公开(公告)号：US20200016557A1

公开(公告)日：2020-01-16

申请号：US15764311

申请日：2017-04-07

申请人： Andre BRÜNING ,  Andreas SAUER ,  Applied Materials, Inc.

发明人： Andre BRÜNING ,  Andreas SAUER

IPC分类号： B01J3/02 ,  C23C14/12 ,  C23C14/24 ,  C23C14/56 ,  H01L51/56

摘要： A supply line guide for guiding a plurality of supply lines in a vacuum chamber of a processing system is described. The supply line guide includes a guiding arrangement including a plurality of connected elements, wherein the connected elements are angle-adjustable relative to each other. Further, the supply line guide includes a flexible tube provided around the guiding arrangement.

公开(公告)号：US20120048186A1

公开(公告)日：2012-03-01

申请号：US12875213

申请日：2010-09-03

申请人： Andre Brüning ,  Oliver Heimel ,  Reiner Hinterschuster ,  Hans Georg Wolf

发明人： Andre Brüning ,  Oliver Heimel ,  Reiner Hinterschuster ,  Hans Georg Wolf

IPC分类号： B05C13/00 ,  B23P19/00

CPC分类号： C23C14/50 ,  C03C17/002 ,  Y10T29/49826 ,  Y10T29/49963

摘要： Carriers for substrates and to methods for assembling the same in the field of vacuum deposition of thin films. In particular, a carrier for a substrate to be coated in a vacuum chamber includes a first frame comprising two vertical sections and two horizontal sections being dimensioned to surround the substrate; a second dimensioned to define an area of the substrate to be coated, and to cover at least a first part of the first frame to prevent the first part of the first frame from being coated when the second frame is mounted to the first frame. The second frame is detachably mounted to the first frame.

摘要翻译： 基板载体及其在薄膜真空沉积领域的组装方法。 特别地，用于涂覆在真空室中的基底的载体包括包括两个垂直部分和两个水平部分的第一框架，其尺寸被设计成围绕基底; 第二尺寸设置成限定待涂覆的基底的区域，并且当第二框架安装到第一框架时，覆盖第一框架的至少第一部分以防止第一框架的第一部分被涂覆。 第二框架可拆卸地安装到第一框架。

公开(公告)号：US20180171466A1

公开(公告)日：2018-06-21

申请号：US15737442

申请日：2015-07-06

申请人： Stefan KELLER ,  Andre BRÜNING ,  Uwe SCHÜßLER ,  Thomas Werner ZILBAUER ,  Stefan BANGERT ,  Applied Materials, Inc.

发明人： Stefan KELLER ,  Andre BRÜNING ,  Uwe SCHÜßLER ,  Thomas Werner ZILBAUER ,  Stefan BANGERT

IPC分类号： C23C14/50 ,  C23C14/34 ,  H01J37/32 ,  H01J37/34 ,  H01M10/052

CPC分类号： C23C14/50 ,  C23C14/34 ,  C23C14/562 ,  C23C14/564 ,  H01J37/32715 ,  H01J37/34 ,  H01M10/052 ,  H01M10/0562

摘要： A carrier for supporting at least one substrate during a sputter deposition process is provided. The carrier includes a carrier body and an insulating portion provided at the carrier body. The insulating portion provides a surface of an electrically insulating material, wherein the surface is configured to face one or more sputter deposition sources during the sputter deposition process.