公开(公告)号：US20240123580A1

公开(公告)日：2024-04-18

申请号：US17968616

申请日：2022-10-18

申请人： Chih-Ping PENG

发明人： Chih-Ping PENG

IPC分类号： B25B15/04

CPC分类号： B25B15/04 ,  B25B23/0035

摘要： A hand tool capable of switching operating direction includes: a handgrip (10); an actuating unit (20) having an actuating seat (21) and a positioning set (25), the actuating seat (21) has an accommodating slot (221) and pivotal slots (222), the positioning set (25) has an elastic member (26) and a positioning member (27); a positioning unit (30) having latching members (31) and an elastic unit (32), the latching members (31) is pivotally connected to the pivotal slot (222) and has a latching tooth (331); a switching component (40) having a rotation disk (41) and abutting blocks (42), the rotation disk (41) has positioning slots (43) allowing the positioning member (27) to be mounted; and a rotating rod (50) having a ratchet (52); the positioning member (27) is selectively mounted in one of the positioning slots (27) when the rotation disk (41) is being rotated.

公开(公告)号：US08138597B2

公开(公告)日：2012-03-20

申请号：US12939561

申请日：2010-11-04

申请人： Wan-Lan Chiang ,  Kuang Hann Lin ,  Chih-Ping Peng

发明人： Wan-Lan Chiang ,  Kuang Hann Lin ,  Chih-Ping Peng

IPC分类号： H01L23/34 ,  H01L21/00 ,  H01L23/10

CPC分类号： H01L23/367 ,  H01L23/4093 ,  H01L23/4334 ,  H01L23/49562 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/014

摘要： A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inward along the heat sink surface from the first layer. The subassembly also includes a second patterned polymer layer disposed on a radially outer portion of the first patterned polymer layer. The first and second layers define a cell for accommodating a power semiconductor die. Solder material is disposed on the exposed portion of the heat sink surface and in the cell. A power semiconductor die is located within the cell on a radially inward portion of the first layer and thermally coupled to the heat sink by the solder material.

摘要翻译： 半导体组件包括第一子组件，其包括散热器和设置在散热器的表面上以限定第一表面的暴露部分的第一图案化聚合物层。 第一表面的暴露部分沿着散热表面从第一层径向向内延伸。 子组件还包括设置在第一图案化聚合物层的径向外部部分上的第二图案化聚合物层。 第一和第二层限定用于容纳功率半导体管芯的电池。 焊料设置在散热器表面的暴露部分和电池中。 功率半导体管芯位于第一层的径向向内部分内的单元内，并通过焊料材料热耦合到散热器。

公开(公告)号：US07838985B2

公开(公告)日：2010-11-23

申请号：US11827593

申请日：2007-07-12

申请人： Wan-Lan Chiang ,  Kuang Hann Lin ,  Chih-Ping Peng

发明人： Wan-Lan Chiang ,  Kuang Hann Lin ,  Chih-Ping Peng

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L23/367 ,  H01L23/4093 ,  H01L23/4334 ,  H01L23/49562 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/014

摘要： A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inward along the heat sink surface from the first layer. The subassembly also includes a second patterned polymer layer disposed on a radially outer portion of the first patterned polymer layer. The first and second layers define a cell for accommodating a power semiconductor die. Solder material is disposed on the exposed portion of the heat sink surface and in the cell. A power semiconductor die is located within the cell on a radially inward portion of the first layer and thermally coupled to the heat sink by the solder material.

摘要翻译： 半导体组件包括第一子组件，其包括散热器和设置在散热器的表面上以限定第一表面的暴露部分的第一图案化聚合物层。 第一表面的暴露部分沿着散热表面从第一层径向向内延伸。 子组件还包括设置在第一图案化聚合物层的径向外部部分上的第二图案化聚合物层。 第一和第二层限定用于容纳功率半导体管芯的电池。 焊料设置在散热器表面的暴露部分和电池中。 功率半导体管芯位于第一层的径向向内部分内的单元内，并通过焊料材料热耦合到散热器。

公开(公告)号：US07489071B2

公开(公告)日：2009-02-10

申请号：US11593499

申请日：2006-11-07

申请人： Yu-Han Chien ,  Chih-Ping Peng ,  Chuan-Hsu Fu ,  Wei-Yi Lin ,  Lih-Hsiung Chan

发明人： Yu-Han Chien ,  Chih-Ping Peng ,  Chuan-Hsu Fu ,  Wei-Yi Lin ,  Lih-Hsiung Chan

IPC分类号： H01J1/62

CPC分类号： H01J63/02 ,  H01J7/18 ,  H01J29/94 ,  H01J31/127 ,  H01J61/26 ,  H01J2329/948

摘要： The present invention provides a field emission system and a method for improving its vacuum. The present invention employs aging surface-unsaturated carbon nanotubes in non-display areas of the field emission system as getter material to absorb residual gas within the system so as to improve its vacuum. The present method for improving vacuum of the field emission system can be integrated with the standard process of a field emission display device without additional fabricating steps, and thus facilitating the mass production of the field emission display device.

摘要翻译： 本发明提供一种场致发射系统及其真空改善方法。 本发明在场发射系统的非显示区域中使用老化的表面 - 不饱和碳纳米管作为吸收材料以吸收系统内的残余气体，从而改善其真空度。 用于改善场致发射系统的真空的本方法可以与场发射显示装置的标准过程结合而不需要额外的制造步骤，从而有助于场发射显示装置的大规模生产。

公开(公告)号：US20090014862A1

公开(公告)日：2009-01-15

申请号：US11827592

申请日：2007-07-12

申请人： Wan-Lan Chiang ,  Kuang Hann Lin ,  Chih-Ping Peng

发明人： Wan-Lan Chiang ,  Kuang Hann Lin ,  Chih-Ping Peng

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L23/367 ,  H01L23/4093 ,  H01L23/4334 ,  H01L23/49562 ,  H01L2924/0002 ,  H01L2924/00

摘要： The semiconductor assembly includes a first subassembly having a heat sink. Solder material is disposed on the exposed portion of a first surface of heat sink. A power semiconductor die is located on the first surface of the heat sink and is thermally coupled thereto by the solder material. A packaging patterned polymer layer is disposed on a second surface of the heat sink opposing the first surface and defines an interior surface portion of the heat sink. A semiconductor package is provided in which the first subassembly, solder material and die are located such that the interior surface portion of the second surface of the heat sink is not enclosed by the semiconductor package.

摘要翻译： 半导体组件包括具有散热器的第一子组件。 焊料设置在散热片的第一表面的暴露部分上。 功率半导体管芯位于散热器的第一表面上并且通过焊料材料热耦合到其上。 封装图案化聚合物层设置在散热器的与第一表面相对的第二表面上并且限定散热器的内表面部分。 提供了半导体封装，其中第一子组件，焊料材料和管芯被定位成使得散热器的第二表面的内表面部分不被半导体封装封闭。

公开(公告)号：US20070210695A1

公开(公告)日：2007-09-13

申请号：US11434888

申请日：2006-05-17

申请人： Chih-Ping Peng ,  Yun-Jiau Shiau

发明人： Chih-Ping Peng ,  Yun-Jiau Shiau

IPC分类号： H01J1/62 ,  H01J63/04 ,  H01J9/24

CPC分类号： H01J9/385 ,  H01J7/22 ,  H01J9/40 ,  H01J29/865 ,  H01J63/04

摘要： This invention provides a method for maintaining vacuum of a panel module and a structure of the panel module. A sealing material is suspended inside the panel module right above an exhaust opening of the panel module connecting with an exhaust tube. After exhausting the inside of the panel module, the sealing material is heated and molten so as to drop down to seal the exhaust tube. As such, the panel module becomes vacuum-tight. During a subsequent annealing process to heat the exhaust tube to its melting temperature, ambient air is prohibited from flowing into the panel module.

摘要翻译： 本发明提供一种用于维持面板模块的真空度和面板模块的结构的方法。 密封材料悬挂在与排气管连接的面板模块的排气口正上方的面板模块内。 在排出面板模块的内部之后，将密封材料加热并熔融以便下降以密封排气管。 因此，面板模块变得真空。 在随后的退火过程中将排气管加热到其熔化温度时，禁止环境空气流入面板模块。

公开(公告)号：US08252633B2

公开(公告)日：2012-08-28

申请号：US13031658

申请日：2011-02-22

申请人： Wan-Lan Chiang ,  Kuang Hann Lin ,  Chih-Ping Peng

发明人： Wan-Lan Chiang ,  Kuang Hann Lin ,  Chih-Ping Peng

IPC分类号： H01L21/00

CPC分类号： H01L23/367 ,  H01L23/4093 ,  H01L23/4334 ,  H01L23/49562 ,  H01L2924/0002 ,  H01L2924/00

摘要： The semiconductor assembly includes a first subassembly having a heat sink. Solder material is disposed on the exposed portion of a first surface of heat sink. A power semiconductor die is located on the first surface of the heat sink and is thermally coupled thereto by the solder material. A packaging patterned polymer layer is disposed on a second surface of the heat sink opposing the first surface and defines an interior surface portion of the heat sink. A semiconductor package is provided in which the first subassembly, solder material and die are located such that the interior surface portion of the second surface of the heat sink is not enclosed by the semiconductor package.

摘要翻译： 半导体组件包括具有散热器的第一子组件。 焊料设置在散热片的第一表面的暴露部分上。 功率半导体管芯位于散热器的第一表面上并且通过焊料材料热耦合到其上。 封装图案化聚合物层设置在散热器的与第一表面相对的第二表面上并且限定散热器的内表面部分。 提供了半导体封装，其中第一子组件，焊料材料和管芯被定位成使得散热器的第二表面的内表面部分不被半导体封装封闭。

公开(公告)号：US20090014863A1

公开(公告)日：2009-01-15

申请号：US11827593

申请日：2007-07-12

申请人： Wan-Lan Chiang ,  Kuang Hann Lin ,  Chih-Ping Peng

发明人： Wan-Lan Chiang ,  Kuang Hann Lin ,  Chih-Ping Peng

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L23/367 ,  H01L23/4093 ,  H01L23/4334 ,  H01L23/49562 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/014

摘要： A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inward along the heat sink surface from the first layer. The subassembly also includes a second patterned polymer layer disposed on a radially outer portion of the first patterned polymer layer. The first and second layers define a cell for accommodating a power semiconductor die. Solder material is disposed on the exposed portion of the heat sink surface and in the cell. A power semiconductor die is located within the cell on a radially inward portion of the first layer and thermally coupled to the heat sink by the solder material.

摘要翻译： 半导体组件包括第一子组件，其包括散热器和设置在散热器的表面上以限定第一表面的暴露部分的第一图案化聚合物层。 第一表面的暴露部分沿着散热表面从第一层径向向内延伸。 子组件还包括设置在第一图案化聚合物层的径向外部部分上的第二图案化聚合物层。 第一和第二层限定用于容纳功率半导体管芯的电池。 焊料设置在散热器表面的暴露部分和电池中。 功率半导体管芯位于第一层的径向向内部分内的单元内，并通过焊料材料热耦合到散热器。

公开(公告)号：US20110171784A1

公开(公告)日：2011-07-14

申请号：US13031658

申请日：2011-02-22

申请人： Wan-Lan Chiang ,  Kuang Hann Lin ,  Chih-Ping Peng

发明人： Wan-Lan Chiang ,  Kuang Hann Lin ,  Chih-Ping Peng

IPC分类号： H01L21/52

CPC分类号： H01L23/367 ,  H01L23/4093 ,  H01L23/4334 ,  H01L23/49562 ,  H01L2924/0002 ,  H01L2924/00

摘要： The semiconductor assembly includes a first subassembly having a heat sink. Solder material is disposed on the exposed portion of a first surface of heat sink. A power semiconductor die is located on the first surface of the heat sink and is thermally coupled thereto by the solder material. A packaging patterned polymer layer is disposed on a second surface of the heat sink opposing the first surface and defines an interior surface portion of the heat sink. A semiconductor package is provided in which the first subassembly, solder material and die are located such that the interior surface portion of the second surface of the heat sink is not enclosed by the semiconductor package.

摘要翻译： 半导体组件包括具有散热器的第一子组件。 焊料设置在散热片的第一表面的暴露部分上。 功率半导体管芯位于散热器的第一表面上并且通过焊料材料热耦合到其上。 封装图案化聚合物层设置在散热器的与第一表面相对的第二表面上并且限定散热器的内表面部分。 提供了半导体封装，其中第一子组件，焊料材料和管芯被定位成使得散热器的第二表面的内表面部分不被半导体封装封闭。

公开(公告)号：US07780494B2

公开(公告)日：2010-08-24

申请号：US12320233

申请日：2009-01-22

申请人： Chih-Ping Peng ,  Yun-Jiau Shiau

发明人： Chih-Ping Peng ,  Yun-Jiau Shiau

IPC分类号： H01J9/26 ,  H01J9/32

CPC分类号： H01J9/385 ,  H01J7/22 ,  H01J9/40 ,  H01J29/865 ,  H01J63/04

摘要： This invention provides a method for maintaining vacuum of a panel module and a structure of the panel module. A sealing material is suspended inside the panel module right above an exhaust opening of the panel module connecting with an exhaust tube. After exhausting the inside of the panel module, the sealing material is heated and molten so as to drop down to seal the exhaust tube. As such, the panel module becomes vacuum-tight. During a subsequent annealing process to heat the exhaust tube to its melting temperature, ambient air is prohibited from flowing into the panel module.

摘要翻译： 本发明提供一种用于维持面板模块的真空度和面板模块的结构的方法。 密封材料悬挂在与排气管连接的面板模块的排气口正上方的面板模块内。 在排出面板模块的内部之后，将密封材料加热并熔融以便下降以密封排气管。 因此，面板模块变得真空。 在随后的退火过程中将排气管加热到其熔化温度时，禁止环境空气流入面板模块。