Abstract:
A method of sealing articles having metal and glass sealing surfaces in a vacuum-tight manner. The joint is established by heating the surfaces under pressure until welding occurs at temperatures which are lower than the softening point of the glass and which lie between the temperature at which the vapor tension of the metal is equal to 10 10 Torr and the temperature which is the melting point of the metal.
Abstract:
An electric terminal assembly, particularly for heremetic compressors, comprising a plurality of conductor pins extending through a metal body member and secured thereto by glass-to-metal seals is provided with sleeves of insulating material surrounding the pins and a body of resinous material anchoring the sleeves to the body member and covering the glass seals.
Abstract:
An apparatus for embedding metal pins in a glass panel having a base frame on the surface of which is performed the work of embedding one end of metal pins for fitting other members by the opposite end thereof in the inner wall of a glass panel having a skirt portion formed substantially vertically around its outer peripheral surface. A plurality of first pin chuck means selectively rotatable to lie substantially in a predetermined horizontal position and other positions respectively outwardly of a setting portion on the base frame of the glass panel, are positioned so as to securely carry each one end of a metal pin by subjecting the forward ends thereof to selective energization by a vacuum source. A plurality of second pin chuck means is rotated to the horizontal position, the second pin chuck means are capable of receiving and securely carrying the opposite end of each metal pin from each first pin chuck means by subjecting the forward ends thereof to selective energization by the vacuum source, the opposite end being mounted by the other members, and which are moveable in back and forth directions. A plurality of heating sources are also provided about the forward end of each second pin chuch means.
Abstract:
Method of hermetically sealing hard glass to metal as in the encapsulation of a semiconductor device wherein the glass and metal are assembled in loosely fitting relationship and placed in an oven. The assembly is then heated under nonoxidizing conditions at a first pressure. The nonoxidizing atmosphere is then evacuated to produce a second pressure and an oxygen containing gas is then introduced to produce a third pressure and to oxidize the metal when the temperature is increased to the range at which the metal oxidizes. The oxygen-containing atmosphere is then flushed out by introducing a nonoxidizing gas under pressure. The temperature is increased till the glass softens and seals with the metal. The sealed structure is then cooled.
Abstract:
THIS METHOD OF MANUFACTURING A SEMICONDUCTOR CONTAINER WHICH IS COMPRISED OF A CYLINDRICAL METAL CAN HAVING A GLASS WINDOW AT ONE END INVOLVES THE STEPS OF PLACING A SOLID GLASS PREFORM IN AN OPEN ENDED METAL CAN AND CAUSING THE SOLID GLASS PREFORM TO BECOME MOLTEN GLASS BY PLACING THE METAL CAN IN A HEATED ATMOSPHERE. THE CAN WITH THE SOLID GLASS PREFORM IS PLACED IN A MOULD JIG IN WHICH THE JIG HAS A LENS FORMED CAVITY AT ITS BASE SO THAT WHEN THE GLASS BECOMES MOLTEN IT WILL FLOW INTO THE CAVITY TO FORM THE PROPER WINDOW. AFTER THE COMBINA-
TION IS COOLED A HERMETIC SEAL IS ESTABLISHED BETWEEN THE GLASS AND THE METAL CAN. SUBSEQUENTLY THE GLASS WINDOW IS REHEATED TO A TEMPERATURE ABOVE THE SOFTENING TEMPERATURE OF GLASS AND BELOW THE WORKING TEMPERATURE SO THAT IT MAY BECOME THERMALLY POLISHED.