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公开(公告)号：US20070130764A1
公开(公告)日：2007-06-14
申请号：US10576787
申请日：2005-06-30
申请人： Toru Nebashi , Shigeaki Kawakami
发明人： Toru Nebashi , Shigeaki Kawakami
IPC分类号： B23K31/02
CPC分类号： H01L24/742 , B23K3/0623 , B23K2101/42 , H01L21/4853 , H01L24/11 , H01L2224/11334 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H05K2203/041 , H05K2203/0557 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49179 , Y10T29/53174 , Y10T29/53178 , Y10T29/532
摘要： A method of mounting conductive balls comprises a step of setting, on a substrate, a mask that includes a plurality of apertures for disposing conductive balls on the substrate and a filling step. The filling step includes using a head that moves along a surface of the mask, holding a group of conductive balls in an area that is part of the surface of the mask, and moving the area so that parts of a path taken by the area overlap. By limiting the area where filling is carried out and moving the conductive balls while gathering the conductive balls in this area, it is possible to prevent losses for the conductive balls, to increase the filling efficiency, and to suppress the number of unfilled apertures.
摘要翻译： 安装导电球的方法包括在基板上设置包括用于在基板上设置导电球的多个孔的掩模和填充步骤的步骤。 填充步骤包括使用沿着掩模的表面移动的头部，将一组导电球保持在作为掩模的表面的一部分的区域中，并移动该区域，使得由该区域拍摄的路径的一部分重叠 。 通过限制进行填充的区域并且在该区域中聚集导电球的同时移动导电球，可以防止导电球的损耗，提高填充效率，并且抑制未填充孔的数量。
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公开(公告)号：US07240822B2
公开(公告)日：2007-07-10
申请号：US11407536
申请日：2006-04-19
申请人： Masao Takeuchi , Yoshiharu Fujimori , Chuji Tomita
发明人： Masao Takeuchi , Yoshiharu Fujimori , Chuji Tomita
CPC分类号： H01L24/11 , B23K3/0623 , B23K2101/40 , H01L21/4853 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H05K2203/0292 , H05K2203/041 , H05K2203/082
摘要： A ball mounting apparatus and method for mounting a plurality of balls sucked up and held by a head onto a workpiece. The apparatus includes a positioning mechanism for the workpiece, a ball supply device for supplying the balls, the head for sucking up the balls, a force generating device for urging the head upward, a clamping device for clamping the head in a condition in which this force generating device stores the force, and a moving mechanism for moving the head. The force of the force generating device is able to lift the head above a lower stop which is a component of the clamping device.
摘要翻译： 一种用于安装被头部吸附并保持在工件上的多个球的球安装装置和方法。 该装置包括用于工件的定位机构，用于供应球的球供给装置，用于吸入球的头部，用于向上推动头部的力产生装置，用于将头部夹紧的夹紧装置， 力产生装置存储力，以及用于移动头部的移动机构。 力产生装置的力能够将头抬起在作为夹紧装置的部件的下止动件上。
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公开(公告)号：US20090307899A1
公开(公告)日：2009-12-17
申请号：US12484516
申请日：2009-06-15
申请人： Toru NEBASHI , Shigeaki Kawakami
发明人： Toru NEBASHI , Shigeaki Kawakami
CPC分类号： H01L24/742 , B23K3/0623 , B23K2101/42 , H01L21/4853 , H01L24/11 , H01L2224/11334 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H05K2203/041 , H05K2203/0557 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49179 , Y10T29/53174 , Y10T29/53178 , Y10T29/532
摘要： A method of mounting conductive balls comprises a step of setting, on a substrate, a mask that includes a plurality of apertures for disposing conductive balls on the substrate and a filling step. The filling step includes using a head that moves along a surface of the mask, holding a group of conductive balls in an area that is part of the surface of the mask, and moving the area so that parts of a path taken by the area overlap. By limiting the area where filling is carried out and moving the conductive balls while gathering the conductive balls in this area, it is possible to prevent losses for the conductive balls, to increase the filling efficiency, and to suppress the number of unfilled apertures.
摘要翻译： 安装导电球的方法包括在基板上设置包括用于在基板上设置导电球的多个孔的掩模和填充步骤的步骤。 填充步骤包括使用沿着掩模的表面移动的头部，将一组导电球保持在作为掩模的表面的一部分的区域中，并移动该区域，使得由该区域拍摄的路径的一部分重叠 。 通过限制进行填充的区域并且在该区域中聚集导电球的同时移动导电球，可以防止导电球的损耗，提高填充效率，并且抑制未填充孔的数量。
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公开(公告)号：US07077305B1
公开(公告)日：2006-07-18
申请号：US09602814
申请日：2000-06-23
申请人： Masao Takeuchi , Yoshiharu Fujimori , Chuji Tomita
发明人： Masao Takeuchi , Yoshiharu Fujimori , Chuji Tomita
CPC分类号： H01L24/11 , B23K3/0623 , B23K2101/40 , H01L21/4853 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H05K2203/0292 , H05K2203/041 , H05K2203/082
摘要： A ball mounting apparatus for mounting a plurality of balls sucked up and held by a head onto a workpiece. The apparatus includes a positioning mechanism for the workpiece, a ball supply device for supplying the balls, the head for sucking up the balls, an force generating device for urging the head upward, a clamping device for clamping the head in a condition in which this force generating device stores the force, and a moving mechanism for moving the head. The force of the force generating device is able to lift the head above a lower stop which is a component of the clamping device.
摘要翻译： 一种球安装装置，用于安装被头部吸附并保持在工件上的多个球。 该装置包括用于工件的定位机构，用于供应球的球供给装置，用于吸取球的头部，用于向上推动头部的力产生装置，用于将头部夹紧的夹紧装置， 力产生装置存储力，以及用于移动头部的移动机构。 力产生装置的力能够将头抬起在作为夹紧装置的部件的下止动件上。
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公开(公告)号：US07066377B2
公开(公告)日：2006-06-27
申请号：US11017247
申请日：2004-12-20
申请人： Masao Takeuchi , Yoshiharu Fujimori , Chuji Tomita
发明人： Masao Takeuchi , Yoshiharu Fujimori , Chuji Tomita
CPC分类号： H01L24/11 , B23K3/0623 , B23K2101/40 , H01L21/4853 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H05K2203/0292 , H05K2203/041 , H05K2203/082
摘要： A ball mounting method for mounting a plurality of balls held by a head onto a workpiece. The head is clamped such that a clamping surface mounted to the head is engaged with a rigid lower positioning stop, and then moved above a ball supply section. The balls are held on the head, and the head is moved above the workpiece. The clamping force is then released so that the clamping surface does not engage the lower stop, and the head is counterbalanced between the lower positioning stop and an upper positioning stop. While the head is unclamped and counterbalanced, the balls are mounted on the workpiece. The head is then clamped and moved above the ball supply section again.
摘要翻译： 一种用于将由头部保持的多个球安装到工件上的球安装方法。 头被夹紧，使得安装到头部的夹紧表面与刚性下部定位止动件接合，然后移动到球供给部分上方。 球保持在头部，头部移动到工件上方。 然后释放夹紧力，使得夹紧表面不接合下部止动件，并且头部在下部定位止动件和上部定位止动件之间平衡。 当头部松开和平衡时，球安装在工件上。 然后将头部夹紧并再次移动到球供应部分上方。
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公开(公告)号：US08387236B2
公开(公告)日：2013-03-05
申请号：US12484516
申请日：2009-06-15
申请人： Toru Nebashi , Shigeaki Kawakami
发明人： Toru Nebashi , Shigeaki Kawakami
IPC分类号： B23P19/00
CPC分类号： H01L24/742 , B23K3/0623 , B23K2101/42 , H01L21/4853 , H01L24/11 , H01L2224/11334 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H05K2203/041 , H05K2203/0557 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49179 , Y10T29/53174 , Y10T29/53178 , Y10T29/532
摘要： A head that moves across a surface of a mask, which includes a plurality of apertures for disposing conductive balls on a substrate, whereby, while the head is rotating about an axis that is perpendicular to the mask, the axis moves across the surface of the mask. The head includes a gatherer that gathers the conductive balls into a circular area that is smaller than the surface of the mask and disposed around a center of rotation of the head, the conductive balls being gathered from an area around the circular area when the head rotates.
摘要翻译： 移动穿过掩模表面的头部，其包括用于在导电球上设置导电球的多个孔，从而当头围绕垂直于掩模的轴线旋转时，轴线移动穿过 面具。 头包括收集器，该收集器将导电球聚集成小于面罩表面的圆形区域，并围绕头部的旋转中心设置，当头部旋转时，导电球从圆形区域周围的区域聚集 。
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公开(公告)号：US20060186181A1
公开(公告)日：2006-08-24
申请号：US11407536
申请日：2006-04-19
申请人： Masao Takeuchi , Yoshiharu Fujimori , Chuji Tomita
发明人： Masao Takeuchi , Yoshiharu Fujimori , Chuji Tomita
IPC分类号： B23K31/02
CPC分类号： H01L24/11 , B23K3/0623 , B23K2101/40 , H01L21/4853 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H05K2203/0292 , H05K2203/041 , H05K2203/082
摘要： A ball mounting apparatus for mounting a plurality of balls sucked up to the head on a workpiece. The apparatus includes a positioning mechanism for the workpiece, a ball supply device for supplying the balls, the head for sucking up the balls, an energized force generating device for energizing the head upward, a clamping device for clamping the head in a condition in which this energized force generating device stores the energized force, a moving mechanism for moving the head. The energized force is able to lift the head above a lower positioning which is a component of the clamping device.
摘要翻译： 一种用于将吸附到头部上的多个球安装在工件上的球安装装置。 该装置包括用于工件的定位机构，用于供应球的球供给装置，用于吸入球的头部，用于向上供能头部的通电力产生装置，用于在头部的夹紧装置 该通电力产生装置存储通电力，用于移动头部的移动机构。 通电力能够将头部抬高到作为夹紧装置的部件的较低定位。
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公开(公告)号：US20050098606A1
公开(公告)日：2005-05-12
申请号：US11017247
申请日：2004-12-20
申请人： Masao Takeuchi , Yoshiharu Fujimori , Chuji Tomita
发明人： Masao Takeuchi , Yoshiharu Fujimori , Chuji Tomita
CPC分类号： H01L24/11 , B23K3/0623 , B23K2101/40 , H01L21/4853 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H05K2203/0292 , H05K2203/041 , H05K2203/082
摘要： A ball mounting apparatus for mounting a plurality of balls sucked up to the head on a workpiece. The apparatus includes a positioning mechanism for the workpiece, a ball supply device for supplying the balls, the head for sucking up the balls, an energized force generating device for energizing the head upward, a clamping device for clamping the head in a condition in which this energized force generating device stores the energized force, a moving mechanism for moving the head. The energized force is able to lift the head above a lower positioning which is a component of the clamping device.
摘要翻译： 一种用于将吸附到头部上的多个球安装在工件上的球安装装置。 该装置包括用于工件的定位机构，用于供应球的球供给装置，用于吸入球的头部，用于向上供能头部的通电力产生装置，用于在头部的夹紧装置 该通电力产生装置存储通电力，用于移动头部的移动机构。 通电力能够将头部抬高到作为夹紧装置的部件的较低定位。
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