公开(公告)号：US20100236817A1

公开(公告)日：2010-09-23

申请号：US12408719

申请日：2009-03-22

Applicant: Kuo-Ching Chen ,  Tsung-Yuan Chen ,  Cheng-Pin Chien

Inventor： Kuo-Ching Chen ,  Tsung-Yuan Chen ,  Cheng-Pin Chien

IPC: H01L21/98 ,  C23F1/00 ,  H01L21/52 ,  H01L21/56 ,  H05K1/09

CPC classification number: H01L23/3128 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/183 ,  H05K1/186 ,  H05K3/06 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/0361 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/308 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/0401

Abstract: A method of making a package substrate includes providing a cladding sheet comprising a first metal layer, a second metal layer and an intermediate layer between the first and second metal layers; etching away a portion of the first metal layer to expose a portion of the intermediate layer thereby forming a metal island body; laminating a first copper clad on the cladding sheet comprising a first copper foil and a first insulating layer; patterning the first copper foil to form a first circuit trace; patterning the second metal layer to form a second circuit trace; removing the metal island body to form a cavity in the first insulating layer; and removing the intermediate layer from bottom of the cavity.

Abstract translation: 制造封装衬底的方法包括提供包括第一金属层，第二金属层和第一和第二金属层之间的中间层的覆层片; 蚀刻掉第一金属层的一部分以暴露中间层的一部分，从而形成金属岛体; 在包括第一铜箔和第一绝缘层的包层片上层叠第一铜包层; 图案化第一铜箔以形成第一电路迹线; 图案化第二金属层以形成第二电路迹线; 去除所述金属岛体以在所述第一绝缘层中形成空腔; 以及从腔的底部去除中间层。

公开(公告)号：US20100206619A1

公开(公告)日：2010-08-19

申请号：US12485889

申请日：2009-06-16

Applicant: Kuo-Ching Chen ,  Tsung-Yuan Chen ,  Cheng-Pin Chien

Inventor： Kuo-Ching Chen ,  Tsung-Yuan Chen ,  Cheng-Pin Chien

IPC: H05K1/00 ,  H05K1/16 ,  H05K1/11 ,  H05K3/30

CPC classification number: H05K1/183 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K1/0206 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0361 ,  H05K2201/10545 ,  H05K2203/308 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package substrate structure includes a substrate with a first side and a second side opposite to the first side, a via connecting the first side and the second side, a cavity in the substrate and on the first side, and a patterned conductive layer disposed on at least one of the first side and the second side, filling the cavity and the via, and including a first conductive layer, a second conductive layer and a third conductive layer. The second conductive layer is different from at least one of the first conductive layer and the third conductive layer.

Abstract translation: 封装衬底结构包括具有第一侧和与第一侧相对的第二侧的衬底，连接第一侧和第二侧的通孔，在衬底中和第一侧上的空腔，以及设置在第一侧上的图案化导电层 第一侧和第二侧中的至少一个，填充空腔和通孔，并且包括第一导电层，第二导电层和第三导电层。 第二导电层与第一导电层和第三导电层中的至少一个不同。

公开(公告)号：US08049114B2

公开(公告)日：2011-11-01

申请号：US12408719

申请日：2009-03-22

Applicant: Kuo-Ching Chen ,  Tsung-Yuan Chen ,  Cheng-Pin Chien

Inventor： Kuo-Ching Chen ,  Tsung-Yuan Chen ,  Cheng-Pin Chien

IPC: H05K1/03

CPC classification number: H01L23/3128 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/183 ,  H05K1/186 ,  H05K3/06 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/0361 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/308 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/0401

Abstract: A method of making a package substrate includes providing a cladding sheet comprising a first metal layer, a second metal layer and an intermediate layer between the first and second metal layers; etching away a portion of the first metal layer to expose a portion of the intermediate layer thereby forming a metal island body; laminating a first copper clad on the cladding sheet comprising a first copper foil and a first insulating layer; patterning the first copper foil to form a first circuit trace; patterning the second metal layer to form a second circuit trace; removing the metal island body to form a cavity in the first insulating layer; and removing the intermediate layer from bottom of the cavity.

Abstract translation: 制造封装衬底的方法包括提供包括第一金属层，第二金属层和第一和第二金属层之间的中间层的覆层片; 蚀刻掉第一金属层的一部分以暴露中间层的一部分，从而形成金属岛体; 在包括第一铜箔和第一绝缘层的包层片上层叠第一铜包层; 图案化第一铜箔以形成第一电路迹线; 图案化第二金属层以形成第二电路迹线; 去除所述金属岛体以在所述第一绝缘层中形成空腔; 以及从腔的底部去除中间层。