公开(公告)号：US20100165509A1

公开(公告)日：2010-07-01

申请号：US12595618

申请日：2008-04-11

申请人： Hiroyuki Uwazumi ,  Yasushi Sakai ,  Shunji Takenoiri

发明人： Hiroyuki Uwazumi ,  Yasushi Sakai ,  Shunji Takenoiri

IPC分类号： G11B5/82

CPC分类号： G11B5/7325 ,  G11B5/65

摘要： A perpendicular magnetic recording medium, which includes a nonmagnetic substrate, and a soft magnetic layer, a first orientation control layer, a nonmagnetic intermediate layer, and a perpendicular magnetic recording layer formed sequentially on the nonmagnetic substrate. The perpendicular magnetic recording medium further includes a second orientation control layer provided between the first orientation control layer and the nonmagnetic intermediate layer. The nonmagnetic intermediate layer has hexagonal close-packed (hcp) structure. The first orientation control layer has a face-centered cubic (fcc) structure. The second orientation control layer includes Co and Cr, and has the hcp structure.

摘要翻译： 包括非磁性基板的垂直磁记录介质和顺序地形成在非磁性基板上的软磁性层，第一取向控制层，非磁性中间层和垂直磁记录层。 垂直磁记录介质还包括设置在第一取向控制层和非磁性中间层之间的第二取向控制层。 非磁性中间层具有六方密堆积（hcp）结构。 第一取向控制层具有面心立方（fcc）结构。 第二取向控制层包括Co和Cr，具有hcp结构。

公开(公告)号：US07629668B2

公开(公告)日：2009-12-08

申请号：US12078323

申请日：2008-03-28

申请人： Jun Yabuzaki ,  Takeshi Yokoyama ,  Tomonori Seki

发明人： Jun Yabuzaki ,  Takeshi Yokoyama ,  Tomonori Seki

IPC分类号： H01L29/00

CPC分类号： H01L23/50 ,  H01G4/228 ,  H01G4/306 ,  H01G4/40 ,  H01L23/3121 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L27/016 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The electrode of a thin-type capacitor is connected to the rear surface of a p-type semiconductor substrate which is brought to a ground potential, by a conductive DAF (Die Attach Film) or by a conductive adhesive, and the electrodes of the front surface of the p-type semiconductor substrate are respectively connected with and stacked on the terminals of a thin-type inductor by bumps, whereby manufacturing costs can be reduced while the occurrence of noise can be suppressed and packaging area can be made small.

摘要翻译： 薄型电容器的电极通过导电DAF（Die Attach Film）或导电粘合剂连接到被引导到地电位的p型半导体衬底的背面，并且前面的电极 p型半导体基板的表面通过凸块分别与薄型电感器的端子连接并堆叠在一起，从而可以降低制造成本，同时可以抑制噪声的发生，并且可以使封装面积小。