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公开(公告)号：US08491360B2
公开(公告)日：2013-07-23
申请号：US12256886
申请日：2008-10-23
IPC分类号： B24D3/34
CPC分类号： B24B37/24
摘要： The present disclosure is directed at a chemical-mechanical planarization polishing pad comprising interconnecting elements and a polymer filler material, wherein the interconnecting elements include interconnecting junction points that are present at a density of 1 interconnecting junction point/cm3 to 1000 interconnecting junction points/cm3, and wherein the interconnecting elements have a length between interconnection junction points of 0.1 microns to 20 cm.
摘要翻译： 本公开涉及包括互连元件和聚合物填充材料的化学机械平面化抛光垫，其中互连元件包括以1个互连连接点/ cm 3至1000个互连连接点/ cm 3的密度存在的互连连接点 并且其中所述互连元件具有0.1微米至20厘米的互连连接点之间的长度。
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公开(公告)号：US08377351B2
公开(公告)日：2013-02-19
申请号：US12244513
申请日：2008-10-02
申请人： Paul Lefevre , David Adam Wells , Marc C. Jin , Oscar K. Hsu , John Erik Aldeborgh , Scott Xin Qiao , Anoop Mathew , Guangwei Wu
发明人： Paul Lefevre , David Adam Wells , Marc C. Jin , Oscar K. Hsu , John Erik Aldeborgh , Scott Xin Qiao , Anoop Mathew , Guangwei Wu
IPC分类号： B29C44/34
CPC分类号： B24B37/24 , Y10T428/249953 , Y10T428/249978
摘要： A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.
摘要翻译： 提供了化学机械平面化抛光垫，其包括分散在聚合物内的元素网络，形成在垫中的多个空隙，并且所述元件网络的至少一部分连接到空隙的至少一部分。 还公开了一种形成垫的方法，其包括提供组合物，所述组合物包含元素网络和聚合物或反应性预聚物中的至少一种，将气体引入所述组合物并使用所述气体产生多个 组合物中的空隙。 还公开了一种形成空隙的方法，其依赖于向聚合物或反应性聚合物内的元素网络施加力，随后除去力和空隙形成。
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公开(公告)号：US20120073210A1
公开(公告)日：2012-03-29
申请号：US12893666
申请日：2010-09-29
申请人： Paul LEFEVRE , Oscar K. HSU , David Adam WELLS , John Erik ALDEBORGH , Marc C. JIN , Guangwei WU , Anoop MATHEW
发明人： Paul LEFEVRE , Oscar K. HSU , David Adam WELLS , John Erik ALDEBORGH , Marc C. JIN , Guangwei WU , Anoop MATHEW
IPC分类号： B24D3/00
CPC分类号： B24B37/205 , B24B37/26 , B24D18/00
摘要： A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L1) at the surface to a second land length (L2) at the surface, wherein the second land length (L2) is less than the first land length (L1) and the grooves have a second width (W2) wherein (W1)≦(X)(W2), wherein (X) has a value in the range of 0.01 to 0.75.
摘要翻译： 一种形成化学机械抛光垫的方法。 该方法包括聚合一种或多种聚合物前体并形成包括表面的化学机械平面化焊盘，在表面之间形成限定凹槽之间的焊盘的凹槽，其中沟槽具有第一宽度，并使焊盘从第一焊盘长度 （L2），其中，所述第二焊盘长度（L2）小于所述第一焊盘长度（L1），并且所述槽具有第二宽度（W2），其中，（W1）＆nlE ;（X）（W2），其中（X）的值在0.01至0.75的范围内。
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公开(公告)号：US20090137121A1
公开(公告)日：2009-05-28
申请号：US12256886
申请日：2008-10-23
IPC分类号： H01L21/306 , B24D3/34 , B24D11/00 , B24D18/00
CPC分类号： B24B37/24
摘要： The present disclosure is directed at a chemical-mechanical planarization polishing pad comprising interconnecting elements and a polymer filler material, wherein the interconnecting elements include interconnecting junction points that are present at a density of 1 interconnecting junction point/cm3 to 1000 interconnecting junction points/cm3, and wherein the interconnecting elements have a length between interconnection junction points of 0.1 microns to 20 cm.
摘要翻译： 本公开涉及包括互连元件和聚合物填充材料的化学机械平面化抛光垫，其中互连元件包括以1个互连连接点/ cm 3至1000个互连连接点/ cm 3的密度存在的互连连接点 并且其中所述互连元件具有0.1微米至20厘米的互连连接点之间的长度。
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公开(公告)号：US08430721B2
公开(公告)日：2013-04-30
申请号：US12347788
申请日：2008-12-31
IPC分类号： B24D11/00
CPC分类号： B24B37/22 , B24B37/24 , B24D11/001 , B24D18/0009
摘要： The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.
摘要翻译： 本发明涉及抛光垫。 抛光垫可以包括其中具有三维网状物的聚合物层和复合层，该复合层具有使垫片表面上的压力相等的能力，包括第一粘合剂，其中当压缩时，复合材料表现出1至500psi的静液压模量 压力为1至50 psi。
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公开(公告)号：US20120178348A1
公开(公告)日：2012-07-12
申请号：US13422165
申请日：2012-03-16
摘要： A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.
摘要翻译： 本文提供了一种抛光垫，其可以包括直径在约5至80微米范围内的多种可溶性纤维和不溶性组分。 衬垫还可以具有包括具有多个微槽的第一表面，其中可溶性纤维形成衬垫中的微槽。 微槽可以具有高达约150微米的宽度和/或深度。 此外，公开了一种形成抛光垫的方法以及用抛光垫抛光表面的方法。
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公开(公告)号：US20100221983A1
公开(公告)日：2010-09-02
申请号：US12652143
申请日：2010-01-05
申请人： Paul LEFEVRE , Anoop MATHEW , Guangwei WU , Scott Xin QIAO , Oscar K. HSU , David Adam WELLS , John Erik ALDEBORGH , Marc C. JIN , Xuechan Zhao
发明人： Paul LEFEVRE , Anoop MATHEW , Guangwei WU , Scott Xin QIAO , Oscar K. HSU , David Adam WELLS , John Erik ALDEBORGH , Marc C. JIN , Xuechan Zhao
摘要： The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.
摘要翻译： 本公开涉及化学机械平面化焊盘和制造和使用化学机械平面化焊盘的方法。 化学机械平面化焊盘可以包括第一组分，其包含在水中的溶解度小于水溶性组合物的水溶性组合物和水不溶性组合物，其中第一组分的水溶性和水不溶性组合物中的至少一种 由纤维形成。 化学机械平面化焊盘还可以包括第二部件，其中第一部件作为第二部件的连续的离散相存在。
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公开(公告)号：US08900036B2
公开(公告)日：2014-12-02
申请号：US13422165
申请日：2012-03-16
摘要： A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.
摘要翻译： 本文提供了一种抛光垫，其可以包括直径在约5至80微米范围内的多种可溶性纤维和不溶性组分。 衬垫还可以具有包括具有多个微槽的第一表面，其中可溶性纤维形成衬垫中的微槽。 微槽可以具有高达约150微米的宽度和/或深度。 此外，公开了一种形成抛光垫的方法以及用抛光垫抛光表面的方法。
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公开(公告)号：US08172648B2
公开(公告)日：2012-05-08
申请号：US12347734
申请日：2008-12-31
CPC分类号： B24B37/24 , B24B37/042 , B24D3/346
摘要： The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomeration and a binder. The pad includes a surface such that as the pad is abraded the surface is renewed exposing at least a portion of the chemical agent.
摘要翻译： 本公开内容涉及一种抛光垫，其包括在化学机械平面化期间足以释放并溶解到水性磨料颗粒抛光介质中并减少磨料颗粒团聚和粘合剂的量的化学试剂。 垫包括表面，使得当垫被磨损时，表面被更新暴露至少一部分化学试剂。
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10.发明授权公开(公告)号：US07985121B2
公开(公告)日：2011-07-26
申请号：US12179359
申请日：2008-07-24
IPC分类号： B24B49/12
CPC分类号： B24B37/205 , B29C70/467
摘要： A chemical mechanical polishing pad. The pad includes a surface and a polymer matrix capable of transmitting at least a portion of incident radiation. In addition, at least one embedded structure in the polymer matrix, including a portion of the pad where the embedded structure is not present, and a window integral to the pad defined by the portion of the pad where the embedded structure is not present.
摘要翻译： 化学机械抛光垫。 垫包括能够透射入射辐射的至少一部分的表面和聚合物基质。 此外，聚合物矩阵中的至少一个嵌入结构，包括不存在嵌入结构的垫的一部分，以及由衬垫的不存在嵌入结构的部分限定的与该垫整体的窗口。
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