公开(公告)号：US5234522A

公开(公告)日：1993-08-10

申请号：US800586

申请日：1991-11-27

申请人： Masakatsu Suzuki ,  Junichi Imaizumi ,  Hiroshi Nomura ,  Kouichi Nagao ,  Yasushi Katoh ,  Takato Oti ,  Eikichi Satou

发明人： Masakatsu Suzuki ,  Junichi Imaizumi ,  Hiroshi Nomura ,  Kouichi Nagao ,  Yasushi Katoh ,  Takato Oti ,  Eikichi Satou

IPC分类号： H05K3/20 ,  B32B15/08 ,  C08G73/10 ,  C08J7/04 ,  C09J179/08 ,  H01B3/30 ,  H05K1/00 ,  H05K3/28 ,  H05K3/38

CPC分类号： C08J7/047 ,  B32B15/08 ,  C08G73/1046 ,  C08G73/1071 ,  C09J179/08 ,  H01B3/306 ,  H05K3/281 ,  C08J2379/08 ,  C08J2479/00 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2203/066 ,  H05K2203/095 ,  H05K3/386 ,  Y10T29/49124 ,  Y10T428/2486 ,  Y10T428/31721

摘要： A flexible printed-circuit board covered with a coverlay is produced by bonding (a) a flexible printed-circuit board that comprises a flexible base having a surface bearing a circuit and (b) a polyimide film having a surface treated to increase adhering property and another surface not treated to increase adhering property, each of the surfaces being coated with an adhesive layer, with the adhesive layer on the surface treated to increase adhering property interposed between the polyimide film and the surface bearing the circuit, and then peeling off the adhesive layer coating the polyimide film on the surface not treated to increase adhering property.

公开(公告)号：US4198499A

公开(公告)日：1980-04-15

申请号：US937116

申请日：1978-08-28

申请人： Susumu Konii ,  Masatoshi Yoshida ,  Yukio Yoshimura ,  Takehiko Ishibashi ,  Shizuo Sakamoto

发明人： Susumu Konii ,  Masatoshi Yoshida ,  Yukio Yoshimura ,  Takehiko Ishibashi ,  Shizuo Sakamoto

IPC分类号： C08G8/00 ,  C08G8/10 ,  C08G2/28

CPC分类号： C08G8/10

摘要： Resol type phenol resins containing scarcely or no phenol mononucleus compounds (monomers) and phenol dinuclei compounds (dimers) and their methylolated derivatives and scarcely containing molecules having an apparent molecular weight of more than 2500 are produced by reacting phenol with formaldehyde in the presence of an alkaline catalyst in a molar ratio of 3.0 to 6.0 moles of formaldehyde and 0.05 to 2.0 moles of the alkaline catalyst per mole of phenol, neutralizing the reaction solution with an acid to pH 4.5 to 6.5 and precipitating the resulting product for separation.

摘要翻译： 含有几乎没有苯酚单核化合物（单体）和苯酚二核化合物（二聚体）及其羟甲基化衍生物和几乎不含有表观分子量大于2500的分子的分解酚型酚树脂通过苯酚与甲醛在存在下反应生成 碱性催化剂，摩尔比为3.0-6.0摩尔甲醛和每摩尔苯酚0.05-2.0摩尔碱性催化剂，用酸将反应溶液中和至pH 4.5至6.5，沉淀所得产物进行分离。

公开(公告)号：US5262277A

公开(公告)日：1993-11-16

申请号：US824088

申请日：1992-01-22

申请人： Kuniaki Sato ,  Yasunori Kojima ,  Shigeo Tachiki ,  Tohru Kikuchi ,  Toshiaki Ishimaru ,  Nobuyuki Hayashi ,  Mitsumasa Kojima

发明人： Kuniaki Sato ,  Yasunori Kojima ,  Shigeo Tachiki ,  Tohru Kikuchi ,  Toshiaki Ishimaru ,  Nobuyuki Hayashi ,  Mitsumasa Kojima

IPC分类号： C08G69/42 ,  C08G73/10 ,  C08G77/54 ,  G03F7/038 ,  G03F7/075 ,  G03C1/725

CPC分类号： G03F7/0387 ,  C08G69/42 ,  C08G73/1039 ,  C08G73/106 ,  C08G77/54 ,  G03F7/0757

摘要： A photosensitive resin composition comprising (A) a polymer obtained by reacting an isocyanate compound having an ethylenic unsaturated group with a polymer which is a reaction product of a tetracarboxylic acid dianhydride and a diamine, and (B) a photoinitiator, can provide a thick film excellent in heat resistant, adhesiveness, flexibility, electrical and mechanical properties, and is particularly suitable for producing a photosensitive element.

摘要翻译： 一种光敏树脂组合物，其包含（A）通过使具有烯属不饱和基团的异氰酸酯化合物与作为四羧酸二酐与二胺的反应产物的聚合物与（B）光引发剂反应而得到的聚合物，可以提供厚膜 耐热性，粘合性，柔韧性，电气和机械性能优异，特别适用于制造光敏元件。