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公开(公告)号：US07999197B1
公开(公告)日：2011-08-16
申请号：US12426385
申请日：2009-04-20
IPC分类号： H01L23/28
CPC分类号： H01L25/0657 , H01L23/13 , H01L23/3128 , H01L23/49822 , H01L2224/45144 , H01L2224/48091 , H01L2225/06517 , H01L2225/06541 , H01L2924/01079 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： A method for making a dual sided electronic module. A substrate has a first surface that is substantially parallel to a second surface. The second surface forms a cavity extending into an interior portion of the substrate. The substrate has at least one through hole connecting the cavity to the first surface. A first component is mounted with respect to the first surface, and a second component is mounted at least partially within the cavity. An encapsulant is applied to the first surface and through the at least one through hole into the cavity about the second component.
摘要翻译： 一种制造双面电子模块的方法。 衬底具有基本上平行于第二表面的第一表面。 第二表面形成延伸到衬底内部的空腔。 衬底具有至少一个将空腔连接到第一表面的通孔。 相对于第一表面安装第一部件，并且第二部件至少部分地安装在腔内。 将密封剂施加到第一表面并且通过至少一个通孔围绕第二部件进入空腔。
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公开(公告)号：US08351221B2
公开(公告)日：2013-01-08
申请号：US13006845
申请日：2011-01-14
IPC分类号： H05K9/00
CPC分类号： H01L25/105 , H01L23/552 , H01L24/16 , H01L24/48 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/1461 , H01L2924/3025 , H01L2224/45099 , H01L2924/00
摘要： The present disclosure is related to an electronic assembly in a stacked configuration. Electronic components are formed on substrates at each level of the stacked configuration. Electromagnetic shield compartments may be provided which substantially encapsulate the electronic components. Conductive vias are formed within the substrates on each level of the stacked configuration and coupled to one another so that the electromagnetic shields at each level of the stack can couple to a common node.
摘要翻译： 本公开涉及一种堆叠结构的电子组件。 电子部件形成在层叠结构的各层的基板上。 可以提供基本上封装电子部件的电磁屏蔽室。 导电通孔在堆叠构造的每个级别上的衬底内形成并且彼此耦合，使得在堆叠的每个级别处的电磁屏蔽可以耦合到公共节点。
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公开(公告)号：US20120182706A1
公开(公告)日：2012-07-19
申请号：US13006845
申请日：2011-01-14
IPC分类号： H05K1/11
CPC分类号： H01L25/105 , H01L23/552 , H01L24/16 , H01L24/48 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/1461 , H01L2924/3025 , H01L2224/45099 , H01L2924/00
摘要： The present disclosure is related to an electronic assembly in a stacked configuration. Electronic components are formed on substrates at each level of the stacked configuration. Electromagnetic shield compartments may be provided which substantially encapsulate the electronic components. Conductive vias are formed within the substrates on each level of the stacked configuration and coupled to one another so that the electromagnetic shields at each level of the stack can couple to a common node.
摘要翻译： 本公开涉及一种堆叠结构的电子组件。 电子部件形成在层叠结构的各层的基板上。 可以提供基本上封装电子部件的电磁屏蔽室。 导电通孔在堆叠构造的每个级别上的衬底内形成并且彼此耦合，使得在堆叠的每个级别处的电磁屏蔽可以耦合到公共节点。
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