摘要:
A System-on-Chip (SoC) may be optically interconnected with memory. The SoC and a first electronic and photonic IC chip may be housed in a same semiconductor package. The first electronic and photonic IC chip may be in optical communication with a second electronic and photonic IC chip in electrical communication with memory. The first and second electronic and photonic IC chips may include microLEDs and photodetectors, for example bonded to surfaces of the first and second photonic IC chips. The optical communication may be through a transmission medium, which may be optical fibers. The optical fibers may be in one or more fiber bundles.
摘要:
Multi-chip modules in different semiconductor packages may be optically data coupled by way of LEDs and photodetectors linked by a multicore fiber. The multicore fiber may pass through apertures in the semiconductor packages, with an array of LEDs and photodetectors in the semiconductor package providing and receiving, respectively, optical signals comprised of data passed between the multi-chip modules.
摘要:
A multi-layer planar waveguide may be used in providing an interconnect for inter-chip and/or intra-chip signal transmission. Various embodiments to transmit optical signals are disclosed, along with designs of microLED optical assemblies, photodetector optical assemblies, waveguides, and multi-layer planar waveguides.
摘要:
Coupling of light from large angular distribution microLEDs into smaller angular acceptance distribution of transmission channels is performed using optical elements.
摘要:
An optical assembly includes a combination of laser sources emitting radiation, focused by a combination of lenses into optical waveguides. The optical waveguide and the laser source are permanently attached to a common carrier, while at least one of the lenses is attached to a holder that is an integral part of the carrier, but is free to move initially. Micromechanical techniques are used to adjust the position of the lens and holder, and then fix the holder it into place permanently using integrated heaters with solder.
摘要:
An optical assembly includes a combination of laser sources emitting radiation, focused by a combination of lenses into optical waveguides. The optical waveguide and the laser source are permanently attached to a common carrier, while at least one of the lenses is attached to a holder that is an integral part of the carrier, but is free to move initially. Micromechanical techniques are used to adjust the position of the lens and holder, and then fix the holder it into place permanently using integrated heaters with solder.
摘要:
A semiconductor laser with an integrated attenuator on the same chip as the laser. In some embodiments the attenuator is formed of the same material as the laser, but without a grating in the attenuator. In some embodiments the laser and attenuator are fabricated concurrently, with the attenuator positioned at the front of the laser and differing from the laser only in not having a grating and having a much smaller length. Level of attenuation by the attenuator is adjustable based on drawing photogenerated current from the attenuator.
摘要:
An optical communication system for transmitting multiple optical beams, each at a different wavelength is disclosed. The optical communication system includes a laser array having multiple laser transmitters transmitting multiple optical beams, each at a different wavelength. The optical communication system further includes a diffraction grating optically coupled to the laser array, the diffraction grating diffracting each of the optical beams at a substantially equal diffraction angle to form a combined optical beam. The combined beam is then focused into an optical communication media.
摘要:
A semiconductor laser capable of emitting in any one of standard communication wavelengths is of great practical value. To this end, a single semiconductor chip is fabricated on which many different distributed feedback (DFB) lasers are integrated. The device parameters of the different DFB lasers are varied such that each laser emits at a different wavelength. In addition a micro-mechanical optical element is packaged with the laser array, such that the position of the optical element controls which laser stripe is coupled to the output fiber. The micro-mechanical element or switch in various embodiments is a sliding waveguide, a movable lens, or a mirror that tilts. By selecting the particular DFB laser, controlling the temperature to fine tune the wavelength, and adjusting the position of the micro-mechanical optical element, the output wavelength is set to one of many communication wavelengths.
摘要:
A planar waveguide Mach-Zehnder interferometer (MZ) has improved performance as a variable optical attenuator as well as a thermo-optic switch (TOS) with reduced polarization dependent loss (PDL) in high attenuation states. The PDL was reduced by correcting for the increased birefringence that occurs on heating one waveguide arm by making the two waveguides inherently asymmetric, such that when one of the waveguides is heated, the differential birefringence of the two arms becomes zero. This asymmetry can be realized simply by changing the width of one of the waveguides. The modified device allows for very small PDL in the high attenuation state of a VOA and for theoretically perfect contrast in a TOS in the off state, with only a small penalty in PDL of the on state.