200, 300, 400) are electrically connected to each other through conductive adhesive material (40). The housing (10) preferably includes a first portion (101), a second portion (102) having smaller thermal conductivity than the first portion, and an electrically conductive partition portion (103).
摘要:
One end of a rod-like pressure-conveying member is disposed in a sensing unit, and the other end extends into and through an insertion hole of an engine. A combustion pressure, to which the other end of the rod-like member is exposed, is conveyed to the sensing unit through the pressure-conveying member for the detection of the combustion pressure. The pressure-conveying member resonates at a knocking frequency fn of the engine and the knocking frequency fn is detected based on the resonance of the pressure-conveying member.
摘要翻译:杆状压力传送构件的一端设置在感测单元中,另一端伸入并穿过发动机的插入孔。 杆状构件的另一端露出的燃烧压力通过压力传送构件被传送到感测单元,用于检测燃烧压力。 压力传递部件以发动机的爆震频率f N n N谐振,并且基于压力传送部件的共振来检测爆震频率f N n N。