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    Oxide-bondable solder
    2.
    发明授权
    Oxide-bondable solder 有权
    可焊接的焊料

    公开(公告)号：US06319617B1

    公开(公告)日：2001-11-20

    申请号：US09642216

    申请日：2000-08-18

    申请人： Sungho Jin ,  Guenther Wilhelm Kammlott ,  Hareesh Mavoori ,  Ainissa G Ramirez

    发明人： Sungho Jin ,  Guenther Wilhelm Kammlott ,  Hareesh Mavoori ,  Ainissa G Ramirez

    IPC分类号： B32B900

    CPC分类号： B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  G02B6/022 ,  G02B6/4238 ,  Y10S228/903

    摘要： A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. The solder composition exhibits a microstructure containing a solder matrix in which is distributed fine, micron-scale islands of rare-earth-containing intermetallic particles. The existence of the islands makes the rare earth elements better available for bonding, and reduce the extent to which the rare earths are oxidized. Advantageously, the solder contains Au and/or Ag, in which the rare earth elements tend to have some solid solubility. Due to this solubility, the Au and/or Ag tend to provide some additional protection of the rare earths against oxidation, and thereby also provide accelerated dissolution of the rare earth into the molten solder.

    摘要翻译： 提供了一种很好地粘合到氧化物和其他通常难以焊接的表面的焊料组合物。 焊料对于通常具有氧化物表面的光学部件的可靠结合和封装特别有用。 焊料组合物显示出包含焊料基质的微结构，其中分布有细小的微米级的含稀土金属间化合物颗粒的岛。 岛的存在使得稀土元素更好地用于结合，并且减少稀土被氧化的程度。 有利地，焊料含有Au和/或Ag，其中稀土元素倾向于具有一些固体溶解性。 由于这种溶解度，Au和/或Ag倾向于为稀土提供一些额外的保护以防氧化，从而也提供了稀土进入熔融焊料的加速溶解。

    Non-volatile MEMS micro-relays using magnetic actuators
    3.
    发明授权
    Non-volatile MEMS micro-relays using magnetic actuators 有权
    使用磁性执行器的非易失性MEMS微型继电器

    公开(公告)号：US6124650A

    公开(公告)日：2000-09-26

    申请号：US418874

    申请日：1999-10-15

    申请人： David John Bishop ,  Sungho Jin ,  Jungsang Kim ,  Ainissa G. Ramirez

    发明人： David John Bishop ,  Sungho Jin ,  Jungsang Kim ,  Ainissa G. Ramirez

    IPC分类号： B81B3/00 ,  H01H50/00 ,  H01H50/42 ,  H01H51/22 ,  H01H51/27 ,  H02K33/10

    CPC分类号： H01H50/005 ,  H02K99/20 ,  H01H2050/007 ,  Y10S310/06

    摘要： An actuation device employing square-loop latchable magnetic material having a magnetization direction (polarization) capable of being changed in response to exposure to an external magnetic field is disclosed. The magnetic field is created by a conductor assembly with non-solenoid configuration. Once the magnetization direction of the material is so changed, the external magnetic field is no longer required to maintain the new magnetization direction. The latchable magnetic material is disposed on the mobile electrode of a switching device, and another magnetic material is disposed in spaced relation to the latchable magnetic material on a stationary electrode or surface. By applying an electrical current to a conductor assembly arranged proximate the latchable material, a magnetic field is created about the latchable magnetic material, to change the magnetization direction and thereby enable the attraction or repulsion of another magnetic material located on the stationary electrode. The resulting relative displacement of the mobile and stationary electrodes effects the selective connection or disconnection of electrical contacts carried on or associated with the respective electrodes of the actuation device without requiring additional power in order to maintain the switched state of the electrodes.

    摘要翻译： 公开了一种使用具有能够响应于暴露于外部磁场而变化的磁化方向（极化））的方形可闭锁磁性材料的致动装置。 磁场由具有非螺线管配置的导体组件产生。 一旦材料的磁化方向如此改变，则不再需要外部磁场来保持新的磁化方向。 可锁定磁性材料设置在开关装置的移动电极上，并且另一磁性材料以与固定电极或表面上的可锁定磁性材料隔开的关系设置。 通过对布置在可闭锁材料附近的导体组件施加电流，产生围绕可锁定磁性材料的磁场，以改变磁化方向，从而能够吸引或斥力位于固定电极上的另一磁性材料。 所产生的移动和固定电极的相对位移影响了携带在致动装置的相应电极上或与驱动装置的相应电极相关联的电触头的选择性连接或断开，而不需要额外的电力以保持电极的开关状态。

    Article comprising oxide-bondable solder
    5.
    发明授权
    Article comprising oxide-bondable solder 有权
    文章包括可氧化粘合的焊料

    公开(公告)号：US06306516B1

    公开(公告)日：2001-10-23

    申请号：US09466449

    申请日：1999-12-17

    申请人： Sungho Jin ,  Hareesh Mavoori ,  Ainissa G Ramirez

    发明人： Sungho Jin ,  Hareesh Mavoori ,  Ainissa G Ramirez

    IPC分类号： B32B1504

    CPC分类号： B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  G02B6/022 ,  G02B6/4238 ,  Y10S228/903

    摘要： The invention provides an article comprising a solder that bonds well to oxides and other surfaces to which solder bonding is problematic. The solder composition contains one or more rare earth elements, which react with the oxide or other surface to promote bonding, and further contains sufficient Au and/or Ag to act as carriers for the rare earths. Because rare earths have some solid solubility in Au and Ag, the problem of intermetallic formation is lessened or eliminated, and improved bonding to oxide surfaces is attained.

    摘要翻译： 本发明提供了一种包含焊料的制品，该焊料很好地粘合到氧化物和焊料粘结问题的其它表面上。 焊料组合物含有一种或多种稀土元素，其与氧化物或其它表面反应以促进键合，并且还含有足够的Au和/或Ag作为稀土的载体。 由于稀土在Au和Ag中具有一定的固溶度，所以金属间形成的问题被减少或消除，并且获得了改进的与氧化物表面的接合。