公开(公告)号：US08033039B2

公开(公告)日：2011-10-11

申请号：US12547575

申请日：2009-08-26

申请人： Edward-yi Chang ,  Li-Han Hsu ,  Chee-Way Oh ,  Wei-Cheng Wu ,  Chin-te Wang

发明人： Edward-yi Chang ,  Li-Han Hsu ,  Chee-Way Oh ,  Wei-Cheng Wu ,  Chin-te Wang

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/66 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/6627 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81444 ,  H01L2224/81895 ,  H01L2224/82203 ,  H01L2224/83102 ,  H01L2224/83104 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/19033 ,  H01L2224/0401

摘要： In a high frequency flip chip package process of a polymer substrate and a structure thereof, the structure is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer structure packaged by the high frequency flip chip package process. The conventional structure not only incurs additional insertion loss and return loss in its high frequency characteristic, but also brings out a reliability issue. Thus, the manufacturing process of a ceramic substrate in the conventional structure still has the disadvantages of a poor yield rate and a high cost.

摘要翻译： 在聚合物基板的高频倒装芯片封装工艺及其结构中，该结构是通过高频倒装芯片封装工艺封装的单层结构，以克服由高频率封装的常规双层结构的缺点 倒装芯片封装过程。 常规结构不仅在其高频特性中引起额外的插入损耗和回波损耗，而且带来可靠性问题。 因此，传统结构中的陶瓷基板的制造工序仍然具有成品率低，成本高的缺点。

公开(公告)号：US20110186974A1

公开(公告)日：2011-08-04

申请号：US13085602

申请日：2011-04-13

申请人： Edward-yi Chang ,  Li-Han Hsu ,  Chee-Way Oh ,  Wei-Cheng Wu ,  Chin-te Wang

发明人： Edward-yi Chang ,  Li-Han Hsu ,  Chee-Way Oh ,  Wei-Cheng Wu ,  Chin-te Wang

IPC分类号： H01L23/50

CPC分类号： H01L23/66 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/6627 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81444 ,  H01L2224/81895 ,  H01L2224/82203 ,  H01L2224/83102 ,  H01L2224/83104 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/19033 ,  H01L2224/0401

摘要： A high frequency flip chip package substrate of a polymer is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer structure packaged by the high frequency flip chip package process. The conventional structure not only incurs additional insertion loss and return loss in its high frequency characteristic, but also brings out a reliability issue. Thus, the manufacturing process of a ceramic substrate in the conventional structure still has the disadvantages of a poor yield rate and a high cost.

摘要翻译： 聚合物的高频倒装芯片封装衬底是通过高频倒装芯片封装工艺封装的单层结构，以克服通过高频倒装芯片封装工艺封装的常规双层结构的缺点。 常规结构不仅在其高频特性中引起额外的插入损耗和回波损耗，而且带来可靠性问题。 因此，传统结构中的陶瓷基板的制造工序仍然具有成品率低，成本高的缺点。

公开(公告)号：US08258606B2

公开(公告)日：2012-09-04

申请号：US13085602

申请日：2011-04-13

申请人： Edward-yi Chang ,  Li-Han Hsu ,  Chee-Way Oh ,  Wei-Cheng Wu ,  Chin-te Wang

发明人： Edward-yi Chang ,  Li-Han Hsu ,  Chee-Way Oh ,  Wei-Cheng Wu ,  Chin-te Wang

IPC分类号： H01L23/50 ,  H01L29/40

CPC分类号： H01L23/66 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/6627 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81444 ,  H01L2224/81895 ,  H01L2224/82203 ,  H01L2224/83102 ,  H01L2224/83104 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/19033 ,  H01L2224/0401

摘要： A high frequency flip chip package substrate of a polymer is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer structure packaged by the high frequency flip chip package process. The conventional structure not only incurs additional insertion loss and return loss in its high frequency characteristic, but also brings out a reliability issue. Thus, the manufacturing process of a ceramic substrate in the conventional structure still has the disadvantages of a poor yield rate and a high cost.

摘要翻译： 聚合物的高频倒装芯片封装衬底是通过高频倒装芯片封装工艺封装的单层结构，以克服通过高频倒装芯片封装工艺封装的常规双层结构的缺点。 常规结构不仅在其高频特性中引起额外的插入损耗和回波损耗，而且带来可靠性问题。 因此，传统结构中的陶瓷基板的制造工序仍然具有成品率低，成本高的缺点。