公开(公告)号：US20150003065A1

公开(公告)日：2015-01-01

申请号：US14241102

申请日：2012-08-31

Applicant: Peng Chen ,  Xiaomian Chen ,  ChengCheng Feng ,  Hao Li

Inventor： Peng Chen ,  Xiaomian Chen ,  ChengCheng Feng ,  Hao Li

IPC: H01L33/64 ,  H01L25/13 ,  F21V29/00 ,  H01L33/62

CPC classification number: H01L33/642 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L24/45 ,  H01L25/0753 ,  H01L25/13 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2924/00014 ,  H01L2224/48

Abstract: An LED lighting assembly may include: a substrate, a metal layer applied on the substrate, and an LED chip provided on the metal layer, wherein the metal layer comprises a first region for heat dissipation and two second regions for electric conduction, and the first region and the two second regions are electrically insulated from each other, and wherein the LED chip is provided in the first region and is respectively electrically connected with the two second regions via wires.

Abstract translation: LED照明组件可以包括：衬底，施加在衬底上的金属层和设置在金属层上的LED芯片，其中金属层包括用于散热的第一区域和用于导电的两个第二区域，并且第一 并且所述两个第二区域彼此电绝缘，并且其中所述LED芯片设置在所述第一区域中，并且经由导线分别与所述两个第二区域电连接。