公开(公告)号：US06506664B1

公开(公告)日：2003-01-14

申请号：US09541995

申请日：2000-04-03

申请人： Eric Beyne ,  Augustin Coella-Vera

发明人： Eric Beyne ,  Augustin Coella-Vera

IPC分类号： H01L21322

CPC分类号： H01L25/50 ,  H01L21/6835 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06593 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00

摘要： The present invention provides a method of transfer of a first planar substrate with two major surfaces to a second substrate, comprising the steps of: forming the first planar substrate, attaching one of the major surfaces of the first planar substrate to a carrier by means of a release layer; attaching the other major surface of the first substrate to the second substrate with a curable polymer adhesive layer; partly curing the polymer adhesive layer, disconnecting the release layer from the first substrate to separate the first substrate from the camer, followed by coing the polymer adhesive layer.

摘要翻译： 本发明提供了一种将具有两个主表面的第一平面基板转移到第二基板的方法，包括以下步骤：形成第一平面基板，通过第一平面基板将第一平面基板的主表面附接到载体上 释放层; 用可固化聚合物粘合剂层将第一基底的另一个主表面附着到第二基底; 部分地固化聚合物粘合剂层，将释放层与第一基底断开，以将第一基底与摄像机分离，随后使聚合物粘合剂层进行粘合。