THERMOELECTRIC GENERATING UNIT AND METHODS OF MAKING AND USING SAME
    1.
    发明申请
    THERMOELECTRIC GENERATING UNIT AND METHODS OF MAKING AND USING SAME 审中-公开
    热电发生单元及其制造和使用方法

    公开(公告)号:US20170062690A1

    公开(公告)日:2017-03-02

    申请号:US14872681

    申请日:2015-10-01

    CPC classification number: H01L35/32 H01L35/02 H01L35/30 H01L35/34

    Abstract: A thermoelectric generating unit includes a hot-side heat exchanger (HHX) including one or more discrete channels and substantially flat first and second cold-side plates. A first plurality of thermoelectric devices are between the first cold-side plate and a first side of the HHX; and a second plurality of thermoelectric devices can be between the second cold-side plate and a second side of the HHX. Fasteners can extend between the first and second cold-side plates at locations outside of the HHX channel(s). The fasteners can be disposed within gaps between the thermoelectric devices of the first plurality and within gaps between the thermoelectric devices of the second plurality. The fasteners can compress the first plurality of thermoelectric devices between the first cold-side plate and the first side of the HHX and can compress the second plurality of thermoelectric devices between the second cold-side plate and the second side of the HHX.

    Abstract translation: 热电发生单元包括:热侧热交换器(HHX),其包括一个或多个离散通道和基本平坦的第一和第二冷侧板。 第一多个热电装置位于第一冷侧板和HHX的第一侧之间; 并且第二多个热电装置可以位于第二冷侧板和HHX的第二侧之间。 紧固件可以在HHX通道外的位置处在第一和第二冷侧板之间延伸。 紧固件可以设置在第一多个的热电装置之间的间隙内,并且可以设置在第二多个热电装置之间的间隙内。 紧固件可以压缩第一冷侧板和HHX的第一侧之间的第一多个热电装置,并且可压缩在第二冷侧板和HHX的第二侧之间的第二多个热电装置。

    Method and structure for thermoelectric unicouple assembly

    公开(公告)号:US09203011B2

    公开(公告)日:2015-12-01

    申请号:US13947400

    申请日:2013-07-22

    Abstract: Method for assembling thermoelectric unicouples is provided and applied with silicon-based nanostructure thermoelectric legs. The method includes preparing and disposing both n-type and p-type thermoelectric material blocks in alternative columns on a first shunt material. The method includes a sequence of cutting processes to resize the thermoelectric material blocks to form multiple singulated unicouples each having an n-type thermoelectric leg and a p-type thermoelectric leg bonded to a section of the first shunt material. Additionally, the method includes re-disposing these singulated unicouples in a serial daisy chain configuration with a predetermined pitch distance and bonding a second shunt material on top. The method further includes performing additional cutting processes to form one or more daisy chains of thermoelectric unicouples. The first shunt material is coupled to a cold-side heat sink and the second shunt material is coupled to a hot-side heat sink.

    BULK-SIZE NANOSTRUCTURED MATERIALS AND METHODS FOR MAKING THE SAME BY SINTERING NANOWIRES
    5.
    发明申请
    BULK-SIZE NANOSTRUCTURED MATERIALS AND METHODS FOR MAKING THE SAME BY SINTERING NANOWIRES 审中-公开
    大尺寸纳米结构材料及其制备方法

    公开(公告)号:US20140116491A1

    公开(公告)日:2014-05-01

    申请号:US14062803

    申请日:2013-10-24

    CPC classification number: H01L35/22 B82B3/0014 B82Y30/00 H01L35/34

    Abstract: Thermoelectric solid material and method thereof. The thermoelectric solid material includes a plurality of nanowires. Each nanowire of the plurality of nanowires corresponds to an aspect ratio (e.g., a ratio of a length of a nanowire to a diameter of the nanowire) equal to or larger than 10, and each nanowire of the plurality of nanowires is chemically bonded to one or more other nanowires at at least two locations of the each nanowire.

    Abstract translation: 热电固体材料及其制造方法。 热电固体材料包括多个纳米线。 多个纳米线的每个纳米线对应于等于或大于10的纵横比(例如,纳米线的长度与纳米线的直径的比),并且多个纳米线的每个纳米线化学键合到一个 或更多的其它纳米线在每个纳米线的至少两个位置。

    SILICON-BASED THERMOELECTRIC MATERIALS INCLUDING ISOELECTRONIC IMPURITIES, THERMOELECTRIC DEVICES BASED ON SUCH MATERIALS, AND METHODS OF MAKING AND USING SAME
    6.
    发明申请
    SILICON-BASED THERMOELECTRIC MATERIALS INCLUDING ISOELECTRONIC IMPURITIES, THERMOELECTRIC DEVICES BASED ON SUCH MATERIALS, AND METHODS OF MAKING AND USING SAME 审中-公开
    基于含硅材料的热电材料,基于这种材料的热电设备,以及制造和使用它们的方法

    公开(公告)号:US20140360546A1

    公开(公告)日:2014-12-11

    申请号:US14297444

    申请日:2014-06-05

    CPC classification number: H01L35/22

    Abstract: Silicon-based thermoelectric materials including isoelectronic impurities, thermoelectric devices based on such materials, and methods of making and using same are provided. According to one embodiment, a thermoelectric material includes silicon and one or more isoelectronic impurity atoms selected from the group consisting of carbon, tin, and lead disposed within the silicon in an amount sufficient to scatter thermal phonons propagating through the silicon and below a saturation limit of the one or more isoelectronic impurity atoms in the silicon. In one example, the thermoelectric material also includes germanium atoms disposed within the silicon in an amount sufficient to scatter thermal phonons propagating through the silicon and below a saturation limit of germanium in the silicon. Each of the one or more isoelectronic impurity atoms and the germanium atoms can independently substitute for a silicon atom or can be disposed within an interstice of the silicon.

    Abstract translation: 提供了包括等电子杂质的硅基热电材料,基于这种材料的热电装置及其制造和使用方法。 根据一个实施例,热电材料包括硅和一个或多个选自碳,锡和铅中的等电子杂质原子,其中硅,锡和铅以足以散射通过硅传播的热声子并低于饱和极限的量 的硅中的一个或多个等电子杂质原子。 在一个实例中,热电材料还包括设置在硅内的锗原子,其量足以散射通过硅传播的热声子并且低于硅中的锗的饱和极限。 一个或多个等电子杂质原子和锗原子中的每一个可以独立地代替硅原子,或者可以设置在硅的空隙内。

    LOW THERMAL CONDUCTIVITY MATRICES WITH EMBEDDED NANOSTRUCTURES AND METHODS THEREOF
    7.
    发明申请
    LOW THERMAL CONDUCTIVITY MATRICES WITH EMBEDDED NANOSTRUCTURES AND METHODS THEREOF 有权
    具有嵌入式纳米结构的低热导率矩阵及其方法

    公开(公告)号:US20140193982A1

    公开(公告)日:2014-07-10

    申请号:US14203360

    申请日:2014-03-10

    CPC classification number: H01L21/02225 B82Y40/00 H01L21/02112 H01L35/26

    Abstract: A matrix with at least one embedded array of nanowires and method thereof. The matrix includes nanowires and one or more fill materials located between the nanowires. Each of the nanowires including a first end and a second end. The nanowires are substantially parallel to each other and are fixed in position relative to each other by the one or more fill materials. Each of the one or more fill materials is associated with a thermal conductivity less than 50 Watts per meter per degree Kelvin. And, the matrix is associated with at least a sublimation temperature and a melting temperature, the sublimation temperature and the melting temperature each being above 350° C.

    Abstract translation: 具有至少一个纳米线嵌入阵列的矩阵及其方法。 该基质包括位于纳米线之间的纳米线和一个或多个填充材料。 每个纳米线包括第一端和第二端。 纳米线基本上彼此平行并且通过一个或多个填充材料相对于彼此固定在适当的位置。 一种或多种填充材料中的每一种与导热率相关联,导热率小于每瓦开度50瓦特。 而且,该基质至少升华温度和熔融温度,升华温度和熔融温度均高于350℃。

    STRUCTURES AND METHODS FOR MULTI-LEG PACKAGE THERMOELECTRIC DEVICES
    8.
    发明申请
    STRUCTURES AND METHODS FOR MULTI-LEG PACKAGE THERMOELECTRIC DEVICES 审中-公开
    多级封装热电装置的结构和方法

    公开(公告)号:US20140182644A1

    公开(公告)日:2014-07-03

    申请号:US14053452

    申请日:2013-10-14

    CPC classification number: H01L35/325 H01L35/34 H05B3/265

    Abstract: Thermoelectric device with a multi-leg package and method thereof. The thermoelectric device includes a first ceramic base structure including a first surface and a second surface, and a first plurality of pads including one or more first materials thermally and electrically conductive. The first plurality of pads are attached to the first surface. Additionally, the thermoelectric device includes a second plurality of pads including the one or more first materials. The second plurality of pads are attached to the second surface and arranged in a mirror image with the first plurality of pads. Moreover, the thermoelectric device includes a plurality of thermoelectric legs attached to the first plurality of pads respectively. Each pad of the first plurality of pads is attached to at least two first thermoelectric legs of the plurality of thermoelectric legs.

    Abstract translation: 具有多腿包装的热电装置及其方法。 热电装置包括包括第一表面和第二表面的第一陶瓷基底结构以及包括一种或多种第一材料的导电和导电的第一多个焊盘。 第一组多个垫连接到第一表面。 另外,热电装置包括包括一个或多个第一材料的第二多个焊盘。 所述第二多个焊盘附接到所述第二表面并且与所述第一多个焊盘一起布置成镜像。 此外,热电装置包括分别附接到第一多个焊盘的多个热电支脚。 第一多个焊盘中的每个焊盘附接到多个热电支腿的至少两个第一热电支腿。

    Method and structure for thermoelectric unicouple assembly
    10.
    发明授权
    Method and structure for thermoelectric unicouple assembly 有权
    热电联合组件的方法和结构

    公开(公告)号:US09257627B2

    公开(公告)日:2016-02-09

    申请号:US13947400

    申请日:2013-07-22

    CPC classification number: H01L35/34 H01L27/16

    Abstract: Method for assembling thermoelectric unicouples is provided and applied with silicon-based nanostructure thermoelectric legs. The method includes preparing and disposing both n-type and p-type thermoelectric material blocks in alternative columns on a first shunt material. The method includes a sequence of cutting processes to resize the thermoelectric material blocks to form multiple singulated unicouples each having an n-type thermoelectric leg and a p-type thermoelectric leg bonded to a section of the first shunt material. Additionally, the method includes re-disposing these singulated unicouples in a serial daisy chain configuration with a predetermined pitch distance and bonding a second shunt material on top. The method further includes performing additional cutting processes to form one or more daisy chains of thermoelectric unicouples. The first shunt material is coupled to a cold-side heat sink and the second shunt material is coupled to a hot-side heat sink.

    Abstract translation: 提供了组装热电单体的方法,并应用了硅基纳米结构热电腿。 该方法包括在第一分流材料上制备和设置替代列中的n型和p型热电材料块。 该方法包括一系列切割过程,以调整热电材料块的尺寸以形成多个分离的单体,其中每一个具有n型热电支脚和p型热电支脚,该p型热电支脚连接到第一分流材料的一部分。 此外,该方法包括以预定的间距距离重新布置串联菊花链配置中的这些单独的单组合,并将第二分路材料粘结在顶部。 该方法还包括执行附加的切割处理以形成热电单体的一个或多个菊花链。 第一分流材料耦合到冷侧散热器,并且第二分流材料耦合到热侧散热器。

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