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1.发明申请Semiconductor light emitting device, optical pickup unit and information recording/reproduction apparatus 失效半导体发光器件，光学拾取单元和信息记录/再现设备公开(公告)号：US20080151960A1
公开(公告)日：2008-06-26
申请号：US11978700
申请日：2008-02-19
IPC分类号： H01S5/00
CPC分类号： H01S5/4043 , B82Y20/00 , G11B7/1275 , G11B2007/0006 , H01L2224/48091 , H01L2224/48464 , H01S5/0224 , H01S5/02272 , H01S5/02276 , H01S5/02476 , H01S5/0425 , H01S5/2214 , H01S5/2224 , H01S5/3432 , H01S5/34326 , H01S5/34333 , H01S5/4087 , H01L2924/00014
摘要： A semiconductor light emitting device downsized by devising arrangement of connection pads is provided. A second light emitting device is layered on a first light emitting device. The second light emitting device has a stripe-shaped semiconductor layer formed on a second substrate on the side facing to a first substrate, a stripe-shaped p-side electrode supplying a current to the semiconductor layer, stripe-shaped opposed electrodes that are respectively arranged oppositely to respective p-side electrodes of the first light emitting device and electrically connected to the p-side electrodes of the first light emitting device, connection pads respectively and electrically connected to the respective opposed electrodes, and a connection pad electrically connected to the p-side electrode. The connection pads are arranged in parallel with the opposed electrodes.
摘要翻译： 提供了通过设计连接焊盘的布置来缩小尺寸的半导体发光器件。 第二发光器件层叠在第一发光器件上。 第二发光器件具有形成在与第一衬底相对的一侧的第二衬底上的条形半导体层，向半导体层提供电流的条形p侧电极，条形对置电极 与第一发光器件的各个p侧电极相对地布置并电连接到第一发光器件的p侧电极，分别连接到各个相对电极的连接焊盘，以及电连接到第一发光器件的连接焊盘 p侧电极。 连接焊盘与相对的电极平行布置。
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2.发明授权Semiconductor light emitting device, optical pickup unit and information recording/reproduction apparatus 失效半导体发光器件，光学拾取单元和信息记录/再现设备公开(公告)号：US08494020B2
公开(公告)日：2013-07-23
申请号：US13446916
申请日：2012-04-13
IPC分类号： H01S5/00
CPC分类号： H01S5/4043 , B82Y20/00 , G11B7/1275 , G11B2007/0006 , H01L2224/48091 , H01L2224/48464 , H01S5/0224 , H01S5/02272 , H01S5/02276 , H01S5/02476 , H01S5/0425 , H01S5/2214 , H01S5/2224 , H01S5/3432 , H01S5/34326 , H01S5/34333 , H01S5/4087 , H01L2924/00014
摘要： A semiconductor light emitting device downsized by devising arrangement of connection pads is provided. A second light emitting device is layered on a first light emitting device. The second light emitting device has a stripe-shaped semiconductor layer formed on a second substrate on the side facing to a first substrate, a stripe-shaped p-side electrode supplying a current to the semiconductor layer, stripe-shaped opposed electrodes that are respectively arranged oppositely to respective p-side electrodes of the first light emitting device and electrically connected to the p-side electrodes of the first light emitting device, connection pads respectively and electrically connected to the respective opposed electrodes, and a connection pad electrically connected to the p-side electrode. The connection pads are arranged in parallel with the opposed electrodes.
摘要翻译： 提供了通过设计连接焊盘的布置来缩小尺寸的半导体发光器件。 第二发光器件层叠在第一发光器件上。 第二发光器件具有形成在与第一衬底相对的一侧的第二衬底上的条形半导体层，向半导体层提供电流的条形p侧电极，条形对置电极 与第一发光器件的各个p侧电极相对地布置并电连接到第一发光器件的p侧电极，分别连接到各个相对电极的连接焊盘，以及电连接到第一发光器件的连接焊盘 p侧电极。 连接焊盘与相对的电极平行布置。
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3.发明授权Semiconductor light emitting device, optical pickup unit and information recording/reproduction apparatus 失效半导体发光器件，光学拾取单元和信息记录/再现设备公开(公告)号：US08243769B2
公开(公告)日：2012-08-14
申请号：US11978700
申请日：2007-10-29
CPC分类号： H01S5/4043 , B82Y20/00 , G11B7/1275 , G11B2007/0006 , H01L2224/48091 , H01L2224/48464 , H01S5/0224 , H01S5/02272 , H01S5/02276 , H01S5/02476 , H01S5/0425 , H01S5/2214 , H01S5/2224 , H01S5/3432 , H01S5/34326 , H01S5/34333 , H01S5/4087 , H01L2924/00014
摘要： A semiconductor light emitting device downsized by devising arrangement of connection pads is provided. A second light emitting device is layered on a first light emitting device. The second light emitting device has a stripe-shaped semiconductor layer formed on a second substrate on the side facing to a first substrate, a stripe-shaped p-side electrode supplying a current to the semiconductor layer, stripe-shaped opposed electrodes that are respectively arranged oppositely to respective p-side electrodes of the first light emitting device and electrically connected to the p-side electrodes of the first light emitting device, connection pads respectively and electrically connected to the respective opposed electrodes, and a connection pad electrically connected to the p-side electrode. The connection pads are arranged in parallel with the opposed electrodes.
摘要翻译： 提供了通过设计连接焊盘的布置来缩小尺寸的半导体发光器件。 第二发光器件层叠在第一发光器件上。 第二发光器件具有形成在与第一衬底相对的一侧的第二衬底上的条形半导体层，向半导体层提供电流的条形p侧电极，条形对置电极 与第一发光器件的各个p侧电极相对地布置并电连接到第一发光器件的p侧电极，分别连接到各个相对电极的连接焊盘，以及电连接到第一发光器件的连接焊盘 p侧电极。 连接焊盘与相对的电极平行布置。
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4.发明申请SEMICONDUCTOR LIGHT EMITTING DEVICE, OPTICAL PICKUP UNIT AND INFORMATION RECORDING/REPRODUCTION APPARATUS 失效半导体发光器件，光学拾取单元和信息记录/再现设备公开(公告)号：US20120205680A1
公开(公告)日：2012-08-16
申请号：US13446916
申请日：2012-04-13
IPC分类号： H01L33/08
CPC分类号： H01S5/4043 , B82Y20/00 , G11B7/1275 , G11B2007/0006 , H01L2224/48091 , H01L2224/48464 , H01S5/0224 , H01S5/02272 , H01S5/02276 , H01S5/02476 , H01S5/0425 , H01S5/2214 , H01S5/2224 , H01S5/3432 , H01S5/34326 , H01S5/34333 , H01S5/4087 , H01L2924/00014
摘要： A semiconductor light emitting device downsized by devising arrangement of connection pads is provided. A second light emitting device is layered on a first light emitting device. The second light emitting device has a stripe-shaped semiconductor layer formed on a second substrate on the side facing to a first substrate, a stripe-shaped p-side electrode supplying a current to the semiconductor layer, stripe-shaped opposed electrodes that are respectively arranged oppositely to respective p-side electrodes of the first light emitting device and electrically connected to the p-side electrodes of the first light emitting device, connection pads respectively and electrically connected to the respective opposed electrodes, and a connection pad electrically connected to the p-side electrode. The connection pads are arranged in parallel with the opposed electrodes.
摘要翻译： 提供了通过设计连接焊盘的布置来缩小尺寸的半导体发光器件。 第二发光器件层叠在第一发光器件上。 第二发光器件具有形成在与第一衬底相对的一侧的第二衬底上的条形半导体层，向半导体层提供电流的条形p侧电极，条形对置电极 与第一发光器件的各个p侧电极相对地布置并电连接到第一发光器件的p侧电极，分别连接到各个相对电极的连接焊盘，以及电连接到第一发光器件的连接焊盘 p侧电极。 连接焊盘与相对的电极平行布置。
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