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公开(公告)号：US20230143340A1
公开(公告)日：2023-05-11
申请号：US17919739
申请日：2021-04-20
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
CPC classification number: G01R1/07371 , G01R1/06755 , G01R1/07342
Abstract: Proposed are a probe head and a probe card having the same. The probe head according to the present disclosure includes a plurality of guide plates each having a guide hole, wherein each of the guide plates has a shape in which a plurality of layers are stacked, and each of the guide plates includes: a first guide layer provided at a lowermost side thereof, and having a first guide hole; and a second guide layer provided at an uppermost side thereof, and having a second guide hole, wherein a side wall of the first guide hole and a side wall of the second guide hole are not provided on the same vertical line.
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公开(公告)号：US20230008795A1
公开(公告)日：2023-01-12
申请号：US17779551
申请日：2020-10-19
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: H01L33/00 , H01L25/075
Abstract: Proposed is a method for manufacturing a micro LED display, the method including a step of preparing a plurality of first substrates having a plurality of micro LEDs, respectively, a step of preparing a plurality of second substrates, a segmented region formation step of segmenting each of the first substrates into a plurality of regions, and a step of transferring micro LEDs of one segmented region of each of the first substrates to an associated one of the second substrates, wherein the one second substrate comprises the micro LEDs of the first substrate.
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公开(公告)号：US20220165604A1
公开(公告)日：2022-05-26
申请号：US17430206
申请日：2020-02-07
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: H01L21/683 , H01L21/67
Abstract: A micro LED vacuum adsorption body configured to vacuum-adsorb micro LEDs is proposed. More particularly, the micro LED adsorption body is capable of preventing micro LED damage when adsorbing the micro LEDs.
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公开(公告)号：US20210313491A1
公开(公告)日：2021-10-07
申请号：US17351019
申请日：2021-06-17
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Moon Hyun KIM
Abstract: An optical component package includes a main substrate including a plurality of metal bodies, and a vertical insulation part provided between the metal bodies; a cavity provided in an upper surface of the main substrate; a sub-substrate provided in the cavity of the main substrate, the sub-substrate including an insulating body, a plurality of via holes vertically passing through the insulating body and filled with a metal material being electrically connected to each of the metal bodies, and a plurality of metal pads mounted on the insulating body and electrically connected to the plurality of via holes; a plurality of optical components mounted on the plurality of metal pads and electrically connected to the plurality of metal pads; and a light transmitting member provided above the main substrate.
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公开(公告)号：US20200251284A1
公开(公告)日：2020-08-06
申请号：US16776134
申请日：2020-01-29
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
Abstract: A multilayer ceramic substrate according to the present invention includes a first insulating portion including a body of a ceramic material, a first via conductor penetrating through the body, and a first internal wiring layer and a first connection pad connected to the first via conductor; and a second insulating portion including a body of an anodized oxide material, a second via conductor penetrating through the body, and a second internal wiring layer and a second connection pad connected to the second via conductor.
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Patent Agency Ranking
公开(公告)号：US20200185570A1
公开(公告)日：2020-06-11
申请号：US16791846
申请日：2020-02-14
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
Abstract: A method for manufacturing a chip-mounting substrate includes a pre-coating step of forming a precoat on a substrate including a plurality of conductive portions and an insulating portion interposed between the conductive portions, an etching step of etching at least a portion of the precoat through a laser to form a pattern, and a step of forming a metal layer on the substrate. The pattern is disposed on at least one of the conductive portions, and the metal layer is formed in the pattern.
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公开(公告)号：US20190319178A1
公开(公告)日：2019-10-17
申请号：US16383462
申请日：2019-04-12
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Moon Hyun KIM
Abstract: The present invention relates generally to an optical device package on which an optical device is mounted and, more particularly, to an optical device package that is configured such that a unit substrate of the optical device package comes into surface contact with a curved surface of a light transmission member.
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公开(公告)号：US20190305036A1
公开(公告)日：2019-10-03
申请号：US16370749
申请日：2019-03-29
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK
Abstract: The present invention relates to a micro LED semi-finished product module and, more specifically, to a micro LED semi-finished product module being manufactured to be individually bonded to a second substrate and being modularized by mounting multiple micro LEDs on a first substrate. Accordingly, it possible to manufacture a large display using micro LEDs and it is easy to manage a defect rate.
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公开(公告)号：US20190304817A1
公开(公告)日：2019-10-03
申请号：US16366914
申请日：2019-03-27
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK
Abstract: The present invention relates to a transfer head for a micro LED, the transfer head gripping a micro LED and transferring the micro LED to a display substrate. In particular, the present invention relates to a transfer head for a micro LED, the transfer head gripping a micro LED in a state where a grip surface of the transfer head and an upper surface of the micro LED are not in contact with each other when transferring the micro LED. Accordingly, it is possible to prevent positional error which may occur when transferring the micro LED and prevent damage of the micro LED.
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公开(公告)号：US20190296195A1
公开(公告)日：2019-09-26
申请号：US16357204
申请日：2019-03-18
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
Abstract: The present invention relates generally to a substrate for an optical device, an optical device package, a manufacturing method of the substrate for the optical device, and a manufacturing method of the optical device package. More particularly, the present invention relates to a substrate for an optical device, an optical device package, a manufacturing method of the substrate for the optical device, and a manufacturing method of the optical device package, in which the optical device to be mounted self-aligns, thus improving mounting precision of the optical device, and also reflection efficiency is prevented from being reduced.
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