公开(公告)号：US08667442B1

公开(公告)日：2014-03-04

申请号：US13523786

申请日：2012-06-14

申请人： Wei M. Tian ,  An-Chang Deng ,  Che-Cheng Lin

发明人： Wei M. Tian ,  An-Chang Deng ,  Che-Cheng Lin

IPC分类号： G06F17/50

CPC分类号： G06F17/5036 ,  G06F2217/78

摘要： A method for calculating leakage current associated with an integrated circuit, includes selecting a sampling point at which an input signal for the integrated circuit is in a quiescent state and determining the leakage current associated with the integrated circuit using the selected sampling point.

摘要翻译： 一种用于计算与集成电路相关的漏电流的方法，包括：选择集成电路的输入信号处于静止状态的采样点，并使用所选择的采样点确定与集成电路相关的漏电流。

公开(公告)号：US06289412B1

公开(公告)日：2001-09-11

申请号：US09267333

申请日：1999-03-12

申请人： Chen-Ping Yuan ,  Che-Cheng Lin ,  You-Pang Wei

发明人： Chen-Ping Yuan ,  Che-Cheng Lin ,  You-Pang Wei

IPC分类号： G06F1750

CPC分类号： G06F17/5022 ,  G06F17/5081

摘要： A process is provided for generating a synoptic layout database for efficient layout parasitic extraction and circuit simulation in post-layout verification of an integrated circuit (IC) design for a system having a plurality of repetitive subcircuits. The process includes the steps of: receiving an input layout database including a plurality of geometric objects including cells representing the IC design, each of the cells including a plurality of polygons; identifying a plurality of repetitive cells of the input layout database, the repetitive cells being associated with the repetitive sub-circuits; recognizing at least one pattern of the repetitive cells; defining at least one cut region of the input layout database, the cut region being defined by physical layout coordinates, the cut region intersecting a corresponding pattern of the repetitive cells; and generating a synoptic layout database.

摘要翻译： 提供了一种用于生成用于具有多个重复子电路的系统的集成电路（IC）设计的布局后验证中的有效布局寄生提取和电路模拟的概要布局数据库的过程。 该过程包括以下步骤：接收包括包括表示IC设计的单元的多个几何对象的输入布局数据库，每个单元包括多个多边形; 识别所述输入布局数据库的多个重复单元，所述重复单元与所述重复子电路相关联; 识别重复细胞的至少一种模式; 限定输入布局数据库的至少一个切割区域，切割区域由物理布局坐标定义，切割区域与重复单元格的相应图案相交; 并生成概要布局数据库。

公开(公告)号：US20050159316A1

公开(公告)日：2005-07-21

申请号：US10758190

申请日：2004-01-16

申请人： Chia-Chung Chen ,  Che-Cheng Lin

发明人： Chia-Chung Chen ,  Che-Cheng Lin

IPC分类号： A01N25/04 ,  A01N25/12

CPC分类号： A01N25/04

摘要： A water dispersible granule includes the ingredients of wetting agent, dispersing agent, binder, disintegratant, acid, base, carrier and pesticide, wherein the above ingredients are combined to be 100%. All the above components of insecticide are mixed with water and extruded. The extruded material is baked in an oven that has operation temperature set from 40° C. to 50° C. and the baked material ground into small granules by machine or manpower.

摘要翻译： 水分散性颗粒包括润湿剂，分散剂，粘合剂，崩解剂，酸，碱，载体和农药的成分，其中上述成分组合为100％。 所有上述杀虫剂成分与水混合并挤出。 挤出的材料在烘箱中烘烤，操作温度设定为40℃至50℃，烘烤的材料通过机器或人力研磨成小颗粒。

公开(公告)号：US06392888B1

公开(公告)日：2002-05-21

申请号：US09746597

申请日：2000-12-20

申请人： Yung Chou Chen ,  Che Cheng Lin ,  Hsueh Sheng Hsiao

发明人： Yung Chou Chen ,  Che Cheng Lin ,  Hsueh Sheng Hsiao

IPC分类号： H05K720

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L23/4093 ,  H01L23/552 ,  H01L2924/0002 ,  Y10T29/49359 ,  H01L2924/00

摘要： A heat dissipation assembly comprises a printed circuit board (PCB) (20), a chip (30) and a heat sink (10). The PCB comprises a grounding circuit and four through apertures (22) in the grounding circuit. The chip is mounted on the PCB, and is surrounded by the through apertures. The heat sink has four metal columns (16) depending from a bottom surface of a base (12) thereof, the columns corresponding to the four through apertures. A method of assembling the heat dissipation assembly includes the steps of: mounting a chip on a PCB; inserting metal columns of a heat sink into corresponding through apertures of the PCB; and welding the metal columns in the through apertures so that the heat sink is in intimate thermal contact with an upper surface of the chip.

摘要翻译： 散热组件包括印刷电路板（PCB）（20），芯片（30）和散热片（10）。 PCB包括接地电路和接地电路中的四个通孔（22）。 芯片安装在PCB上，并被通孔包围。 散热器具有从其底部（12）的底表面悬垂的四个金属柱（16），所述列对应于四个通孔。 组装散热组件的方法包括以下步骤：将芯片安装在PCB上; 将散热器的金属柱插入到PCB的相应的通孔中; 并且将金属柱焊接在通孔中，使得散热器与芯片的上表面紧密地热接触。