公开(公告)号：US20130270216A1

公开(公告)日：2013-10-17

申请号：US13448478

申请日：2012-04-17

申请人： CHENG-HSIUNG YANG

发明人： CHENG-HSIUNG YANG

IPC分类号： H05K3/00 ,  B32B38/10 ,  B05D5/12

CPC分类号： H05K3/0085 ,  H05K1/0393 ,  H05K3/0008 ,  H05K2201/10424 ,  H05K2203/167

摘要： A method of thin printed circuit board wet process consistency on the same carrier, and more particularly to a printed circuit board in the developing, copper plating, stripping, etching and other wet processes uses the same frame as a carrier from the beginning to the end of the wet process, such that the thin printed circuit board is conducted a continuous and automatic wet process to avoid disassembly, storage and transportation between each process. Moreover, when using the flame, the thin printed circuit board is smooth and flattening in the wet process for avoiding “water effect,” the effective area is not exposed to any mechanical members for preventing scratches, and there are point contacts between the thin printed circuit board and the frame for preventing chemical residue. Accordingly, the present invention can not only enhance the yield of the thin printed circuit board but also shorten the production time.

摘要翻译： 一种薄印刷电路板在相同载体上湿法稠度的方法，更具体地说涉及在显影，镀铜，剥离，蚀刻和其它湿法工艺中的印刷电路板，从开始到结束使用与载体相同的框架 使得薄的印刷电路板进行连续和自动的湿法，以避免在每个工艺之间的拆卸，储存和运输。 此外，当使用火焰时，薄的印刷电路板在湿法中平滑且扁平化以避免“水分效应”，有效区域不暴露于任何机械构件以防止划伤，并且薄印刷 电路板和防止化学残留物的框架。 因此，本发明不仅可以提高薄印刷电路板的产量，而且缩短生产时间。

公开(公告)号：US06979886B2

公开(公告)日：2005-12-27

申请号：US10109781

申请日：2002-03-29

申请人： Jui-Hsiang Hung ,  Chin-Teng Hsu ,  Cheng-Hsiung Yang ,  Chih-Jen Yang

发明人： Jui-Hsiang Hung ,  Chin-Teng Hsu ,  Cheng-Hsiung Yang ,  Chih-Jen Yang

IPC分类号： H01L23/31 ,  H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A short-prevented lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein each lead of the lead frame is formed with a thickness-reduced portion at a peripheral position of the lead frame, allowing thickness-reduced portions of adjacent leads to be arranged in a stagger manner. This stagger arrangement significantly increases pitches between the neighboring thickness-reduced portions of leads. Therefore, during a singulation process as to cut through the leads, lead bridging and short-circuiting between adjacent leads caused by cut-side burrs can be prevented from occurrence, whereby singulation quality and product yield and reliability are effectively improved.

摘要翻译： 提出一种防短引线框架和一种用于制造具有引线框架的半导体封装件的方法，其中引线框架的每个引线在引线框架的周边位置处形成有厚度减小部分，从而允许厚度减小的部分 的相邻导线以错开的方式布置。 这种交错布置显着增加了引线的相邻厚度减小部分之间的间距。 因此，在切断引线的切割过程中，可以防止由切断毛刺引起的相邻导线之间的引线桥接和短路，从而有效地提高切割质量和产品成品率和可靠性。

公开(公告)号：US08858808B2

公开(公告)日：2014-10-14

申请号：US13448478

申请日：2012-04-17

申请人： Cheng-Hsiung Yang

发明人： Cheng-Hsiung Yang

IPC分类号： H01B13/00

CPC分类号： H05K3/0085 ,  H05K1/0393 ,  H05K3/0008 ,  H05K2201/10424 ,  H05K2203/167

摘要： A method of thin printed circuit board wet process consistency on the same carrier, and more particularly to a printed circuit board in the developing, copper plating, stripping, etching and other wet processes uses the same frame as a carrier from the beginning to the end of the wet process, such that the thin printed circuit board is conducted a continuous and automatic wet process to avoid disassembly, storage and transportation between each process. Moreover, when using the flame, the thin printed circuit board is smooth and flattening in the wet process for avoiding “water effect,” the effective area is not exposed to any mechanical members for preventing scratches, and there are point contacts between the thin printed circuit board and the frame for preventing chemical residue. Accordingly, the present invention can not only enhance the yield of the thin printed circuit board but also shorten the production time.

摘要翻译： 一种薄印刷电路板在相同载体上湿法稠度的方法，更具体地说涉及在显影，镀铜，剥离，蚀刻和其它湿法工艺中的印刷电路板，从开始到结束使用与载体相同的框架 使得薄的印刷电路板进行连续和自动的湿法，以避免在每个工艺之间的拆卸，储存和运输。 此外，当使用火焰时，薄的印刷电路板在湿法中平滑且扁平化以避免“水分效应”，有效区域不暴露于任何机械构件以防止划伤，并且薄印刷 电路板和防止化学残留物的框架。 因此，本发明不仅可以提高薄印刷电路板的产量，而且缩短生产时间。