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公开(公告)号：US20240136384A1
公开(公告)日：2024-04-25
申请号：US18275174
申请日：2022-02-01
IPC分类号： H01L27/146 , H01L31/0304 , H01L31/0352
CPC分类号： H01L27/14649 , H01L31/03046 , H01L31/035236
摘要： A device for detecting infrared radiation, includes at least one pixel having an axis in a direction Z, the pixel comprising a first absorbent planar structure comprising at least one semiconductor layer. The composition of the materials used to produce the at least one layer of the first absorbent planar structure is chosen such that: the first absorbent planar structure has an effective valence band formed by a plurality of energy levels. Each energy level is occupied by one of: a first type of positive charge carrier, called heavy holes, having a first effective mass; or a second type of positive charge carrier, called light holes, having a second effective mass strictly less than the first effective mass. The maximum energy level of the effective valence band is occupied by light holes along the axis of the pixel.
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公开(公告)号：US11601606B2
公开(公告)日：2023-03-07
申请号：US16972982
申请日：2019-06-07
申请人： LYNRED
发明人： Alain Durand , Nicolas Boudou
摘要： A method of calibrating an infrared (IR) camera including a pixel array housed in a housing, the pixel array having an image sensor and one or more parasitic heat sensing pixels arranged to receive infrared light from different portions of an interior surface of the housing, the method including: receiving, by a processing device, one or more readings from each of the parasitic heat sensing pixels and from each pixel of the pixel array; and generating, by the processing device based on the one or more readings, one or more conversion matrices for converting readings from the parasitic heat sensing pixels into pixel correction values for performing 2D signal correction of the image.
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公开(公告)号：US11305983B2
公开(公告)日：2022-04-19
申请号：US17279006
申请日：2019-09-27
发明人： Sylvain Lemettre , David Bunel , Johan Moulin , Alain Bosseboeuf
摘要： A hermetic housing is disclosed (10a) for an optoelectronic component (11) or a MEMS device configured to form an enclosure (12) within which a low pressure or vacuum prevails. The hermetic housing includes: an optical window (14) transparent for at least one wavelength of interest (λ); and a layer of a getter material (15a) configured to capture gases present in said enclosure and deposited on the optical window opposite the enclosure. This layer of getter material has a thickness (e_t), greater than 60 nanometers, and a porosity (P) in the range from 10 to 70% to satisfy the following relation: (1−P)*e_t
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公开(公告)号：US11190719B2
公开(公告)日：2021-11-30
申请号：US17258188
申请日：2019-07-26
申请人： LYNRED
发明人： Gilbert Decaens
IPC分类号： H04N5/369 , H04N5/3745 , H04N5/378
摘要： A first input receiving a voltage to be sampled formed by a terminal of a sampling capacitor. An amplifier has a first input connected to another terminal of the sampling capacitor and a second input connected to a reference voltage. The amplifier is supplied by a power supply configured to deliver a reduced current and to supply the amplifier in a first condition during a first period, deliver a rated current and to supply the amplifier in a second condition during a second period, the reduced current being lower than the rated current. During the first period, the first and second inputs of the amplifier are short-circuited.
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公开(公告)号：US20210274118A1
公开(公告)日：2021-09-02
申请号：US17258188
申请日：2019-07-26
申请人： LYNRED
发明人： Gilbert DECAENS
IPC分类号： H04N5/369 , H04N5/378 , H04N5/3745
摘要： A first input receiving a voltage to be sampled formed by a terminal of a sampling capacitor. An amplifier has a first input connected to another terminal of the sampling capacitor and a second input connected to a reference voltage. The amplifier is supplied by a power supply configured to deliver a reduced current and to supply the amplifier in a first condition during a first period, deliver a rated current and to supply the amplifier in a second condition during a second period, the reduced current being lower than the rated current. During the first period, the first and second inputs of the amplifier are short-circuited.
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公开(公告)号：US20210072087A1
公开(公告)日：2021-03-11
申请号：US16962642
申请日：2019-02-27
申请人： LYNRED
发明人： Roger Petigny , Patrick Robert
摘要： A device of integration of an electric current received on an integration node, includes an operational amplifier, an integration capacitor, and a circuit for modifying an output voltage of the operational amplifier formed by a charge transfer circuit configured to be connected on the integration node and to transfer charges into the integration capacitor. The device also includes a comparison circuit configured to trigger the modification circuit at least once during the integration duration, and a storage circuit configured to store the number of triggerings which have occurred during the integration duration. The received electric current is calculated according to the output voltage as well as to the number of triggerings multiplied by the modification of the output voltage induced by the modification circuit.
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7.发明授权公开(公告)号：US10414647B2
公开(公告)日：2019-09-17
申请号：US15928008
申请日：2018-03-21
申请人： LYNRED
发明人： Jérôme Favier , David Bunel
摘要： A device having a microelectronic component housed in a hermetically sealed housing having a vacuum inner space, and including a getter that substantially traps only hydrogen, is inert to oxygen and/or to nitrogen, and is housed in said inner space. Each of the constituent parts of the device being likely to degas into the inner space is a mineral material.
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公开(公告)号：US20240328862A1
公开(公告)日：2024-10-03
申请号：US18698187
申请日：2022-10-07
申请人： LYNRED
发明人： Gabriel JOBERT
CPC分类号： G01J5/0859 , G01J5/0205 , G01J5/0879 , G01J2005/0077
摘要： The present description concerns an infrared imaging device (200) comprising an infrared camera (210) having an optical axis (A), said camera being intended to detect an infrared radiation in a spectral range through an element (132) transparent to said infrared radiation, the transparent element being inclined by an angle of inclination (a) greater than 0° and smaller than 90° or smaller than 0° and greater than −90° relative to an image capture direction (C);
the device further comprising a refractor element (230) transparent to the infrared radiation in the spectral range and adapted to be positioned between the transparent element and the infrared camera, said refractor element comprising a virtual exit facet of the refractor element, corresponding to an exit facet (234) of the refractor element in a tunnel diagram of said refractor element, said virtual exit facet being substantially parallel to an entry facet (232) of the refractor element.-
公开(公告)号：US11875484B2
公开(公告)日：2024-01-16
申请号：US17604913
申请日：2020-04-28
申请人： LYNRED
发明人： Alain Durand , Olivier Harant
CPC分类号： G06T5/005 , G06T5/50 , G06T7/0002 , H04N23/80 , G06T2207/10016 , G06T2207/10048 , G06T2207/30168
摘要： The present disclosure relates to a method of removing, by an imaging processing device, remanence artifacts from an image (fn) of a sequence of images captured by an infrared imaging device, the method comprising:
generating a remanence measure for at least some pixels in the image (fn) based on a difference between the pixels values of the image (fn) and the pixel values a previous image (fn−1) of the sequence; and
removing remanence artifacts from at least some pixels of the image (fn) based on a remanence estimation for each of the at least some pixels, each remanence estimation being generated based on the remanence measure and on one or more previous remanence estimations of the at least some pixels and on a model of the exponential decay of the remanence.-
公开(公告)号：US11869905B2
公开(公告)日：2024-01-09
申请号：US17258379
申请日：2019-07-26
申请人： LYNRED
发明人： Nicolas Pere-Laperne
IPC分类号： H01L27/144
CPC分类号： H01L27/1443 , H01L27/1446
摘要： A detection device includes an absorbent first stack configured to absorb an electromagnetic radiation in at least a first wavelength range and presenting a first thermal expansion coefficient. It also includes a second stack forming an optical function and presenting a second thermal expansion coefficient. The first thermal expansion coefficient is different from the second thermal expansion coefficient and the detection device further includes a buffer layer separating the first stack and the second stack. The buffer layer presents a thickness included between 0.5 μm and 50 μm so as to absorb the mechanical stresses induced by the first stack.
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