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公开(公告)号：US5028513A
公开(公告)日：1991-07-02
申请号：US336771
申请日：1989-04-13
申请人： Kanji Murakami , Mineo Kawamoto , Akio Tadokoro , Haruo Akahoshi , Toshikazu Narahara , Ritsuji Toba , Toshiaki Ishimaru , Nobuyuki Hayashi , Motoyo Wajima
发明人： Kanji Murakami , Mineo Kawamoto , Akio Tadokoro , Haruo Akahoshi , Toshikazu Narahara , Ritsuji Toba , Toshiaki Ishimaru , Nobuyuki Hayashi , Motoyo Wajima
CPC分类号： H05K3/282 , H05K3/108 , H05K2201/0355 , H05K2203/0591 , H05K2203/072 , H05K2203/1105 , H05K2203/124 , H05K3/0076 , H05K3/062 , H05K3/383
摘要： The present invention provide a process for producing printed circuit boards which comprises the steps of(a) roughening a surface of a copper layer formed on an insulating board.(b) coating the roughened surface of copper layer with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to a circuit pattern to form, and developing the resulting resist layer, thereby forming plating-resist coats on circuit-negative pattern portions of the copper layer,(c) heat-treating the plating-resist coats,(d) plating chemically the circuit-corresponding portion with copper,(e) removing the plating-resist coats, and(f) removing the copper layer except the circuit-corresponding portion thereof.
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公开(公告)号：US4632852A
公开(公告)日：1986-12-30
申请号：US746099
申请日：1985-06-18
申请人： Haruo Akahoshi , Kanji Murakami , Mineo Kawamoto , Motoyo Wajima , Rituji Toba , Shoji Kawakubo , Akio Tadokoro
发明人： Haruo Akahoshi , Kanji Murakami , Mineo Kawamoto , Motoyo Wajima , Rituji Toba , Shoji Kawakubo , Akio Tadokoro
摘要： In a process for electroless copper plating in an electroless copper plating solution containing a copper salt, a complexing agent for the copper salt, a reducing agent for the copper salt, and a pH-adjusting agent, a plating film having distinguished mechanical properties can be obtained by adding at least one of soluble inorganic silicon compounds and soluble inorganic germanium compounds and conducting the electroless copper plating by injecting an oxygen-containing gas into the plating solution or by adding an oxidizing agent to the plating solution or by both injection or the oxygen-containing gas and addition of the oxidizing agent thereto. The stability of the electroless copper plating solution can be maintained better thereby and substantially thick plating is possible.
摘要翻译： 在含有铜盐，铜盐络合剂，铜盐还原剂和pH调节剂的化学镀铜溶液中的无电镀铜方法中，具有显着的机械性能的镀膜可以是 通过添加可溶性无机硅化合物和可溶性无机锗化合物中的至少一种而进行无电镀铜，通过将含氧气体注入镀液中或者通过向镀液中添加氧化剂，或者通过注入或氧气 并且向其中加入氧化剂。 可以更好地保持化学镀铜溶液的稳定性，并且可以实现基本上厚的镀覆。
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公开(公告)号：US4876177A
公开(公告)日：1989-10-24
申请号：US95921
申请日：1987-09-08
CPC分类号： H05K3/184 , H05K2203/1407 , H05K3/0023 , H05K3/387
摘要： A process for producing a printed circuit board, which comprises the steps of forming a layer comprising a photosensitive resin composition on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist on the areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; and carrying out a curing treatment to cure completely said resist. According to this invention, it is possible to provide a printed circuit board of higher reliability compared with conventional processes.
摘要翻译： 一种制造印刷电路板的方法，包括以下步骤：在绝缘基材上形成包含感光性树脂组合物的层，其表面上附着有金属的粘合剂层，随后在其上镀覆; 将包含光敏树脂组合物的所述层以使其在所述层上形成导体电路图案的负型图案并将所述负型图案半形成足以使其免受电镀溶液侵蚀的程度使光敏树脂组合物暴露于光化辐射; 通过用溶剂除去未暴露于所述光化辐射的未固化区域，从而在所述负型图案的区域上形成电镀抗蚀剂; 对未被所述电镀抗蚀剂覆盖的所述导体电路图案化学电镀，从而形成导体电路; 并进行固化处理以完全固化所述抗蚀剂。 根据本发明，与传统工艺相比，可以提供具有更高可靠性的印刷电路板。
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