-
1.发明授权
公开(公告)号：US5262277A
公开(公告)日：1993-11-16
申请号：US824088
申请日：1992-01-22
申请人： Kuniaki Sato , Yasunori Kojima , Shigeo Tachiki , Tohru Kikuchi , Toshiaki Ishimaru , Nobuyuki Hayashi , Mitsumasa Kojima
发明人： Kuniaki Sato , Yasunori Kojima , Shigeo Tachiki , Tohru Kikuchi , Toshiaki Ishimaru , Nobuyuki Hayashi , Mitsumasa Kojima
CPC分类号： G03F7/0387 , C08G69/42 , C08G73/1039 , C08G73/106 , C08G77/54 , G03F7/0757
摘要： A photosensitive resin composition comprising (A) a polymer obtained by reacting an isocyanate compound having an ethylenic unsaturated group with a polymer which is a reaction product of a tetracarboxylic acid dianhydride and a diamine, and (B) a photoinitiator, can provide a thick film excellent in heat resistant, adhesiveness, flexibility, electrical and mechanical properties, and is particularly suitable for producing a photosensitive element.
摘要翻译： 一种光敏树脂组合物，其包含（A）通过使具有烯属不饱和基团的异氰酸酯化合物与作为四羧酸二酐与二胺的反应产物的聚合物与（B）光引发剂反应而得到的聚合物，可以提供厚膜 耐热性，粘合性，柔韧性，电气和机械性能优异，特别适用于制造光敏元件。
-
公开(公告)号：US6143475A
公开(公告)日：2000-11-07
申请号：US83056
申请日：1998-05-22
CPC分类号： G03F7/037 , C08G73/10 , C08G73/1053 , C08G73/1082 , G03F7/0387 , H05K3/4676
摘要： A polyimide precursor having repeating units of the formula: ##STR1## wherein R.sup.1 is a tetravalent organic group; and R.sup.2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.
摘要翻译： 一种具有下式重复单元的聚酰亚胺前体：其中R1是四价有机基团; R2是二价二苯基，图像形成优异，特别适合于使用i线步进机形成图案，并且通过赋予聚酰亚胺前体光敏性得到感光性树脂组合物，所述感光性树脂组合物适于形成表面 用于半导体器件的保护膜或用于多层布线板的层间绝缘膜。
-
3.发明授权
公开(公告)号：US6071667A
公开(公告)日：2000-06-06
申请号：US630478
申请日：1996-04-10
CPC分类号： G03F7/037 , C08G73/10 , C08G73/1053 , C08G73/1082 , G03F7/0387 , H05K3/4676
摘要： A polyimide precursor having repeating units of the formula: wherein R.sup.1 is a tetravalent organic group; and R.sup.2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.
摘要翻译： 一种具有下式重复单元的聚酰亚胺前体：其中R1是四价有机基团; R2是二价二苯基，图像形成优异，特别适合于使用i线步进机形成图案，并且通过赋予聚酰亚胺前体光敏性得到感光性树脂组合物，所述感光性树脂组合物适于形成表面 用于半导体器件的保护膜或用于多层布线板的层间绝缘膜。
-
公开(公告)号：US06309791B1
公开(公告)日：2001-10-30
申请号：US09634582
申请日：2000-08-08
IPC分类号： G03F7075
CPC分类号： G03F7/037 , C08G73/10 , C08G73/1053 , C08G73/1082 , G03F7/0387 , H05K3/4676
摘要： A polyimide precursor having repeating units of the formula: wherein R1 is a tetravalent organic group; and R2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.
摘要翻译： 一种具有下式重复单元的聚酰亚胺前体：其中R1是四价有机基团; R2是二价二苯基，图像形成优异，特别适合于使用i线步进机形成图案，并且通过赋予聚酰亚胺前体光敏性得到感光性树脂组合物，所述感光性树脂组合物适于形成表面 用于半导体器件的保护膜或用于多层布线板的层间绝缘膜。
-
5.发明授权Photoinitiator compositions including amino acids, coumarin and titanocene and photosensitive materials using the same 失效光引发剂组合物包括氨基酸，香豆素和二茂钛，以及使用其的感光材料
公开(公告)号：US5811218A
公开(公告)日：1998-09-22
申请号：US503274
申请日：1995-07-17
申请人： Makoto Kaji , Yasunori Kojima , Shigeki Katogi , Masataka Nunomura , Hideo Hagiwara , Dai Kawasaki , Mitsumasa Kojima , Hiroshi Suzuki , Hidetaka Satou
发明人： Makoto Kaji , Yasunori Kojima , Shigeki Katogi , Masataka Nunomura , Hideo Hagiwara , Dai Kawasaki , Mitsumasa Kojima , Hiroshi Suzuki , Hidetaka Satou
CPC分类号： G03F7/031 , G03F7/029 , G03F7/037 , Y10S430/12 , Y10S430/122 , Y10S430/125 , Y10S430/126 , Y10S430/127
摘要： An N-aryl-.alpha.-amino acid (I), which is a novel compound, is effective as a photoinitiator. The photoinitiator composition including this photoinitiator is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation. Further, a photoinitiator composition (A) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and/or an azabenzalcyclohexanone (III), or a photoinitiator composition (B) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and a titanocene (IV), or a photoinitiator composition (C) comprising a 3-substituted coumarin (II), a titanocene (IV) and an oxime ester (V), is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation.
摘要翻译： 作为新型化合物的N-芳基-α-氨基酸（I）作为光引发剂是有效的。 包含该光引发剂的光引发剂组合物对于改善含有聚（酰胺酸）的感光材料和用于图案形成的加成聚合性化合物的感光性能是有效的。 此外，包含N-芳基-α-氨基酸（I）或（I'），3-取代香豆素（II）和/或氮杂苯并环己酮（III）的光引发剂组合物（A）或光引发剂组合物 ）包含N-芳基-α-氨基酸（I）或（I'），3-取代香豆素（II）和二茂钛（IV）或包含3-取代香豆素（II）的光引发剂组合物（C） ），二茂钛（IV）和肟酯（V））对于改善含有聚（酰胺酸）的感光材料和用于图案形成的加成聚合性化合物的感光性能是有效的。
-
公开(公告)号：US5668248A
公开(公告)日：1997-09-16
申请号：US517583
申请日：1995-08-22
CPC分类号： C08G73/1025 , C07C275/40 , C08G73/0677 , C08G73/10 , C08G73/1042 , C08G73/1067 , C08G73/1071 , C08G73/1085 , C08G73/16 , G03F7/0387
摘要： A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.
摘要翻译： 一种感光性树脂组合物，其包含作为其主要成分的由式（I）表示的二氨基化合物构成的聚（酰胺酸）树脂和任选使用的其它二氨基化合物和四羧酸二酐作为其构成单体和/ 或通过将所述聚（酰胺酸）树脂和/或通过所述聚（酰胺酸）树脂或聚（酰胺酸）的脱水或醇消除闭环反应获得的聚酰胺树脂和/或聚酰亚胺树脂酯化获得的聚（酰胺酸） ）酯树脂具有优异的显影性和高的膜强度，并且可以形成低热膨胀的浮雕图案。
-
公开(公告)号：US5847071A
公开(公告)日：1998-12-08
申请号：US843860
申请日：1997-04-17
CPC分类号： C08G73/1025 , C07C275/40 , C08G73/0677 , C08G73/10 , C08G73/1042 , C08G73/1067 , C08G73/1071 , C08G73/1085 , C08G73/16 , G03F7/0387
摘要： A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.
-
公开(公告)号：US20090137129A1
公开(公告)日：2009-05-28
申请号：US12064511
申请日：2005-08-22
申请人： Yasunori Kojima , Toshiaki Itabashi
发明人： Yasunori Kojima , Toshiaki Itabashi
IPC分类号： H01L21/3065
CPC分类号： H01L23/3171 , H01L21/563 , H01L23/3128 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01004 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method is provided for manufacturing a semiconductor device having a heat-resistant resin film with flip-chip connection structure using a solder bump or a gold bump and an epoxy resin compound laminated thereon, in which adhesiveness is improved particularly after exposure to high temperature and high humidity environments for a long period of time, thereby enhancing the reliability of the semiconductor device. The method, in accordance with the present invention, for manufacturing a semiconductor device having a heat-resistant resin film formed on a semiconductor element and an epoxy resin compound layer laminated thereon, comprises the steps of carrying out a plasma treatment on a surface of the heat-resistant resin film on which the epoxy resin compound layer is laminated using a nitrogen atom-containing gas containing at least one of nitrogen, ammonia, and hydrazine.
摘要翻译： 提供一种制造半导体器件的方法，该半导体器件具有使用焊料凸块或金凸块的倒装芯片连接结构的耐热树脂膜和层压在其上的环氧树脂化合物，其中特别是在暴露于高温之后粘合性得到改善， 高湿度环境长时间，从而提高半导体器件的可靠性。 根据本发明的用于制造在半导体元件上形成的耐热树脂膜和层压在其上的环氧树脂化合物层的半导体器件的方法包括以下步骤：在所述半导体元件的表面上进行等离子体处理 使用包含氮，氨和肼中的至少一种的含氮原子的气体层压环氧树脂化合物层的耐热性树脂膜。
-
9.发明授权公开(公告)号：US06197475B1
公开(公告)日：2001-03-06
申请号：US08234861
申请日：1994-04-28
申请人： Hideo Hagiwara , Makoto Kaji , Yasunori Kojima
发明人： Hideo Hagiwara , Makoto Kaji , Yasunori Kojima
IPC分类号： G03F732
CPC分类号： G03F7/0045 , Y10S430/12
摘要： There is disclosed a positive type photosensitive resin composition which comprises an alkali-soluble polymer (A) having a carboxyl group and/or a phenolic hydroxyl group, and a compound (B) which forms an amine compound with irradiation of light.
摘要翻译： 公开了包含具有羧基和/或酚羟基的碱溶性聚合物（A）和通过照射形成胺化合物的化合物（B）的正型感光性树脂组合物。
-
公开(公告)号：US08975192B2
公开(公告)日：2015-03-10
申请号：US12064511
申请日：2006-08-22
申请人： Yasunori Kojima , Toshiaki Itabashi
发明人： Yasunori Kojima , Toshiaki Itabashi
IPC分类号： C03C15/00 , C03C25/68 , C23F1/00 , B44C1/22 , H01L21/302 , H01L21/461 , H01L21/56 , H01L23/31
CPC分类号： H01L23/3171 , H01L21/563 , H01L23/3128 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01004 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method is provided for manufacturing a semiconductor device having a heat-resistant resin film with flip-chip connection structure using a solder bump or a gold bump and an epoxy resin compound laminated thereon, in which adhesiveness is improved particularly after exposure to high temperature and high humidity environments for a long period of time, thereby enhancing the reliability of the semiconductor device. The method, in accordance with the present invention, for manufacturing a semiconductor device having a heat-resistant resin film formed on a semiconductor element and an epoxy resin compound layer laminated thereon, comprises the steps of carrying out a plasma treatment on a surface of the heat-resistant resin film on which the epoxy resin compound layer is laminated using a nitrogen atom-containing gas containing at least one of nitrogen, ammonia, and hydrazine.
摘要翻译： 提供了一种制造半导体器件的方法，该半导体器件具有使用焊料凸块或金凸块的倒装芯片连接结构的耐热树脂膜和层压在其上的环氧树脂化合物，其中特别是在暴露于高温之后粘合性得到改善， 高湿度环境长时间，从而提高半导体器件的可靠性。 根据本发明的用于制造在半导体元件上形成的耐热树脂膜和层压在其上的环氧树脂化合物层的半导体器件的方法包括以下步骤：在所述半导体元件的表面上进行等离子体处理 使用包含氮，氨和肼中的至少一种的含氮原子的气体层压环氧树脂化合物层的耐热性树脂膜。
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.029 秒)
