公开(公告)号：US20100259657A1

公开(公告)日：2010-10-14

申请号：US12491412

申请日：2009-06-25

申请人： Seung Hyun LEE ,  Chan Ki HWANG ,  Seung Ho LEE ,  Hee Jin PARK

发明人： Seung Hyun LEE ,  Chan Ki HWANG ,  Seung Ho LEE ,  Hee Jin PARK

IPC分类号： H04N5/335

CPC分类号： H01L27/14625 ,  H01L24/13 ,  H01L24/16 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14636 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13562 ,  H01L2224/1369 ,  H01L2224/1379 ,  H01L2224/138 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An image sensor module is presented which includes a semiconductor chip, a holder and a coupling member. The semiconductor chip has a semiconductor chip body; an image sensing section over the semiconductor chip body; and bonding pads on the semiconductor chip body. The holder is mounted over the semiconductor chip and has an insulation section over the semiconductor chip body; connection patterns on the insulation section which are electrically coupled to the bonding pads; and a transparent cover over the image sensing section which is connected to the insulation section. The coupling member is interposed between the holder and the semiconductor chip for coupling together the holder to the semiconductor chip.

摘要翻译： 提出了一种图像传感器模块，其包括半导体芯片，保持器和联接构件。 半导体芯片具有半导体芯片体; 半导体芯片本体上的图像感测部分; 以及半导体芯片主体上的接合焊盘。 保持器安装在半导体芯片上，并且在半导体芯片主体上方具有绝缘部分; 绝缘部分上的连接图案，其电耦合到接合焊盘; 以及连接到绝缘部分的图像感测部分上方的透明盖。 联接构件插入在保持器和半导体芯片之间，用于将保持器联接在半导体芯片上。

公开(公告)号：US20060284298A1

公开(公告)日：2006-12-21

申请号：US11302622

申请日：2005-12-14

申请人： Jae Myun Kim ,  Sung Ho Kim ,  Chan Ki Hwang

发明人： Jae Myun Kim ,  Sung Ho Kim ,  Chan Ki Hwang

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A chip stack package has semiconductor chips connected to the substrate by the same signal pathway lengths to prevent malfunction of the semiconductor chips. In the chip stack package, first and second semiconductor chips disposed opposite to each other. The first and second semiconductor chips having bonding bumps are bonded to upper and bottom surfaces of the pattern tape. The bonded chips are then bonded to an upper surface of a substrate. The bond fingers of the substrate are in electrical contact with the bond leads of the pattern tape. Ball lands are formed on the bottom surface of the substrate to which solder balls are attached.

摘要翻译： 芯片堆叠封装具有通过相同的信号通路长度连接到衬底的半导体芯片，以防止半导体芯片的故障。 在芯片堆叠封装中，彼此相对布置的第一和第二半导体芯片。 具有接合凸块的第一和第二半导体芯片被结合到图案带的上表面和底表面。 接合的芯片然后结合到基板的上表面。 基板的键合指与图案带的接合引线电接触。 在焊锡球附着的基板的底面形成有球面。

公开(公告)号：US08223248B2

公开(公告)日：2012-07-17

申请号：US12491412

申请日：2009-06-25

申请人： Seung Hyun Lee ,  Chan Ki Hwang ,  Seung Ho Lee ,  Hee Jin Park

发明人： Seung Hyun Lee ,  Chan Ki Hwang ,  Seung Ho Lee ,  Hee Jin Park

IPC分类号： H04N5/225 ,  H01L21/00 ,  H01L31/0232

CPC分类号： H01L27/14625 ,  H01L24/13 ,  H01L24/16 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14636 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13562 ,  H01L2224/1369 ,  H01L2224/1379 ,  H01L2224/138 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An image sensor module is presented which includes a semiconductor chip, a holder and a coupling member. The semiconductor chip has a semiconductor chip body; an image sensing section over the semiconductor chip body; and bonding pads on the semiconductor chip body. The holder is mounted over the semiconductor chip and has an insulation section over the semiconductor chip body; connection patterns on the insulation section which are electrically coupled to the bonding pads; and a transparent cover over the image sensing section which is connected to the insulation section. The coupling member is interposed between the holder and the semiconductor chip for coupling together the holder to the semiconductor chip.

摘要翻译： 提出了一种图像传感器模块，其包括半导体芯片，保持器和联接构件。 半导体芯片具有半导体芯片体; 半导体芯片本体上的图像感测部分; 以及半导体芯片主体上的接合焊盘。 保持器安装在半导体芯片上，并且在半导体芯片主体上方具有绝缘部分; 绝缘部分上的连接图案，其电耦合到接合焊盘; 以及连接到绝缘部分的图像感测部分上方的透明盖。 联接构件插入在保持器和半导体芯片之间，用于将保持器联接在半导体芯片上。