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公开(公告)号:US1662488A
公开(公告)日:1928-03-13
申请号:US65142423
申请日:1923-07-13
申请人: OTTO BURKHARDT
发明人: OTTO BURKHARDT
CPC分类号: B23D57/0023 , B28D1/08
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公开(公告)号:US1043433A
公开(公告)日:1912-11-05
申请号:US1911626010
申请日:1911-05-09
申请人: EMANUEL S ROSE
发明人: JACKSON THADDEUS A
IPC分类号: B28D1/08
CPC分类号: B28D1/082
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公开(公告)号:US558483A
公开(公告)日:1896-04-21
申请号:US558483D
IPC分类号: B28D1/08
CPC分类号: B28D1/088 , Y10T83/7114 , Y10T83/7158 , Y10T83/8691 , Y10T83/8717
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公开(公告)号:US20240091987A1
公开(公告)日:2024-03-21
申请号:US18275546
申请日:2022-01-22
申请人: EGUN CO., LTD.
发明人: Sung Jun LEE , Chae Mun LEE
摘要: A wire saw apparatus comprises: a first pulley system from which a wire is withdrawn toward a structure to be cut; a second pulley system into which the wire is introduced from the structure; a first dust collection pipe unit provided to surround the wire between an end part at which surrounding of the structure by the wire ends and a part at which the wire is introduced into the first pulley system; and a second dust collection pipe unit provided to surround the wire between a start part at which surrounding of the structure by the wire starts and a part at which the wire is withdrawn from the second pulley system.
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公开(公告)号:US20210260915A1
公开(公告)日:2021-08-26
申请号:US16827608
申请日:2020-03-23
发明人: Zuoxiang LI
IPC分类号: B44C5/04 , B28D1/08 , B28D1/20 , B24B7/19 , B32B7/12 , B32B38/00 , B32B1/00 , B32B9/00 , B32B37/12
摘要: According to a processing method of a stone composite board, the two sides of a natural stone board are ground and flattened until a preset standard value of thickness variation is reached, then the surface planes and base material layers are subjected to pressure-compositing through adhesive layers, afterwards splitting is conducted, and the natural stone layer is subjected to calibrated planing with diamond roller and surface treatment to obtain the ultra-thin stone composite board.
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86.
公开(公告)号:US20200338653A1
公开(公告)日:2020-10-29
申请号:US16760459
申请日:2018-11-02
申请人: Sfera S.R.L.S.
发明人: Stefano TONGIANI
摘要: The present invention concerns a Machine (10, 10′) for simultaneous cutting of a plurality of slabs (18) from a block (B) of stone material through a plurality of band saw blades (11), wherein each of said band saw blades (11) is closed in a loop between a respective driving pulley (12) or a shared driving drum and a respective driven pulley (13) or a shared driven drum, said driving pulleys (12) or said shared driving drum rotating around a first axis (A) of rotation, or respective first axes of rotation parallel to each other, and said driven pulleys (13) or said shared driven drum rotating around the same second axis (A′) of rotation, parallel to said first axis (A) of rotation, or respective second axes of rotation parallel to each other and parallel to said first axes of rotation, said axis (A) of rotation of the driving pulleys (12) or of said shared driving drum and said axis of rotation (A′) of the driven pulleys (13) or of said shared driven drum being in turn mounted on a frame (14) movable with respect to said block of stone material, along two directions (x, y) incident to each other, one direction (x) of cutting said block (B) of stone material, said direction (x) of cutting being disposed on a plane (τ) of cutting of said slabs (18), said plane (τ) of cutting being in its turn incident with respect to a direction (y) of relative advancement of said block (B) of stone material with respect to said frame (14), characterised in that the plane (π) to which said direction (x) of cutting and said direction (y) of relative advancement of said block (B) of stone material with respect to said frame (14) belong is horizontal and at least the portion of the path of each of said band saw blades (11) included between respective movable spacers (19) is inclined with respect to the vertical of an angle (β) comprised between 3 and 20° in the direction of cutting.
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公开(公告)号:US10300628B2
公开(公告)日:2019-05-28
申请号:US15512635
申请日:2015-09-22
申请人: Dario Toncelli
发明人: Dario Toncelli
摘要: A machine (12) for working slabs of natural stone, agglomerate or ceramic material comprises: a work bench (14) adapted to receive a slab to be machined; a machining head (16) comprising a spindle (18); and movement means (20) for moving the machining head (16) above the work bench (14). The spindle (18) comprises coupling means (40) which allow a diamond chain tool (42) to be operatively fixed.
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公开(公告)号:US20180326617A1
公开(公告)日:2018-11-15
申请号:US15593544
申请日:2017-05-12
发明人: Chih-Chen KUO , Ching-Fang CHEN , Bo-Hong WU , Chao-Hung LEE , Bo-Hua CHENG
CPC分类号: B28D1/08 , B23D61/185
摘要: A diamond wire saw includes a steel wire, a molded sleeve, and a plurality of diamond bead bearing units. The molded sleeve surrounds and is bonded to the steel wire. The diamond bead bearing units are disposed around and bonded to the molded sleeve. Each of the diamond bead bearing units includes a tubular body and a functional layer that covers the tubular body and that contains a plurality of abrasive diamond particles. The molded sleeve is made of polyether-type thermoplastic polyurethane, and has a Shore hardness of greater than or equal to 70 D.
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公开(公告)号:US20180133926A1
公开(公告)日:2018-05-17
申请号:US15868984
申请日:2018-01-11
申请人: BLOUNT, INC.
发明人: Todd Gerlach
摘要: Embodiments herein provide a high stability saw chain comprising a first drive link including a first mating surface; a second drive link including a second mating surface; a first tie strap coupling the first drive link to the second drive link; wherein the first mating surface of the first drive link is configured to contact the second mating surface of the second drive link when the first and second drive links traverse an elongate portion of a guide bar to prevent reverse articulation of the saw chain less than a minimum radius of 20 inches.
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公开(公告)号:US09876078B2
公开(公告)日:2018-01-23
申请号:US14212370
申请日:2014-03-14
发明人: Hiroshi Noguchi
CPC分类号: H01L29/0657 , B23D57/0023 , B23D57/0046 , B23D61/18 , B28D1/08 , B28D5/0088 , B28D5/042 , B28D5/045 , Y10T428/21
摘要: An amount of warp of a wafer is not only reduced, but the amount of warp of the wafer is also accurately controlled to a desired amount. The present invention relates to a method for slicing a semiconductor single crystal ingot, by which a cylindrical semiconductor single crystal ingot is bonded to and held by a holder in a state where the ingot is rotated at a predetermined rotation angle around a crystal axis of the ingot different from a center axis of a cylinder of this ingot and the ingot is sliced by a cutting apparatus in this state. The predetermined rotation angle at the time of bonding and holding the ingot with the use of the holder in such a manner that an amount of warp of a wafer sliced out by the cutting apparatus becomes a predetermined amount.
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