公开(公告)号：US07671436B2

公开(公告)日：2010-03-02

申请号：US12151108

申请日：2008-05-02

申请人： Ahmed Nur Amin ,  Mark Adam Bachman ,  David Lee Crouthamel ,  John William Osenbach ,  Brian Thomas Vaccaro

发明人： Ahmed Nur Amin ,  Mark Adam Bachman ,  David Lee Crouthamel ,  John William Osenbach ,  Brian Thomas Vaccaro

IPC分类号： H01L31/00

CPC分类号： H05K1/0271 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/11849 ,  H01L2224/13016 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2224/13099 ,  H01L2924/00

摘要： Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics.

摘要翻译： 涉及集成电路管芯（例如封装的集成电路）和与电路板电连接的封装模具的组件有时在用于电互连的导电焊盘处机械故障。 这种故障由具有具有特定特征的柔顺区域的下层适当的垫减轻。