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13 条记录 (耗时 0.013 秒)

    Controlled impedance extruded flat ribbon cable
    1.
    发明授权
    Controlled impedance extruded flat ribbon cable 失效
    受控阻抗挤出扁平带状电缆

    公开(公告)号：US06689958B1

    公开(公告)日：2004-02-10

    申请号：US10197713

    申请日：2002-07-18

    申请人： Darryl J. McKenney ,  Steven J. Bibeau ,  Laurea J. Doiron, Jr.

    发明人： Darryl J. McKenney ,  Steven J. Bibeau ,  Laurea J. Doiron, Jr.

    IPC分类号： H01B700

    CPC分类号： H01B7/0861 ,  H01B7/0009 ,  H01B7/0018

    摘要： A flat ribbon cable having a controlled impedance and suitable for use at high data rates. The ribbon cable includes a plurality of conductors arranged side-by-side within an insulating material. The conductors include a first portion at each end having a generally circular cross-section, a center portion of generally rectangular cross-section in which the width is greater than the height and a transition portion at each end between the first portion and the second portion. A shield is disposed over selected ones of the plurality of conductors on at least one side of the ribbon cable. A drain wire is provided that is conductively coupled to the shield and may be disposed between the shield and insulating material. The drain wire is disposed over one of the conductors and may be conductively coupled to the conductor via use of a single contact of an insulation displacement connector that engages both the drain wire and the respective conductor. Multiple shield layers and associated drain wires may be provided to provide controlled impedance for selected conductors of the ribbon cable.

    摘要翻译： 扁平带状电缆，具有受控阻抗，适用于高数据速率。 带状电缆包括在绝缘材料内并排布置的多个导体。 导体包括在每个端部具有大致圆形横截面的第一部分，大致矩形横截面的中心部分，其宽度大于高度，并且在每个端部处的过渡部分在第一部分和第二部分之间 。 屏蔽层设置在带状电缆的至少一侧上的多个导体中的选定导体上。 提供了一种导线，其导电地耦合到屏蔽并且可以设置在屏蔽和绝缘材料之间。 漏极线设置在一个导体上，并且可以通过使用与漏极导线和相应导体两者接合的绝缘位移连接器的单个触点而导电耦合到导体。 可以提供多个屏蔽层和相关联的漏极线以为带状电缆的选定导体提供受控的阻抗。

    Process for providing bond enhancement and an etch resist in the fabrication of printed circuit boards
    2.
    发明授权
    Process for providing bond enhancement and an etch resist in the fabrication of printed circuit boards 失效
    在印刷电路板的制造中提供结合增强和抗蚀剂的方法

    公开(公告)号：US06645549B1

    公开(公告)日：2003-11-11

    申请号：US09958647

    申请日：2001-10-11

    申请人： Darryl J. McKenney ,  Arthur J. Demaso ,  Kathy A. Gosselin ,  Craig S. Wilson

    发明人： Darryl J. McKenney ,  Arthur J. Demaso ,  Kathy A. Gosselin ,  Craig S. Wilson

    IPC分类号： C25D360

    CPC分类号： C23C28/00 ,  C23C2/02 ,  C23C2/08 ,  C23C18/1651 ,  C23C18/54 ,  C25D3/30 ,  C25D5/10 ,  C25D7/12 ,  H05K3/062 ,  H05K3/244 ,  H05K3/384 ,  H05K3/389 ,  H05K3/4611 ,  H05K2203/073 ,  H05K2203/1476

    摘要： A process for providing bond enhancement and an etch resist for a printed circuit board is provided. A sheet comprising at least a layer of copper is immerses in a first immersion tin solution comprising a tin metal and a complexing agent in an acidic medium for a time sufficient to deposit a first heavy tin deposit on the sheet. The sheet is then immersed in a second immersion tin solution comprising stannous tin ions and stannic tin ions and a complexing agent in an acidic medium for a time sufficient to deposit a second thin tin deposit on the sheet. The second thin tin deposit has a thickness less than a thickness of the first heavy tin deposit. A rough surface texture providing mechanical adhesion sites results. The board is then treated with a coupling agent, such as silane, for enhanced bonding to a subsequent epoxy or other polymer prepreg. Additionally, the first heavy tin deposit may serve as an etch resist in subsequent fabrication of the provided circuit board.

    摘要翻译： 提供了用于提供粘结增强的方法和用于印刷电路板的蚀刻抗蚀剂。 包含至少一层铜的片材在酸性介质中浸渍在包含锡金属和络合剂的第一浸锡溶液中足以在片材上沉积第一重锡沉积物的时间。 然后将片材浸入含有锡锡离子和锡锡离子的第二浸锡溶液中，并在酸性介质中浸渍一段时间，以使第二薄锡沉积物沉积在片材上。 第二薄锡沉积物的厚度小于第一重锡沉积物的厚度。 产生提供机械粘附位点的粗糙表面纹理。 然后用偶联剂如硅烷处理该板，以增强与随后的环氧树脂或其它聚合物预浸料的粘合。 此外，第一重锡沉积物可以在随后的所提供的电路板的制造中用作抗蚀剂。

    Method of manufacturing a printed circuit board
    5.
    发明授权
    Method of manufacturing a printed circuit board 失效
    印刷电路板的制造方法

    公开(公告)号：US5376232A

    公开(公告)日：1994-12-27

    申请号：US110540

    申请日：1993-08-23

    申请人： Darryl J. McKenney ,  Robert D. Cyr

    发明人： Darryl J. McKenney ,  Robert D. Cyr

    IPC分类号： H05K3/10 ,  H05K3/18 ,  H05K3/42 ,  B44C1/22 ,  B05D5/12 ,  C23F1/00

    CPC分类号： H05K3/426 ,  H05K3/108 ,  H05K3/181 ,  H05K2201/0344

    摘要： A method of depositing a conductive material on a surface of a printed circuit board, includes the steps of chemically treating at least a portion of a surface of the printed circuit board, disposing a resist layer over the chemically treated surface, depositing a conductive layer in the areas which are not covered by the resist, stripping the resist from the surface of the printed circuit board, and cleaning exposed chemically treated surfaces of the printed circuit board to remove contaminants from the surface of the printed circuit board which were introduced in the chemically treating step.

    摘要翻译： 一种在印刷电路板的表面上沉积导电材料的方法包括以下步骤：化学处理印刷电路板的表面的至少一部分，在抗蚀剂层上方设置抗蚀剂层，将导电层沉积在 未被抗蚀剂覆盖的区域，从印刷电路板的表面剥离抗蚀剂，以及清洁印刷电路板的暴露的经化学处理的表面，以从化学引入的印刷电路板的表面去除污染物 处理步骤。

    Rigid-flex printed circuit
    6.
    发明授权
    Rigid-flex printed circuit 失效
    刚性柔性印刷电路

    公开(公告)号：US5175047A

    公开(公告)日：1992-12-29

    申请号：US757308

    申请日：1991-09-10

    申请人： Darryl J. McKenney ,  Lee Millette ,  Herb Dixon ,  Roland Caron

    发明人： Darryl J. McKenney ,  Lee Millette ,  Herb Dixon ,  Roland Caron

    IPC分类号： H05K3/00 ,  H05K3/06

    CPC分类号： H05K3/4691 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2203/1536 ,  H05K2203/308 ,  H05K3/06 ,  Y10S428/901 ,  Y10S428/913 ,  Y10T428/24777 ,  Y10T428/24826 ,  Y10T428/24917 ,  Y10T428/31511 ,  Y10T428/31678 ,  Y10T428/31721

    摘要： In a process for manufacturing a rigid-flex printed circuit wherein a rigid insulating layer supports one portion of the printed circuit and a flexible insulator supports another portion thereof to furnish flexible leads for connection the printed circuit to an operative device, a first assembly is provided comprising a curable prepreg insulator layer having an opening for the flexible leads. A flexible sheet spans the opening, and the assembly is pressed with one surface in contact with a smooth hard surface while the other surface is supported by a flowable curable prepreg layer. The insulator and flowable layers are a release layer which prevents bonding between the prepreg layers throughout most of the areas while permitting bonding along the edges. The assembly is maintained under heat and pressure to partially cure both prepreg layers and bond the flexible sheet to the edges of the opening and bond the edges of the prepregs together to form a flat rigid sandwich. A sheet of copper is bonded to that surface previously in contact with the hard surface. In a second pressing operation the copper is bonded to both the partially cured prepreg layer and the flexible sheet, and thereafter the bonded edges of the cured prepreg layers, are severed to permit separation of the cured prepreg layers.

    摘要翻译： 在制造刚性 - 柔性印刷电路的方法中，刚性绝缘层支撑印刷电路的一部分，并且柔性绝缘体支撑其另一部分以提供用于将印刷电路连接到可操作装置的柔性引线，提供第一组件 包括具有用于柔性引线的开口的可固化预浸料绝缘体层。 柔性片跨越开口，并且组件被压制成与光滑的硬表面接触的一个表面，而另一个表面由可流动的可固化预浸料层支撑。 绝缘体和可流动层是防止在大多数区域之间的预浸料层之间的粘合，同时允许沿着边缘的粘结的剥离层。 将组件保持在加热和压力下以部分地固化预浸料层并将柔性片粘合到开口的边缘并将预浸料坯的边缘粘合在一起以形成平坦的刚性夹心物。 一块铜片先前与硬表面相接合。 在第二按压操作中，将铜结合到部分固化的预浸料层和柔性片两者上，然后将固化的预浸料层的接合边缘切断以允许固化的预浸料层分离。

    Process of forming a rigid-flex circuit
    7.
    发明授权
    Process of forming a rigid-flex circuit 失效
    形成刚性电路的工艺

    公开(公告)号：US5095628A

    公开(公告)日：1992-03-17

    申请号：US565437

    申请日：1990-08-09

    申请人： Darryl J. McKenney ,  Lee Millette ,  Herb Dixon ,  Roland Caron

    发明人： Darryl J. McKenney ,  Lee Millette ,  Herb Dixon ,  Roland Caron

    IPC分类号： H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  H05K3/46

    CPC分类号： H05K3/4691 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2203/1536 ,  H05K2203/308 ,  H05K3/06 ,  Y10T29/49155

    摘要： In a process for manufacturing a rigid-flex printed circuit wherein a rigid insulating layer supports one portion of the printed circuit and a flexible insulator supports another portion thereof to furnish flexible leads for connection the printed circuit to an operative device, a first assembly is provided comprising a curable prepreg insulator layer having an opening for the flexible leads. A flexible sheet spans the opening, and the assembly is pressed with one surface in contact with a smooth hard surface while the other surface is supported by a flowable curable prepreg layer. The insulator and flowable layers are a release layer which prevents bonding between the prepreg layers throughout most of the areas while permitting bonding along the edges. The assembly is maintained under heat and pressure to partially cure both prepreg layers and bond the flexible sheet to the edges of the opening and bond the edges of the prepregs together to form a flat rigid sandwich. A sheet of copper is bonded to that surface previously in contact with the hard surface. In a second pressing operation the copper is bonded to both the partially cured prepreg layer and the flexible sheet, and thereafter the bonded edges of the cured prepreg layers, are severed to permit separation of the cured prepreg layers.