摘要:
A radio frequency (RF) integrated circuit with electrostatic discharge (ESD) protection and an ESD protection apparatus thereof are provided. The ESD protection apparatus includes a substrate, an RF bonding pad, and an ESD protection unit. The RF bonding pad for transmitting RF signal is disposed upon the substrate. The ESD protection unit is disposed under the RF bonding pad. Wherein, The ESD protection unit includes an inductor electrically connected between the RF bonding pad and the power rail.
摘要:
The invention is directed to a method for manufacturing a metal-insulator-metal transformer together with a capacitor. The method comprises steps of providing a substrate having at least a dielectric layer formed thereon and then forming a first metal layer of the metal-insulator-metal capacitor together with a first metal coil of the transformer over the substrate. An insulating layer is formed to cover the substrate, the first metal layer and the first metal coil. A second metal layer of the metal-insulator-metal capacitor is formed together with a second metal coil of the transformer on the insulating layer.
摘要:
A transmit-receive switch for ultrawideband and a method for isolating transmitting and receiving signal thereof are provided. The transmit-receive switch includes a first switch, a second switch, and an inductor. The first switch has a first end coupled to a signal transmitting end, a second end coupled to a signal transmit-receive end, and a control end receiving a first control signal to decide whether or not to turn on the first switch according to the first controlling signal. The second switch has a first end coupled to a signal receiving end, a second end coupled to the signal transmit-receive end, and a control end receiving a second control signal to decide whether or not to turn on the second switch according to the second controlling signal. The inductor has an end coupled to the signal transmit-receive end, and another end coupled to a first potential.
摘要:
The invention is directed to a method for manufacturing a metal-insulator-metal transformer together with a capacitor. The method comprises steps of providing a substrate having at least a dielectric layer formed thereon and then forming a first metal layer of the metal-insulator-metal capacitor together with a first metal coil of the transformer over the substrate. An insulating layer is formed to cover the substrate, the first metal layer and the first metal coil. A second metal layer of the metal-insulator-metal capacitor is formed together with a second metal coil of the transformer on the insulating layer.