公开(公告)号：US4434434A

公开(公告)日：1984-02-28

申请号：US249261

申请日：1981-03-30

申请人： Somnath Bhattacharya ,  Shih-Ming Hu ,  Nicholas G. Koopman ,  Chester C. Oldakowski

发明人： Somnath Bhattacharya ,  Shih-Ming Hu ,  Nicholas G. Koopman ,  Chester C. Oldakowski

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/532 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/62

CPC分类号： H01L24/10 ,  H01L23/53209 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14

摘要： A controlled geometric configuration of contact pads for securing solder mounds to an integrated circuit chip which reduces cracking of brittle passivating coatings in fabrication of components.

摘要翻译： 用于将焊接块固定到集成电路芯片的接触焊盘的受控几何构型，其减少部件制造中脆性钝化涂层的开裂。

公开(公告)号：US5631058A

公开(公告)日：1997-05-20

申请号：US929194

申请日：1992-08-12

申请人： Richard H. Flachbart ,  Albert P. Lee ,  Stafford Miller ,  Chester C. Oldakowski ,  Swie-In Tan

发明人： Richard H. Flachbart ,  Albert P. Lee ,  Stafford Miller ,  Chester C. Oldakowski ,  Swie-In Tan

IPC分类号： C23C14/34 ,  G11B5/73 ,  G11B5/84 ,  G11B5/85 ,  G11B5/66

CPC分类号： G11B5/7325 ,  G11B5/8404 ,  Y10S428/90

摘要： According to the present invention, a blank of an aluminum alloy is partially cut so as to form several disks maintained in the blank by portions of the remaining uncut aluminum. This results in the disks being supported in the blank during formation of the thin films, yet easily separated from the blank into individual disks after the thin films have been deposited. Therefore, multiple disks can be processed during a single manufacturing step.

摘要翻译： 根据本发明，铝合金坯件被部分切割，以便通过剩余未切割铝的一部分形成保持在坯料中的多个盘。 这导致在薄膜形成期间盘被支撑在坯料中，并且在薄膜沉积之后容易地从坯料上分离成单独的盘。 因此，在单个制造步骤中可以处理多个磁盘。