摘要:
A method for reducing noise in a lapping guide. Selected portions of a magnetoresistive device wafer are bombarded with ions such that a magnetoresistive effect of lapping guides is reduced. The device is lapped, using the lapping guides to measure an extent of the lapping.
摘要:
A method for reducing noise in a lapping guide. Selected portions of a Giant magnetoresistive device wafer are masked, thereby defining masked and unmasked regions of the wafer in which the unmasked regions include lapping guides. The wafer is bombarded with ions such that a Giant magnetoresistive effect of the unmasked regions is reduced. The GMR device is lapped, using the lapping guides to measure an extent of the lapping
摘要:
An apparatus and method of lapping of rows of magnetic recording heads uses multiple fluid-filled ports with variable pressure against a flexible adhesive tape to secure to and support the row. The tape provides the necessary tangential restraining force to drag the workpiece along a lapping plate. The multiple ports beneath the tape provide the necessary normal force to press the workpiece against the lapping plate to allow lapping to occur. The amount of material removal from the row is varied by adjusting the pressure in the ports such that higher pressure is applied to those heads with higher stripe height, and lower pressure is applied to recording heads with lower stripe height. To set or adjust the port pressures, measurements of the read sensor resistance are taken to calculate the stripe height. The stripe height is roughly proportional to the reciprocal of resistance.
摘要:
A magneto-resistive device with built-in test structure. The magneto-resistive device includes a slider having first and second lower termination pads and first and second upper termination pads. A first conductive trace element electrically couples the first lower termination pad to the first upper termination pad and a second conductive trace element electrically couples the second lower termination pad to said second upper termination pad. The magneto-resistive device also includes a magneto-resistive transducer deposited on the slider and the resistance of the magneto-resistive transducer is obtained by passing an electrical current between the first and second lower termination pads and measuring a voltage across the first and second upper termination pads.
摘要:
An in-situ (result-directed/predictive) MR stripe height calibration method capable of operating on the fly during lapping operation. The method involves utilization of an interval sampling technique, which provides a high number of data points. The data provided are filtered and averaged at each kerf location to provide a much higher calibration accuracy than previously available. The primary advantage is to create an accurate relationship between MR element resistance and its stripe height while the MR element is being lapped. The method thus provides the ability to target either resistance or stripe height or a combination of both during the lapping process. Finally, the system is completely self-contained and does not required wafer data.
摘要:
Disclosed is an apparatus and method for calibrating the deposition windage of deposited thin film resistive elements, such as magnetoresistive read elements for magnetic heads which are to be lapped, comprising one set of at least three resistive elements having different nominal height dimensions, a resistance detector for measuring the resistance of each of the resistive elements, and a windage calculator responsive to the nominal height dimensions and to the measured resistances of each of the resistive elements for calculating the windage of the one set of resistive elements.
摘要:
A method for determining the position of a lapped edge of a substrate during lapping of a row of thin film magnetic transducer elements. First and second electrical lapping guide structures are formed on each side of the row of transducer elements. The lapping guide structures include a series of switching junctions, each switching junction paralleled by a resistor. A lapping resistor which provides a change in resistance proportional to the lapping of the row is measured and compared with the position of the lapping plane as determined from each switching junction change of state. Calibration of the resistor versus lapping plane position is effected to permit an accurate determination of the lapped surface from subsequent resistance measurements of the lapping resistor.
摘要:
A thin film magnetic head assembly has a multi-turn electrical conducting coil, which is formed by deposition in an elliptical pattern. By virtue of the elliptical pattern, the coil turn portions between the back gap closure and transducing gap of the thin film head are relatively narrow, whereas the coil turn portions furthest from the transducing gap are widest. Corners and sharp ends are eliminated. Electrical resistance effects are thereby minimized and signal output is enhanced.
摘要:
An integrated read/write head assembly incorporates a thin film inductive write head subassembly comprising first and second pole pieces that define a write transducing gap, and a magnetoresistive read subassembly disposed in the write gap. The first write pole piece is extended so as to provide a planar conductive path from the terminal connections or studs to the magnetoresistive read subassembly, thereby forming a uniform surface for deposition of the magnetoresistive read subassembly.
摘要:
A dual element electrical lapping guide system is disclosed for a row of multi-layer dual element magnetoresistive and inductive magnetic transducers formed on a substrate, which will be used to form sliders, the sliders being separated by separation kerfs, and the multi-layer transducers aligned along an edge of the substrate for lapping of the edge. The dual element lapping guide system comprises superposed resistive elements and electrical switch elements, each positioned in one of the separation kerfs, and having an edge thereof positioned so as to be aligned with the edge of the row and subject to lapping of the row. Each electrical switch element comprises a bottom and a top layer connected at one end thereof and separated at the other end thereof by an insulation layer, so as to be initially closed at the connected end, which end is aligned with the edge of the multi-layer transducers and subject to lapping of the row at the connected end to open the switch element.