公开(公告)号：US08517277B2

公开(公告)日：2013-08-27

申请号：US12503112

申请日：2009-07-15

申请人： Kenji Kobae

发明人： Kenji Kobae

IPC分类号： G06K7/00

CPC分类号： H01Q1/2225 ,  G06K19/07749 ,  G06K19/0775

摘要： A radio frequency identification tag includes a substrate, and an antenna pattern disposed on an outer peripheral side surface of the substrate. An electronic device is electrically connected to the antenna pattern, and is mounted on the outer peripheral side surface of the substrate.

摘要翻译： 射频识别标签包括衬底和布置在衬底的外周侧表面上的天线图案。 电子设备电连接到天线图案，并且安装在基板的外周侧表面上。

公开(公告)号：US07670873B2

公开(公告)日：2010-03-02

申请号：US11435851

申请日：2006-05-18

申请人： Kimio Nakamura ,  Kenji Kobae ,  Takashi Kubota

发明人： Kimio Nakamura ,  Kenji Kobae ,  Takashi Kubota

IPC分类号： H01L21/00 ,  H01L21/44

CPC分类号： H01L24/75 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75304 ,  H01L2224/75744 ,  H01L2224/83139 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/3511 ,  H01L2924/00

摘要： A method of flip-chip mounting can reliably and stably mount a semiconductor chip to a mounting substrate while avoiding problems such as damage to the semiconductor chip due to a difference in thermal expansion coefficients between the semiconductor chip and the mounting substrate. The method of flip-chip mounting a semiconductor chip supports a mounting substrate on a stage in a state where a resin material has been supplied onto a chip mounting surface of the mounting substrate and presses the semiconductor chip toward the mounting substrate using a pressure/heat applying head to bond the semiconductor chip to the mounting substrate and thermally harden the resin material. A concave part is provided in a support surface of the stage that supports the semiconductor chip, and the semiconductor chip is bonded to the mounting substrate by pressing the semiconductor chip toward the mounting substrate using the pressure/heat applying head in a state where the mounting substrate is bent toward the concave part.

摘要翻译： 一种倒装芯片安装方法可以可靠且稳定地将半导体芯片安装到安装基板，同时避免由于半导体芯片和安装基板之间的热膨胀系数的差异而导致对半导体芯片的损坏等问题。 半导体芯片的倒装芯片的安装方法在将树脂材料供给到安装基板的芯片安装面上的状态下，将载置基板支撑在载台上，并使用压力/热量将半导体芯片朝向安装基板 施加头部以将半导体芯片粘合到安装基板上并使树脂材料热硬化。 在支撑半导体芯片的载物台的支撑面上设置有凹部，半导体芯片通过使用压力/加热头将半导体芯片压向安装基板而与安装基板接合， 基板向凹部弯曲。

公开(公告)号：US07356907B2

公开(公告)日：2008-04-15

申请号：US10997005

申请日：2004-11-24

申请人： Kenji Kobae ,  Takashi Kubota

发明人： Kenji Kobae ,  Takashi Kubota

IPC分类号： G11B5/127 ,  H04R31/00

CPC分类号： G11B5/486 ,  G11B5/4833 ,  G11B5/4846 ,  H05K1/056 ,  H05K3/363 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2203/0285 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4903

摘要： A method of manufacturing a cartridge assembly of a hard disk drive, including a step of forming a part of a wiring circuit into flying leads and a step of forming a coating layer on the respective opposite surfaces of the bonding surfaces of the flying leads, which will be connected to bonding terminals of a flexible printed circuit board. The method also includes a step of placing an ultrasonic tool in contact with the opposite surfaces of the flying leads via the coating layers, and applying ultrasonic vibration from the ultrasonic tool in a state where the flying leads are pressed onto the bonding terminals to ultrasonically bond the flying leads and the bonding terminals together. Additionally, the method includes a step of heating and melting the coating layers to smooth surfaces of the coating layers that have been roughened by contact with the ultrasonic tool during ultrasonic bonding.

摘要翻译： 一种制造硬盘驱动器的盒组件的方法，包括将布线电路的一部分形成为飞行引线的步骤以及在飞线的接合表面的相应相对表面上形成涂层的步骤，其中 将连接到柔性印刷电路板的接合端子。 该方法还包括将超声波工具经由涂层与飞线的相对表面接触的步骤，以及在将飞行引线按压到接合端子上以超声波接合的状态下从超声波工具施加超声波振动 飞线和接合端子在一起。 此外，该方法包括以下步骤：在超声波接合期间，通过与超声波工具的接触使加热和熔化涂层以平滑已经被粗糙化的涂层的表面。

公开(公告)号：US20070141825A1

公开(公告)日：2007-06-21

申请号：US11359426

申请日：2006-02-23

申请人： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

发明人： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

IPC分类号： H01L21/44

CPC分类号： H01L21/4853

摘要： The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: mechanically processing the board so as to form projections, which act as margins for deformation, in boding faces of the pads, on each of which the flying lead will be bonded, positioning the flying leads to correspond to the pads; and applying supersonic vibrations to a bonding tool so as to deform and crush the projections, whereby the flying leads are respectively bonded to the pads.

摘要翻译： 接合飞线的方法能够有效地使飞线与板的焊盘超音速粘接，并提高其间的接合可靠性。 该方法包括以下步骤：机械地处理板，以便形成凸起，其作为变形的边缘，在焊盘的焊接面中，每个引导面将被接合，将飞行引线定位成对应于 垫子 以及对接合工具施加超音速振动以使突起变形和压碎，由此将飞行引线分别接合到焊盘。