公开(公告)号：US20110024527A1

公开(公告)日：2011-02-03

申请号：US12903940

申请日：2010-10-13

申请人： Geun-Jo HAN ,  Jeong-Beom LEE ,  Bu-Jin KO

发明人： Geun-Jo HAN ,  Jeong-Beom LEE ,  Bu-Jin KO

IPC分类号： B05B1/14

CPC分类号： H01J37/3244 ,  C23C16/45565

摘要： A gas injector includes: a plate including at least one first injection hole; and at least one nozzle module combined with the plate, the at least one nozzle module including at least one second injection hole connected to the at least one first injection hole.

摘要翻译： 气体喷射器包括：板，包括至少一个第一喷射孔; 以及至少一个与所述板组合的喷嘴模块，所述至少一个喷嘴模块包括连接到所述至少一个第一喷射孔的至少一个第二喷射孔。

公开(公告)号：US07156950B2

公开(公告)日：2007-01-02

申请号：US10348550

申请日：2003-01-21

申请人： Hong-Seub Kim ,  Bu-Jin Ko

发明人： Hong-Seub Kim ,  Bu-Jin Ko

IPC分类号： C23F1/10 ,  H01L21/306 ,  C23C16/507

CPC分类号： H01L21/6715 ,  H01J37/321 ,  H01J37/3244

摘要： A gas diffusion plate supplying process gases into a chamber of an ICP (inductively coupled plasma) etcher is provided in the present invention. The gas diffusion plate includes a porous plate comprised of a plurality of balls and formed by compressing and curing the plurality of balls, the porous plate having a circular planar shape; a plurality of gas flow grooves formed on an upper surface of the porous plate; and a gas distribution plate having a plurality of gas-feed holes at the bottom thereof and a plurality of gas-feed passages in the side portion thereof, the gas distribution plate surrounding lower and side portions of the porous plate.

摘要翻译： 在本发明中提供了向ICP（电感耦合等离子体）蚀刻器的腔室供给处理气体的气体扩散板。 气体扩散板包括由多个球构成的多孔板，并且通过压缩和固化多个球而形成，多孔板具有圆形平面形状; 形成在所述多孔板的上表面上的多个气流槽; 以及气体分配板，其底部具有多个气体供给孔，并且在其侧部具有多个气体供给通道，所述气体分配板围绕所述多孔板的下部和侧部。

公开(公告)号：US20060219362A1

公开(公告)日：2006-10-05

申请号：US11395643

申请日：2006-03-31

申请人： Geun-Jo Han ,  Jeong-Beom Lee ,  Bu-Jin Ko

发明人： Geun-Jo Han ,  Jeong-Beom Lee ,  Bu-Jin Ko

IPC分类号： H01L21/306 ,  C23F1/00

CPC分类号： H01J37/3244 ,  C23C16/45565

摘要： A gas injector includes: a plate including at least one first injection hole; and at least one nozzle module combined with the plate, the at least one nozzle module including at least one second injection hole connected to the at least one first injection hole.

摘要翻译： 气体喷射器包括：板，包括至少一个第一喷射孔; 以及至少一个与所述板组合的喷嘴模块，所述至少一个喷嘴模块包括连接到所述至少一个第一喷射孔的至少一个第二喷射孔。

公开(公告)号：US06770836B2

公开(公告)日：2004-08-03

申请号：US10100983

申请日：2002-03-19

申请人： Gi-Chung Kwon ,  Hong-Sik Byun ,  Sung-Weon Lee ,  Hong-Seub Kim ,  Sun-Seok Han ,  Bu-Jin Ko ,  Joung-Sik Kim

发明人： Gi-Chung Kwon ,  Hong-Sik Byun ,  Sung-Weon Lee ,  Hong-Seub Kim ,  Sun-Seok Han ,  Bu-Jin Ko ,  Joung-Sik Kim

IPC分类号： B23K1000

CPC分类号： H01J37/321 ,  H01J37/32183 ,  H05H1/46

摘要： An impedance matching circuit for a plasma source includes: a first network including: a first coil; and a RF power supply applying a first voltage to the first coil; and a second network including; a second coil grounded having a second voltage, the second voltage being lower than the first voltage; first and second reactive elements, one end portion of the first and second reactive elements being connected to each end portion of the second coil, respectively; and a load connected to the other end portions of the first and second reactive elements, phases at two end portions of the load being different from each other.

摘要翻译： 一种用于等离子体源的阻抗匹配电路包括：第一网络，包括：第一线圈; 以及向所述第一线圈施加第一电压的RF电源; 和第二网络; 接地的第二线圈具有第二电压，第二电压低于第一电压; 第一和第二无功元件，第一和第二无功元件的一个端部分别连接到第二线圈的每个端部; 以及连接到第一和第二无功元件的另一端部的负载，负载的两个端部处的相位彼此不同。

公开(公告)号：US07846292B2

公开(公告)日：2010-12-07

申请号：US11395643

申请日：2006-03-31

申请人： Geun-Jo Han ,  Jeong-Beom Lee ,  Bu-Jin Ko

发明人： Geun-Jo Han ,  Jeong-Beom Lee ,  Bu-Jin Ko

IPC分类号： H01L21/326 ,  C23C16/505

CPC分类号： H01J37/3244 ,  C23C16/45565

摘要： A gas injector includes: a plate including at least one first injection hole; and at least one nozzle module combined with the plate, the at least one nozzle module including at least one second injection hole connected to the at least one first injection hole.

摘要翻译： 气体喷射器包括：板，包括至少一个第一喷射孔; 以及至少一个与所述板组合的喷嘴模块，所述至少一个喷嘴模块包括连接到所述至少一个第一喷射孔的至少一个第二喷射孔。

公开(公告)号：US06917508B2

公开(公告)日：2005-07-12

申请号：US10443304

申请日：2003-05-22

申请人： Joung-Sik Kim ,  Bu-Jin Ko

发明人： Joung-Sik Kim ,  Bu-Jin Ko

IPC分类号： H01L21/3065 ,  H01J37/32 ,  H01L21/683 ,  C23C16/00

CPC分类号： H01J37/3244 ,  H01J2237/0206 ,  H01L21/6831 ,  Y10T279/23

摘要： An apparatus for manufacturing a semiconductor device includes a chamber, upper and lower electrodes spacing apart and facing each other in the chamber, the upper and lower electrodes supplied with high frequency power to form plasma, an electrostatic chuck on the lower electrode and settling a substrate thereon, a chuck base between the electrostatic chuck and the lower electrode, and protecting the electrostatic chuck, and a helium line supplying helium gas to a gap between the substrate and the electrostatic chuck, the helium line filled with a plurality of fine insulating balls.

摘要翻译： 一种用于制造半导体器件的装置，包括：腔室，上下电极间隔开并且在腔室内相互面对，上下电极被提供高频电力以形成等离子体，静电卡盘位于下电极上并沉降基片 在静电吸盘和下电极之间的卡盘基座，并且保护静电卡盘，以及向基板和静电卡盘之间的间隙供给氦气的氦管线，氦管线填充有多个精细绝缘球。

公开(公告)号：US06847516B2

公开(公告)日：2005-01-25

申请号：US10234695

申请日：2002-09-04

申请人： Gi-Chung Kwon ,  Hong-Sik Byun ,  Sung-Weon Lee ,  Hong-Seub Kim ,  Sun-Seok Han ,  Bu-Jin Ko ,  Joung-Sik Kim

发明人： Gi-Chung Kwon ,  Hong-Sik Byun ,  Sung-Weon Lee ,  Hong-Seub Kim ,  Sun-Seok Han ,  Bu-Jin Ko ,  Joung-Sik Kim

IPC分类号： H01L21/3065 ,  H01L21/683 ,  H01T23/00

CPC分类号： H01L21/6833

摘要： An electrostatic chuck includes: a metal plate; a dielectric layer on the metal plate, the dielectric layer and the metal plate having a lift pin hole and an injection hole of a cooling gas; a lift pin moving up-and-down through the lift pin hole; first protection insulator on an inner surface of the lift pin hole; and second protection insulator on an inner surface of the injection hole.

摘要翻译： 静电卡盘包括：金属板; 金属板上的电介质层，电介质层和金属板具有提升销孔和冷却气体的注入孔; 升降销通过升降销孔上下移动; 第一保护绝缘子在提升销孔的内表面上; 和在注入孔的内表面上的第二保护绝缘体。

公开(公告)号：US06653988B2

公开(公告)日：2003-11-25

申请号：US10185676

申请日：2002-06-27

申请人： Gi Chung Kwon ,  Hong Sik Byun ,  Sung Weon Lee ,  Hong Seub Kim ,  Sun Seok Han ,  Bu Jin Ko ,  Joung Sik Kim

发明人： Gi Chung Kwon ,  Hong Sik Byun ,  Sung Weon Lee ,  Hong Seub Kim ,  Sun Seok Han ,  Bu Jin Ko ,  Joung Sik Kim

IPC分类号： H01Q136

CPC分类号： H01Q21/24 ,  H01Q1/38 ,  H01Q9/27 ,  H01Q21/20

摘要： Disclosed is a parallel resonance antenna comprising: a whirl antenna having a plurality of antenna units installed two-dimensionally and radially around a central point, each of the antenna units having a ground point at a predetermined position thereof, portions outside the ground points respectively being bent in a same direction, the antenna units having a same size and direction, angles between the antenna units at the central point being all the same; a central conductive line connected to the central point to be normal to the whirl antenna, for being supplied with an RF power; a metal plate installed over and apart from the whirl antenna, the metal plate being connected with end portions of the antenna units, and having a penetration hole through which the central conductive line passes without contacting with the metal plate; and a variable resonance capacitor installed in series between the central conductive line and the metal plate. According to a parallel resonance antenna, the geometrical structure enables to obtain a uniform plasma. Since the antenna has a small inductance, impedance matching is easy even at the VHF band. Also, at the resonance point, since the potential of the inner portions (Z1, Z2, Z3 and Z4) of the ground points of the antenna units is low, it becomes possible to decrease a non-desired sputtering phenomenon.