公开(公告)号：US09128679B2

公开(公告)日：2015-09-08

申请号：US13600810

申请日：2012-08-31

申请人： Darryl J. McKenney ,  Daniel Toohey ,  Stephen Mariani ,  Michael Gust ,  Absu Methratta ,  Timothy Fleury ,  Steven Imperalli

发明人： Darryl J. McKenney ,  Daniel Toohey ,  Stephen Mariani ,  Michael Gust ,  Absu Methratta ,  Timothy Fleury ,  Steven Imperalli

IPC分类号： H05K1/14 ,  G06F1/18 ,  H01R12/52 ,  H05K3/40 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36

CPC分类号： G06F1/185 ,  B23C2220/36 ,  H01R12/52 ,  H05K1/11 ,  H05K3/34 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10159 ,  H05K2203/0228 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T409/303752

摘要： According to exemplary embodiments, a controlled-depth slot extending into a circuit board is provided. The controlled depth slot may be milled, and may comprise ½ radial plated through-holes to generate a solderable “D” interconnect feature. The slot may include interconnect features on one to five sides. According to another exemplary embodiment, a circuit board having a depth-controlled interconnect slot is provided in conjunction with one or more solderable technology modules. The one or more solderable technology modules may include memory devices, power devices such as Point of Load Supplies (POLS), security devices and anti-tamper devices, capacitance devices, and other types of chips such as Field Programmable Gate Arrays (FPGAs). The solderable technology modules may be soldered into the slot to secure the modules in the slot and connect the modules to interconnects on the circuit board.

摘要翻译： 根据示例性实施例，提供延伸到电路板中的受控深度槽。 受控深度槽可以被铣削，并且可以包括1/2个径向电镀通孔，以产生可焊接的“D”互连特征。 插槽可以包括一至五侧的互连特征。 根据另一示例性实施例，具有深度控制互连槽的电路板与一个或多个可焊接技术模块一起提供。 一个或多个可焊接技术模块可以包括存储器件，诸如负载供应点（POLS），安全装置和防篡改装置，电容装置和诸如现场可编程门阵列（FPGA）的其它类型的芯片的功率器件。 可焊接技术模块可以焊接到插槽中，以将模块固定在插槽中，并将模块连接到电路板上的互连。

公开(公告)号：US20130058050A1

公开(公告)日：2013-03-07

申请号：US13600810

申请日：2012-08-31

申请人： Darryl J. MCKENNEY ,  Daniel TOOHEY ,  Stephen MARIANI ,  Michael GUST ,  Absu METHRATTA ,  Timothy FLEURY ,  Steven IMPERALLI

发明人： Darryl J. MCKENNEY ,  Daniel TOOHEY ,  Stephen MARIANI ,  Michael GUST ,  Absu METHRATTA ,  Timothy FLEURY ,  Steven IMPERALLI

IPC分类号： H05K1/11 ,  B23C3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K7/06 ,  H05K3/00

CPC分类号： G06F1/185 ,  B23C2220/36 ,  H01R12/52 ,  H05K1/11 ,  H05K3/34 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10159 ,  H05K2203/0228 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T409/303752

摘要： According to exemplary embodiments, a controlled-depth slot extending into a circuit board is provided. The controlled depth slot may be milled, and may comprise ½ radial plated through-holes to generate a solderable “D” interconnect feature. The slot may include interconnect features on one to five sides. According to another exemplary embodiment, a circuit board having a depth-controlled interconnect slot is provided in conjunction with one or more solderable technology modules. The one or more solderable technology modules may include memory devices, power devices such as Point of Load Supplies (POLS), security devices and anti-tamper devices, capacitance devices, and other types of chips such as Field Programmable Gate Arrays (FPGAs). The solderable technology modules may be soldered into the slot to secure the modules in the slot and connect the modules to interconnects on the circuit board.

摘要翻译： 根据示例性实施例，提供延伸到电路板中的受控深度槽。 受控深度槽可以被铣削，并且可以包括1/2个径向电镀通孔，以产生可焊接的D互连特征。 插槽可以包括一至五侧的互连特征。 根据另一示例性实施例，具有深度控制互连槽的电路板与一个或多个可焊接技术模块一起提供。 一个或多个可焊接技术模块可以包括存储器件，诸如负载供应点（POLS），安全装置和防篡改装置，电容装置和诸如现场可编程门阵列（FPGA）的其它类型的芯片的功率器件。 可焊接技术模块可以焊接到插槽中，以将模块固定在插槽中，并将模块连接到电路板上的互连。