公开(公告)号：US5352851A

公开(公告)日：1994-10-04

申请号：US941996

申请日：1992-09-08

Applicant: James S. Wallace ,  Ernie Russell ,  Daniel Baudouin

Inventor： James S. Wallace ,  Ernie Russell ,  Daniel Baudouin

IPC: H01L23/495 ,  H05K3/30 ,  H05K3/34 ,  H01L23/02

CPC classification number: H01L23/4951 ,  H01L23/49555 ,  H05K3/303 ,  H01L2924/0002 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K2203/167 ,  H05K3/3426 ,  Y02P70/613

Abstract: An edge-mounted integrated circuit device (10 ) includes a semiconductor die (11) and a lead frame (15) attached to the semiconductor die (11). The lead frame (15) includes a plurality of leads (14) electrically connected to the semiconductor die and lead frame supports (16, 18). A package (12) encapsulates the semiconductor die and a portion of the lead frame (15). The leads (14) extend from the package (12) and are bent to present a face for surface mount connection to conductors on a substrate. The supports (16, 18) extend from the package (12) for contacting the substrate to support the device (10) in position for soldering the leads (14) to conductors on the substrate.

Abstract translation: 边缘安装集成电路器件（10）包括半导体管芯（11）和连接到半导体管芯（11）的引线框架（15）。 引线框架（15）包括电连接到半导体管芯和引线框架支撑件（16,18）的多个引线（14）。 封装（12）封装半导体管芯和引线框架（15）的一部分。 引线（14）从封装（12）延伸并被弯曲以呈现用于表面安装连接到衬底上的导体的面。 支撑件（16,18）从用于接触基板的包装（12）延伸，以将装置（10）支撑在适当位置，以将引线（14）焊接到基板上的导体。

公开(公告)号：US5275975A

公开(公告)日：1994-01-04

申请号：US907258

申请日：1992-07-01

Applicant: Daniel A. Baudouin ,  Ernest J. Russell

Inventor： Daniel A. Baudouin ,  Ernest J. Russell

IPC: H01L23/495 ,  H05K3/30 ,  H01L21/60

CPC classification number: H01L23/49555 ,  H05K3/303 ,  H01L2924/0002 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49121

Abstract: A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.

Abstract translation: 用于半导体集成电路器件的扁平封装允许边缘安装和表面贴装。 封装可以是包含半导体芯片的模制塑料，并且扁平引线从封装的一个边缘延伸。 引线被弯曲以提供焊接到PC板上的导体的区域。 机械定位，机械支撑和间距由靠近导线的封装边缘延伸的螺柱提供。 螺柱具有形成在甚至具有弯曲引线的平坦外表面的位置处的止动件; 止动件外侧的部分适合PC板中的孔。

公开(公告)号：US5260601A

公开(公告)日：1993-11-09

申请号：US578058

申请日：1990-09-05

Applicant: Daniel A. Baudouin ,  Ernest J. Russell

Inventor： Daniel A. Baudouin ,  Ernest J. Russell

IPC: H01L23/495 ,  H05K3/30 ,  H05K7/12 ,  H01L23/50

CPC classification number: H01L23/49555 ,  H05K3/303 ,  H01L2924/0002 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49121

Abstract: A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.

Abstract translation: 用于半导体集成电路器件的扁平封装允许边缘安装和表面贴装。 封装可以是包含半导体芯片的模制塑料，并且扁平引线从封装的一个边缘延伸。 引线被弯曲以提供焊接到PC板上的导体的区域。 机械定位，机械支撑和间距由靠近导线的封装边缘延伸的螺柱提供。 螺柱具有形成在甚至具有弯曲引线的平坦外表面的位置处的止动件; 止动件外侧的部分适合PC板中的孔。

公开(公告)号：US5096425A

公开(公告)日：1992-03-17

申请号：US593905

申请日：1990-10-05

Applicant: Hiroyuki Takahashi

Inventor： Hiroyuki Takahashi

IPC: H01C1/14 ,  H01G2/06 ,  H01G4/228 ,  H01L23/495 ,  H03H9/13 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01G2/06 ,  H01C1/14 ,  H01L23/49562 ,  H05K3/308 ,  H01F2027/295 ,  H01L2924/0002 ,  H05K2201/10651 ,  H05K2201/10696 ,  H05K2201/10757 ,  H05K2201/10871 ,  H05K3/3447

Abstract: Pin-shaped or flat-plate-shaped parallel terminals of an electronic or piezoelectric component for being inserted in through holes formed in a printed circuit board. The terminals are electrically connected to electrodes of the electronic component and arranged substantially parallel to each other. Each of the terminals includes a bent portion formed at a location along an axis of each terminal so as to project at least partially in a direction perpendicular to that, and the bent portions are generally at an imaginary surface defined by the terminals.

Abstract translation: 用于插入形成在印刷电路板中的通孔中的电子或压电元件的针形或平板形的平行端子。 端子电连接到电子部件的电极并且基本上彼此平行地布置。 每个端子包括形成在沿着每个端子的轴线的位置处的弯曲部分，以便至少部分地沿垂直于该端子的方向突出，并且弯曲部分通常处于由端子限定的假想表面。