公开(公告)号：US4632852A

公开(公告)日：1986-12-30

申请号：US746099

申请日：1985-06-18

申请人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Motoyo Wajima ,  Rituji Toba ,  Shoji Kawakubo ,  Akio Tadokoro

发明人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Motoyo Wajima ,  Rituji Toba ,  Shoji Kawakubo ,  Akio Tadokoro

IPC分类号： C23C18/40 ,  H05K3/18 ,  C23C3/02

CPC分类号： H05K3/187 ,  C23C18/40

摘要： In a process for electroless copper plating in an electroless copper plating solution containing a copper salt, a complexing agent for the copper salt, a reducing agent for the copper salt, and a pH-adjusting agent, a plating film having distinguished mechanical properties can be obtained by adding at least one of soluble inorganic silicon compounds and soluble inorganic germanium compounds and conducting the electroless copper plating by injecting an oxygen-containing gas into the plating solution or by adding an oxidizing agent to the plating solution or by both injection or the oxygen-containing gas and addition of the oxidizing agent thereto. The stability of the electroless copper plating solution can be maintained better thereby and substantially thick plating is possible.

摘要翻译： 在含有铜盐，铜盐络合剂，铜盐还原剂和pH调节剂的化学镀铜溶液中的无电镀铜方法中，具有显着的机械性能的镀膜可以是 通过添加可溶性无机硅化合物和可溶性无机锗化合物中的至少一种而进行无电镀铜，通过将含氧气体注入镀液中或者通过向镀液中添加氧化剂，或者通过注入或氧气 并且向其中加入氧化剂。 可以更好地保持化学镀铜溶液的稳定性，并且可以实现基本上厚的镀覆。

公开(公告)号：US4610910A

公开(公告)日：1986-09-09

申请号：US655426

申请日：1984-09-28

申请人： Mineo Kawamoto ,  Kanji Murakami ,  Haruo Akahoshi ,  Yoichi Matsuda ,  Motoyo Wajima ,  Makoto Matsunaga ,  Shoji Kawakubo ,  Toyofusa Yoshimura ,  Haruo Suzuki ,  Tomio Yoshida

发明人： Mineo Kawamoto ,  Kanji Murakami ,  Haruo Akahoshi ,  Yoichi Matsuda ,  Motoyo Wajima ,  Makoto Matsunaga ,  Shoji Kawakubo ,  Toyofusa Yoshimura ,  Haruo Suzuki ,  Tomio Yoshida

IPC分类号： H05K3/42 ,  C23C18/16 ,  H05K3/18 ,  C23C18/28

CPC分类号： H05K3/184 ,  C23C18/1605 ,  C23C18/285 ,  C23C18/30 ,  C23C18/24 ,  C23C18/405 ,  H05K2203/0713 ,  H05K2203/1407 ,  Y10S428/901 ,  Y10T428/24917

摘要： A printed circuit board comprising an insulating board deposited with a catalyst having reactivity against electroless plating deposition, a resist for electroless plating provided on the insulating board excepting the part where a circuit is to be formed and a circuit formed by electroless plating, wherein the resist for electroless plating contains a coupling agent having a function of preventing the catalyst from ionizing. A process for producing the printed circuit board in which the insulating board surface excepting the part where a circuit is to be formed is covered with a resist for electroless plating containing a coupling agent having a function of preventing the catalyst from ionizing. Use of said resist for electroless plating can prevent drop of insulation resistance of the insulating board after moisture absorption.

摘要翻译： 一种印刷电路板，包括沉积有具有反电化学沉积反应性的催化剂的绝缘板，设置在除了要形成电路的部分之外的绝缘板上的无电电镀抗蚀剂和通过无电镀形成的电路，其中抗蚀剂 化学镀含有具有防止催化剂离子化的功能的偶联剂。 制造印刷电路板的方法，其中除了要形成电路的部分之外的绝缘板表面被含有具有防止催化剂离子化的功能的偶联剂的无电镀的抗蚀剂覆盖。 使用所述抗蚀剂进行化学镀可以防止绝缘板在吸湿后的绝缘电阻下降。

公开(公告)号：US5028513A

公开(公告)日：1991-07-02

申请号：US336771

申请日：1989-04-13

申请人： Kanji Murakami ,  Mineo Kawamoto ,  Akio Tadokoro ,  Haruo Akahoshi ,  Toshikazu Narahara ,  Ritsuji Toba ,  Toshiaki Ishimaru ,  Nobuyuki Hayashi ,  Motoyo Wajima

发明人： Kanji Murakami ,  Mineo Kawamoto ,  Akio Tadokoro ,  Haruo Akahoshi ,  Toshikazu Narahara ,  Ritsuji Toba ,  Toshiaki Ishimaru ,  Nobuyuki Hayashi ,  Motoyo Wajima

IPC分类号： C23C18/40 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/28 ,  H05K3/38

CPC分类号： H05K3/282 ,  H05K3/108 ,  H05K2201/0355 ,  H05K2203/0591 ,  H05K2203/072 ,  H05K2203/1105 ,  H05K2203/124 ,  H05K3/0076 ,  H05K3/062 ,  H05K3/383

摘要： The present invention provide a process for producing printed circuit boards which comprises the steps of(a) roughening a surface of a copper layer formed on an insulating board.(b) coating the roughened surface of copper layer with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to a circuit pattern to form, and developing the resulting resist layer, thereby forming plating-resist coats on circuit-negative pattern portions of the copper layer,(c) heat-treating the plating-resist coats,(d) plating chemically the circuit-corresponding portion with copper,(e) removing the plating-resist coats, and(f) removing the copper layer except the circuit-corresponding portion thereof.

公开(公告)号：US4604160A

公开(公告)日：1986-08-05

申请号：US689802

申请日：1985-01-08

申请人： Kanji Murakami ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Motoyo Wajima ,  Yoichi Matsuda ,  Kyoji Kawakubo ,  Minoru Kanechiku ,  Toyofusa Yoshimura ,  Makoto Matsunaga

发明人： Kanji Murakami ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Motoyo Wajima ,  Yoichi Matsuda ,  Kyoji Kawakubo ,  Minoru Kanechiku ,  Toyofusa Yoshimura ,  Makoto Matsunaga

IPC分类号： H01F41/04 ,  H05K1/00 ,  H05K1/16 ,  H05K3/20 ,  C23F1/02 ,  B05D5/12 ,  B44C1/22 ,  C25D5/02

CPC分类号： H05K1/165 ,  H01F41/042 ,  H05K3/205 ,  H01L2221/68345 ,  H05K1/0393 ,  H05K2201/09881 ,  H05K2203/0152 ,  H05K2203/0726 ,  Y10T29/49155

摘要： This invention concerns a method for the manufacture of a printed wiring board which particularly proves useful as a printed coil. This method is characterized by the fact that in the work in process which has undergone the step for formation of a conductor circuit and which has not undergone the step for separation of a plating resist, the plating resist and other insulating substratal material are separated for transfer from the surface of the substrate having the conductor circuit formed thereon.Since this method permits formation of an extremely thin insulating layer and a conductor circuit layer thicker than the insulating layer, it enables production of very thin printed wiring board and printed coil having high circuit density in the surfaces of component layers as well as in the direction of superposition of component layers.

摘要翻译： 本发明涉及一种特别证明可用作印刷线圈的印刷线路板的制造方法。 该方法的特征在于，在已经经历了形成导体电路的步骤的工作中，没有经历电镀抗蚀剂分离的步骤，电镀抗蚀剂和其它绝缘底材分离用于转印 从其上形成有导体电路的基板的表面。 由于该方法可以形成非常薄的绝缘层和比绝缘层更厚的导体电路层，所以能够在部件层表面和方向上制造非常薄的印刷线路板和具有高电路密度的印刷线圈 的组件层的叠加。

公开(公告)号：US4378384A

公开(公告)日：1983-03-29

申请号：US297565

申请日：1981-08-31

申请人： Kanji Murakami ,  Mineo Kawamoto ,  Yutaka Itoh ,  Youichi Matsuda ,  Motoyo Wajima ,  Shoji Kawakubo ,  Toyofusa Yoshimura

发明人： Kanji Murakami ,  Mineo Kawamoto ,  Yutaka Itoh ,  Youichi Matsuda ,  Motoyo Wajima ,  Shoji Kawakubo ,  Toyofusa Yoshimura

IPC分类号： H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  C23C3/02

CPC分类号： H05K3/381 ,  H05K3/387 ,  H05K2203/0793 ,  H05K2203/122 ,  H05K3/181 ,  H05K3/184 ,  H05K3/426

摘要： A process for producing a printed circuit board which comprises forming a plating film forming adhesive layer on the whole exposed surface of an insulating board, roughening said adhesive layer surface, depositing a catalyst for electroless copper plating on said adhesive layer surface from a catalyst solution, masking the thus treated insulating board surface excepting the part where a circuit is to be formed, and then performing the electroless copper plating on the catalyst of the board to form a circuit thereon, wherein an improvement comprises treating the roughened adhesive layer surface with an alkaline solution before depositing the catalyst thereon and treating the masked insulating board with an aqueous solution containing a surfactant before performing the electroless copper plating. The above process assures a higher copper utilization and a large adhesive strength of the copper plating to the board.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的整个暴露表面上形成镀膜形成粘合剂层，使所述粘合剂层表面粗糙化，在所述粘合剂层表面上从催化剂溶液沉积无电镀铜催化剂， 掩蔽除了形成电路的部分之外的如此处理的绝缘板表面，然后在板的催化剂上进行无电镀铜以在其上形成电路，其中改进包括用碱性处理粗糙化的粘合剂层表面 在将催化剂沉积在其上并在进行化学镀铜之前用含有表面活性剂的水溶液处理掩蔽的绝缘板。 上述方法确保了铜的铜利用率和电镀铜的较大的粘合强度。

公开(公告)号：US4457952A

公开(公告)日：1984-07-03

申请号：US485399

申请日：1983-04-15

申请人： Mineo Kawamoto ,  Kanji Murakami ,  Yutaka Itoh ,  Youichi Matsuda ,  Motoyo Wajima ,  Hirosada Morishita ,  Shoji Kawakubo ,  Toyofusa Yoshimura

发明人： Mineo Kawamoto ,  Kanji Murakami ,  Yutaka Itoh ,  Youichi Matsuda ,  Motoyo Wajima ,  Hirosada Morishita ,  Shoji Kawakubo ,  Toyofusa Yoshimura

IPC分类号： H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  C23C3/02

CPC分类号： H05K3/181 ,  H05K3/184 ,  H05K3/387 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2203/0773 ,  H05K2203/1407

摘要： When an alkaline earth metal carbonate powder is mixed with an adhesive and is formed into an adhesive layer in a conventional covering method, a problem of the transfer of catalyst for electroless plating during a masking step or later electroless plating step is solved. Further, blisters under plated film caused by a fire retardant contained in an insulating substrate is also overcome by the use of alkaline earth metal powder.

摘要翻译： 当将碱土金属碳酸盐粉末与粘合剂混合并且以常规的覆盖方法形成粘合剂层时，解决了在掩蔽步骤或稍后的无电解电镀步骤期间用于化学镀的催化剂的转移的问题。 此外，通过使用碱土金属粉末也克服了由绝缘基板中包含的阻燃剂引起的电镀膜下的气泡。

公开(公告)号：US4876177A

公开(公告)日：1989-10-24

申请号：US95921

申请日：1987-09-08

申请人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Akio Tadokoro ,  Toyofusa Yoshimura

发明人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Akio Tadokoro ,  Toyofusa Yoshimura

IPC分类号： C23C18/38 ,  H05K3/00 ,  H05K3/18 ,  H05K3/38

CPC分类号： H05K3/184 ,  H05K2203/1407 ,  H05K3/0023 ,  H05K3/387

摘要： A process for producing a printed circuit board, which comprises the steps of forming a layer comprising a photosensitive resin composition on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist on the areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; and carrying out a curing treatment to cure completely said resist. According to this invention, it is possible to provide a printed circuit board of higher reliability compared with conventional processes.

摘要翻译： 一种制造印刷电路板的方法，包括以下步骤：在绝缘基材上形成包含感光性树脂组合物的层，其表面上附着有金属的粘合剂层，随后在其上镀覆; 将包含光敏树脂组合物的所述层以使其在所述层上形成导体电路图案的负型图案并将所述负型图案半形成足以使其免受电镀溶液侵蚀的程度使光敏树脂组合物暴露于光化辐射; 通过用溶剂除去未暴露于所述光化辐射的未固化区域，从而在所述负型图案的区域上形成电镀抗蚀剂; 对未被所述电镀抗蚀剂覆盖的所述导体电路图案化学电镀，从而形成导体电路; 并进行固化处理以完全固化所述抗蚀剂。 根据本发明，与传统工艺相比，可以提供具有更高可靠性的印刷电路板。

公开(公告)号：US4151313A

公开(公告)日：1979-04-24

申请号：US884568

申请日：1978-03-08

申请人： Motoyo Wajima ,  Mineo Kawamoto ,  Kanji Murakami ,  Hirosada Morishita ,  Haruo Suzuki

发明人： Motoyo Wajima ,  Mineo Kawamoto ,  Kanji Murakami ,  Hirosada Morishita ,  Haruo Suzuki

IPC分类号： C23C18/16 ,  H05K3/18 ,  C23C3/02 ,  H01B5/14

CPC分类号： C23C18/1605 ,  H05K3/184 ,  H05K2203/0706 ,  H05K2203/0713 ,  H05K2203/1415

摘要： Printed circuits are produced on an insulating substrate by electroless metal plating according to a method comprising steps of:(I) forming a plating resist on a negative pattern of circuit with a masking material having an effect upon reducing the deposition of an initiator for electroless metal plating, and depositing the initiator onto the entire surface of the insulating substrate,(II) removing the initiator from the surface of said resist, and(III) dipping the insulating substrate in an electroless metal plating solution, thereby forming an electroless metal plating on a positive pattern of circuit, wherein a thermosetting resin containing a rutile type solid solution of metal oxides of titanium, nickel and antimony is employed as the masking material in said step (I), and the initiator is removed from the surface of the resist through contact with a hydrochloric acid solution of ammonium persulfate in said step (II).

摘要翻译： 印刷电路通过化学镀金属在绝缘基板上制造，所述方法包括以下步骤：

公开(公告)号：US4642161A

公开(公告)日：1987-02-10

申请号：US823003

申请日：1986-01-27

申请人： Haruo Akahoshi ,  Kanji Murakami ,  Motoyo Wajima ,  Kiyonori Kogawa ,  Ritsuji Toba ,  Takeshi Shimazaki

发明人： Haruo Akahoshi ,  Kanji Murakami ,  Motoyo Wajima ,  Kiyonori Kogawa ,  Ritsuji Toba ,  Takeshi Shimazaki

IPC分类号： B32B15/08 ,  B32B15/088 ,  B32B15/092 ,  C08J5/12 ,  C23C18/40 ,  C23C22/05 ,  C23C22/63 ,  C23C22/83 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  C23F1/02 ,  B31B31/26 ,  B44C1/22

CPC分类号： B32B15/08 ,  C23C18/40 ,  C23C22/63 ,  C23C22/83 ,  H05K3/385 ,  H05K2203/0315 ,  H05K2203/1157 ,  H05K3/4611

摘要： A method of bonding copper and a resin together is disclosed which comprises forming a copper oxide layer on the surface of copper to be bonded to a resin, reducing the copper oxide layer to metallic copper with a reducing solution, and bonding the metallic copper and the resin together. According to this method, a good acid resistance of the bonding interface and a sufficiently high bonding strength can be obtained.

摘要翻译： 公开了一种将铜和树脂接合在一起的方法，其包括在铜的表面上形成氧化铜层以与树脂接合，将还原溶液将氧化铜层还原为金属铜，并将金属铜和 树脂在一起。 根据该方法，可以获得接合界面的良好的耐酸性和足够高的接合强度。

公开(公告)号：US4239813A

公开(公告)日：1980-12-16

申请号：US33218

申请日：1979-04-25

申请人： Kanji Murakami ,  Mineo Kawamoto ,  Yoichi Matsuda ,  Motoyo Wajima ,  Hirosada Morishita

发明人： Kanji Murakami ,  Mineo Kawamoto ,  Yoichi Matsuda ,  Motoyo Wajima ,  Hirosada Morishita

IPC分类号： C23C18/16 ,  H05K3/18 ,  C23C3/02 ,  H01B5/14

CPC分类号： H05K3/185 ,  C23C18/1605

摘要： Highly precise wiring formed on an insulating substrate can be obtained by electroless deposition without using a printing process. Said process is characterized by forming an adhesive layer containing a photo-setting substance on a substrate, exposing the adhesive layer to actinic light imagewisely so as to irradiate only portions other than those forming wiring, treating the surface of the substrate with a roughening solution so as to roughen the portions not exposed to actinic light, and subjecting to the conventional treatments for electroless deposition so as to form prescribed wiring on the portions not exposed to actinic light.

摘要翻译： 在绝缘基板上形成的高精度布线可以通过无电沉积而不使用印刷工艺获得。 所述方法的特征在于，在基材上形成含有光固化物质的粘合剂层，将粘合剂层成像曝光于光化反射光，以仅照射形成布线的部分以外的部分，以粗糙化溶液处理基材表面 以使不暴露于光化光的部分粗糙化，并进行常规的无电沉积处理，以便在不暴露于光化的光的部分上形成规定的布线。