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公开(公告)号：US12214403B2
公开(公告)日：2025-02-04
申请号：US18282516
申请日：2022-03-24
Applicant: Bystronic Laser AG
Inventor： Kevin Scharfenberg
Abstract: The present disclosure is directed to a method for determining the bending angle on a bending machine, wherein the bending machine includes an upper tool and a lower tool for reshaping a workpiece by bending along a bending line. One or more measuring arrangements are positioned on the bending machine, which together include at least one illumination device and in each case at least one image acquisition device. Each measuring arrangement is assigned a different surface portion of the workpiece which lies laterally adjacent to the bending line and extends along the bending line. A light pattern is imaged on the workpiece by means of the at least one illumination device of a respective measuring arrangement onto the assigned surface portion. The light pattern contains a plurality of zones which are arranged side by side along the bending line.
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2.发明授权公开(公告)号：US12194563B2
公开(公告)日：2025-01-14
申请号：US17288553
申请日：2019-10-25
Applicant: Bystronic Laser AG
Inventor： Andreas Luedi
Abstract: The present disclosure relates to a machining apparatus for laser machining a workpiece, such as laser cutting. The apparatus includes a machining laser source for generating a machining laser beam; an illumination laser source having a power for generating an illumination laser beam having a spectral range; an outlet opening for the machining laser beam and the illumination laser beam; and a laser beam guiding device which is designed such that the machining laser beam and the illumination laser beam emerge coaxially through the outlet opening; wherein at least one element selected from the power of the illumination laser source and the spectral range of the illumination laser beam is selected such that the illumination by the illumination laser beam is brighter than a self-emission of the workpiece in a machining region during laser machining. Additionally, a method for laser machining a workpiece is also included in the present disclosure.
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公开(公告)号：US20250001527A1
公开(公告)日：2025-01-02
申请号：US18887096
申请日：2024-09-17
Applicant: BYSTRONIC LASER AG
Inventor： Markus STEINLIN , Titus HAAS
IPC: B23K26/38 , B23K26/03 , B23K101/06 , B23K101/18 , G05B19/18
Abstract: A control unit for calculating a spatially and time-resolved, combined setpoint data set for control of a laser cutting process includes a measurement data interface for accessing sensor data during the cutting operation, a process interface to a first memory that stores a process model that estimates status data of the laser cutting process and a cutting result, a machine interface to a second memory in which a machine model is stored which represents a kinematic behaviour of the laser cutting head and estimates status data of a movement process and the cutting result thereof, and a processor that executes an algorithm that couples the process model and the machine model via a feed rate value and/or via a nozzle spacing value. The processor accesses the process model and the machine model in order to calculate the spatially and time-resolved, combined setpoint data set with coordinated setpoints.
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4.发明公开公开(公告)号：US20240335904A1
公开(公告)日：2024-10-10
申请号：US18701001
申请日：2022-10-24
Applicant: BYSTRONIC LASER AG
Inventor： Michael BERGER , Titus HAAS , Simon SCHEIDIGER
IPC: B23K26/073 , B23K26/38
CPC classification number: B23K26/073 , B23K26/38
Abstract: A control unit for providing control instructions for controlling a laser cutting machine by determining transition phases for transforming different dynamic laser beam shapes for the laser cutting machine, for dynamically varying the shape of the laser beam is disclosed. The control unit includes a cutting plan interface for receiving a cutting plan for cutting out parts of a workpiece that are each defined by a cutting segments ordered in a queue, an allocation tool configured to allocate a specific dynamic laser beam shape to each cutting segment, a transition tool for determining transition phases between each two consecutive specific dynamic laser beam shape, and a processor configured for determining a specific dynamic laser beam shape for each cutting segment and for determining all transition phases between each two consecutive specific dynamic laser beam shapes and for providing controlling the laser cutting machine for executing the received cutting plan.
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公开(公告)号：US20240326160A1
公开(公告)日：2024-10-03
申请号：US18701048
申请日：2022-10-24
Applicant: BYSTRONIC LASER AG
Inventor： Michael BERGER , Titus HAAS , Simon SCHEIDIGER
CPC classification number: B23K26/0604 , B23K26/38 , B23K31/006 , B23K31/10
Abstract: A control unit for determining a dynamic laser beam shape for controlling a laser cutting machine, which is provided with a dynamic beam shaping module for varying the shape of the laser beam. The control unit includes a cutting plan interface, which is configured for receiving a cutting plan, an interface to a shape storage with a stored set of dynamic laser beam shapes, in particular more than two, and a processor which is configured for automatically calculating for each of the cutting segments an allocation to a dynamic laser beam shape of the set of dynamic laser beam shapes, wherein calculating the allocation is based on the property indicator of the workpiece and is specific for the respective cutting segment. The processor is further configured for providing control instructions for controlling the laser cutting machine by applying the determined dynamic laser beams shapes for each cutting segment specifically.
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Patent Agency Ranking
公开(公告)号：US11975402B2
公开(公告)日：2024-05-07
申请号：US18249193
申请日：2021-10-15
Applicant: BYSTRONIC LASER AG
Inventor： Christoph Fahrni , Stefan Kaltenbach , Titus Haas , Andreas Luedi
IPC: B23K26/042 , B23K10/00
CPC classification number: B23K26/042 , B23K10/006
Abstract: A beam machining head (10; 100; 200) for beam cutting of a workpiece is provided, having an interface (12) for an energy beam source (14; 14, 201) for generating a focused machining energy beam (15; 206) selected from a particle beam source, a fuel fluid beam source, a plasma beam source and/or a source for electromagnetic radiation; an exit opening (16) for the machining energy beam bounded by an opening edge (18); an optical detector unit (19) for recording at least one image of an electromagnetic radiation (17) emitted from the workpiece (11) through the exit opening into the beam machining head (10; 100; 200) and induced in the workpiece by the machining energy beam; and a monitoring unit (30) connected in a data-transmitting manner to the optical detector unit for monitoring a positional relationship between a centre of the emitted electromagnetic radiation and the exit opening, wherein the monitoring unit (30) has: a first determination module for determining at least one position (180; 182) of the exit opening in the at least one image; a second determination module for determining at least one position (170) of the centre of the emitted electromagnetic radiation in the at least one image; and a third determination module for determining the positional relationship between the at least one position (170) of the centre of the emitted electromagnetic radiation and the at least one position (180; 182) of the exit opening (16). A beam machining device and a method for beam cutting are further disclosed.
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公开(公告)号：US20230305511A1
公开(公告)日：2023-09-28
申请号：US18035529
申请日：2021-11-04
Applicant: BYSTRONIC LASER AG
Inventor： Friedemann SEIBERT , Benjamin ROEDIGER
IPC: G05B19/18 , G05B19/406 , G05B19/409
CPC classification number: G05B19/188 , G05B19/406 , G05B19/409 , G05B2219/36203
Abstract: A control device for at least one technical installation is described herein. The control device includes at least one mobile control unit for controlling the at least one technical installation as well as at least one supply unit, which can be assigned in a fixed manner to the technical installation and be connected thereto in an energy- and signal-transmitting manner for supplying the at least one mobile control unit with energy. The at least one mobile control unit and the at least one supply unit have a device for wireless energy transmission with a transmission frequency within a predetermined distance between the supply unit and the mobile control unit and for wireless transmission of a safety protocol in the course of the energy transmission. Furthermore, a technical installation and a method for controlling a technical installation are specified.
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公开(公告)号：US11731212B2
公开(公告)日：2023-08-22
申请号：US17787294
申请日：2020-12-22
Applicant: Bystronic Laser AG
Inventor： Simon Scheidiger , Martin Mumenthaler , Andreas Luedi
CPC classification number: B23K26/0648 , B23K26/36
Abstract: An optical unit fora laser beam for laser machining of a workpiece is disclosed. With particular application to a laser beam, the optical unit may be applied to a high-power laser beam and comprise an optical element for the optical imaging of the laser beam, and two protective glasses that are transparent for the laser beam, the outer edges of which protective glasses being enclosed in an airtight manner by a holder in such a way that they form an interior space with the holder, the optical element also being arranged in the interior space. A laser machining device is also disclosed.
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公开(公告)号：US20230118061A1
公开(公告)日：2023-04-20
申请号：US17906801
申请日：2021-03-03
Applicant: BYSTRONIC LASER AG
Inventor： Andreas LUEDI , Roland BADER , Matthias SCHRANZ , Joël BAERTSCHI
Abstract: The present invention relates, in one aspect, to a method for process monitoring of a laser machining process for estimating a machining quality, having the following steps, which are carried out in real time during the machining process: —providing (S2) at least one captured first signal sequence with a first feature from the machining zone; —providing (S3) at least one captured second signal sequence with a second feature from the machining zone; —accessing (S4) a trained neural network with at least the recorded first and second signal sequence in order to calculate (S5) a result for estimating the machining quality.
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公开(公告)号：US20230044332A1
公开(公告)日：2023-02-09
申请号：US17759076
申请日：2021-01-22
Applicant: BYSTRONIC LASER AG
Inventor： Andreas LÜDI , Titus HAAS , Roland BADER
IPC: B23K26/03 , B23K26/046 , B23K26/38 , B23K26/06 , B23K26/70
Abstract: A method of laser machining a workpiece is provided, with a) generation of a machining laser beam and imaging of the machining laser beam on the workpiece with at least one optical element; b) machining of the workpiece with the imaged machining laser beam and generation of a cutting gap in the workpiece; c) monitoring of at least one geometric parameter of the cutting gap during step b); and d) regulating the monitored geometric parameter of the cutting gap during step c) for harmonisation with a target value of the geometric parameter of the cutting gap. Further provided is an apparatus for laser machining a workpiece.
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