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公开(公告)号：US08758659B2
公开(公告)日：2014-06-24
申请号：US12893666
申请日：2010-09-29
申请人： Paul Lefevre , Oscar K. Hsu , David Adam Wells , John Erik Aldeborgh , Marc C. Jin , Guangwei Wu , Anoop Mathew
发明人： Paul Lefevre , Oscar K. Hsu , David Adam Wells , John Erik Aldeborgh , Marc C. Jin , Guangwei Wu , Anoop Mathew
IPC分类号： B24D18/00
CPC分类号： B24B37/205 , B24B37/26 , B24D18/00
摘要： A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L1) at the surface to a second land length (L2) at the surface, wherein the second land length (L2) is less than the first land length (L1) and the grooves have a second width (W2) wherein (W1)≦(X)(W2), wherein (X) has a value in the range of 0.01 to 0.75.
摘要翻译： 一种形成化学机械抛光垫的方法。 该方法包括聚合一种或多种聚合物前体并形成包括表面的化学机械平面化焊盘，在表面之间形成限定凹槽之间的焊盘的凹槽，其中沟槽具有第一宽度，并使焊盘从第一焊盘长度 （L2），其中，所述第二焊盘长度（L2）小于所述第一焊盘长度（L1），并且所述槽具有第二宽度（W2），其中，（W1）＆nlE ;（X）（W2），其中（X）的值在0.01至0.75的范围内。
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公开(公告)号：US08435099B2
公开(公告)日：2013-05-07
申请号：US12694593
申请日：2010-01-27
申请人： Paul Lefevre , Anoop Mathew , Guangwei Wu , David Adam Wells , Oscar K. Hsu , Xuechan Zhao
发明人： Paul Lefevre , Anoop Mathew , Scott Xin Qiao , Guangwei Wu , David Adam Wells , Oscar K. Hsu
IPC分类号： B24D11/00
摘要： An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.
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公开(公告)号：US08377351B2
公开(公告)日：2013-02-19
申请号：US12244513
申请日：2008-10-02
申请人： Paul Lefevre , David Adam Wells , Marc C. Jin , Oscar K. Hsu , John Erik Aldeborgh , Scott Xin Qiao , Anoop Mathew , Guangwei Wu
发明人： Paul Lefevre , David Adam Wells , Marc C. Jin , Oscar K. Hsu , John Erik Aldeborgh , Scott Xin Qiao , Anoop Mathew , Guangwei Wu
IPC分类号： B29C44/34
CPC分类号： B24B37/24 , Y10T428/249953 , Y10T428/249978
摘要： A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.
摘要翻译： 提供了化学机械平面化抛光垫，其包括分散在聚合物内的元素网络，形成在垫中的多个空隙，并且所述元件网络的至少一部分连接到空隙的至少一部分。 还公开了一种形成垫的方法，其包括提供组合物，所述组合物包含元素网络和聚合物或反应性预聚物中的至少一种，将气体引入所述组合物并使用所述气体产生多个 组合物中的空隙。 还公开了一种形成空隙的方法，其依赖于向聚合物或反应性聚合物内的元素网络施加力，随后除去力和空隙形成。
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公开(公告)号：US20120073210A1
公开(公告)日：2012-03-29
申请号：US12893666
申请日：2010-09-29
申请人： Paul LEFEVRE , Oscar K. HSU , David Adam WELLS , John Erik ALDEBORGH , Marc C. JIN , Guangwei WU , Anoop MATHEW
发明人： Paul LEFEVRE , Oscar K. HSU , David Adam WELLS , John Erik ALDEBORGH , Marc C. JIN , Guangwei WU , Anoop MATHEW
IPC分类号： B24D3/00
CPC分类号： B24B37/205 , B24B37/26 , B24D18/00
摘要： A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L1) at the surface to a second land length (L2) at the surface, wherein the second land length (L2) is less than the first land length (L1) and the grooves have a second width (W2) wherein (W1)≦(X)(W2), wherein (X) has a value in the range of 0.01 to 0.75.
摘要翻译： 一种形成化学机械抛光垫的方法。 该方法包括聚合一种或多种聚合物前体并形成包括表面的化学机械平面化焊盘，在表面之间形成限定凹槽之间的焊盘的凹槽，其中沟槽具有第一宽度，并使焊盘从第一焊盘长度 （L2），其中，所述第二焊盘长度（L2）小于所述第一焊盘长度（L1），并且所述槽具有第二宽度（W2），其中，（W1）＆nlE ;（X）（W2），其中（X）的值在0.01至0.75的范围内。
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5.发明申请公开(公告)号：US20100221985A1
公开(公告)日：2010-09-02
申请号：US12694593
申请日：2010-01-27
申请人： Paul LEFEVRE , Anoop MATHEW , Scott Xin QIAO , Xuechan Zhao , Guangwei WU , David Adam WELLS , Oscar K. HSU
发明人： Paul LEFEVRE , Anoop MATHEW , Scott Xin QIAO , Xuechan Zhao , Guangwei WU , David Adam WELLS , Oscar K. HSU
摘要： An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.
摘要翻译： 本公开的一个方面涉及包括第一结构域和第二连续结构域的化学机械平面化焊盘，其中第一结构域包括在第二连续域内规则间隔开的分立元件。 垫可以通过在垫的第二连续区域内形成用于第一区域的多个开口形成，其中开口在第二区域内规则地间隔开，并且在第二连续域中的多个开口内形成第一区域。 此外，可以使用抛光浆料抛光衬底。
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公开(公告)号：US20090246504A1
公开(公告)日：2009-10-01
申请号：US12244513
申请日：2008-10-02
申请人： Paul LEFEVRE , David Adam WELLS , Marc C. JIN , Oscar K. HSU , John Erik ALDEBORGH , Scott Xin Qiao , Anoop Mathew , Guangwei Wu
发明人： Paul LEFEVRE , David Adam WELLS , Marc C. JIN , Oscar K. HSU , John Erik ALDEBORGH , Scott Xin Qiao , Anoop Mathew , Guangwei Wu
CPC分类号： B24B37/24 , Y10T428/249953 , Y10T428/249978
摘要： A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.
摘要翻译： 提供了化学机械平面化抛光垫，其包括分散在聚合物内的元素网络，形成在垫中的多个空隙，并且所述元件网络的至少一部分连接到空隙的至少一部分。 还公开了一种形成垫的方法，其包括提供组合物，所述组合物包含元素网络和聚合物或反应性预聚物中的至少一种，将气体引入所述组合物并使用所述气体产生多个 组合物中的空隙。 还公开了一种形成空隙的方法，其依赖于向聚合物或反应性聚合物内的元素网络施加力，随后除去力和空隙形成。
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公开(公告)号：US08684794B2
公开(公告)日：2014-04-01
申请号：US12185737
申请日：2008-08-04
申请人： Paul Lefevre , Oscar K. Hsu , David Adam Wells , Scott Xin Qiao , Anoop Mathew , Guangwei Wu
发明人： Paul Lefevre , Oscar K. Hsu , David Adam Wells , Scott Xin Qiao , Anoop Mathew , Guangwei Wu
CPC分类号： B24D18/0009 , B24B37/24 , B24D3/26
摘要： A polishing pad and a method of producing a polishing pad. The method includes providing a mold, having a first cavity and a second cavity, wherein the first cavity defines a recess, providing a polymer matrix material including void forming elements in the recess, forming a polishing pad and removing at least a portion of the elements from the polishing pad forming void spaces within the polishing pad by one of a chemical method or mechanical method, prior to use in chemical/mechanical planarization procedures.
摘要翻译： 抛光垫及抛光垫的制造方法。 该方法包括提供具有第一腔体和第二腔体的模具，其中第一空腔限定凹部，提供在凹部中包括空隙形成元件的聚合物基体材料，形成抛光垫并移除元件的至少一部分 在抛光垫之前，通过化学方法或机械方法之一在化学/机械平面化方法中使用之前在抛光垫中形成空隙。
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公开(公告)号：US20100221983A1
公开(公告)日：2010-09-02
申请号：US12652143
申请日：2010-01-05
申请人： Paul LEFEVRE , Anoop MATHEW , Guangwei WU , Scott Xin QIAO , Oscar K. HSU , David Adam WELLS , John Erik ALDEBORGH , Marc C. JIN , Xuechan Zhao
发明人： Paul LEFEVRE , Anoop MATHEW , Guangwei WU , Scott Xin QIAO , Oscar K. HSU , David Adam WELLS , John Erik ALDEBORGH , Marc C. JIN , Xuechan Zhao
摘要： The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.
摘要翻译： 本公开涉及化学机械平面化焊盘和制造和使用化学机械平面化焊盘的方法。 化学机械平面化焊盘可以包括第一组分，其包含在水中的溶解度小于水溶性组合物的水溶性组合物和水不溶性组合物，其中第一组分的水溶性和水不溶性组合物中的至少一种 由纤维形成。 化学机械平面化焊盘还可以包括第二部件，其中第一部件作为第二部件的连续的离散相存在。
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公开(公告)号：US08790165B2
公开(公告)日：2014-07-29
申请号：US12652143
申请日：2010-01-05
申请人： Paul Lefevre , Anoop Mathew , Guangwei Wu , Oscar K. Hsu , David Adam Wells , John Erik Aldeborgh , Marc C. Jin , Xuechan Zhao
发明人： Paul Lefevre , Anoop Mathew , Guangwei Wu , Scott Xin Qiao , Oscar K. Hsu , David Adam Wells , John Erik Aldeborgh , Marc C. Jin
IPC分类号： B24D11/00
摘要： The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.
摘要翻译： 本公开涉及化学机械平面化焊盘和制造和使用化学机械平面化焊盘的方法。 化学机械平面化焊盘可以包括第一组分，其包含在水中的溶解度小于水溶性组合物的水溶性组合物和水不溶性组合物，其中第一组分的水溶性和水不溶性组合物中的至少一种 由纤维形成。 化学机械平面化焊盘还可以包括第二部件，其中第一部件作为第二部件的连续的离散相存在。
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