公开(公告)号：US06461435B1

公开(公告)日：2002-10-08

申请号：US09603117

申请日：2000-06-22

Applicant: Karl A. Littau ,  Bevan Vo ,  Salvador P. Umotoy ,  Son N. Trinh ,  Chien-Teh Kao ,  Ken Kaung Lai ,  Bo Zheng ,  Ping Jian ,  Siqing Lu ,  Anzhong Chang

Inventor： Karl A. Littau ,  Bevan Vo ,  Salvador P. Umotoy ,  Son N. Trinh ,  Chien-Teh Kao ,  Ken Kaung Lai ,  Bo Zheng ,  Ping Jian ,  Siqing Lu ,  Anzhong Chang

IPC: C23C1600

CPC classification number: C23C16/45565 ,  C23C16/455 ,  H01J37/3244

Abstract: A showerhead for distributing gases in a semiconductor process chamber. In one embodiment, a showerhead comprising a perforated center portion, a mounting portion circumscribing the perforated center portion and a plurality of bosses extending from the mounting portion each having a hole disposed therethrough is provided. Another embodiment of the invention provides a showerhead that includes a mounting portion having a first side circumscribing a perforated center portion. A ring extends from the first side of the mounting portion. A plurality of mounting holes are disposed in the mounting portion radially to either side of the ring. The showerhead provides controlled thermal transfer between the showerhead and chamber lid resulting in less deposition on the showerhead.

Abstract translation: 用于在半导体处理室中分配气体的喷头。 在一个实施例中，提供了一种喷头，包括穿孔中心部分，围绕穿孔中心部分的安装部分和从安装部分延伸的多个凸起，每个凸起具有穿过其中设置的孔。 本发明的另一个实施例提供了一种喷头，其包括具有围绕穿孔中心部分的第一侧面的安装部分。 环从安装部分的第一侧延伸。 多个安装孔径向地设置在安装部分的环的任一侧。 淋浴头在喷头和室盖之间提供受控的热转印，从而在喷头上沉积较少。