公开(公告)号：US08354598B2

公开(公告)日：2013-01-15

申请号：US12731480

申请日：2010-03-25

Applicant: Chin-Ming Liu

Inventor： Chin-Ming Liu

IPC: H05K1/03

CPC classification number: H05K13/00 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2203/0152 ,  H05K2203/1536 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for fabricating a packaging substrate includes: stacking two metal layers; encapsulating the two metal layers with assistant dielectric layers; forming built-up structures on the assistant dielectric layers, respectively; and separating the built-up structures along the interface between the two metal layers so as to form two packaging substrates. Owing to the adhesive characteristic of the assistant dielectric layers, the two metal layers are unlikely to separate from each other during formation of the built-up structures. But after portions of the dielectric layer around the periphery of the metal layers are cut and removed, the two metal layers can be readily separated from each other. The two metal layers can be patterned to form wiring layers, metal bumps, or supporting structures to avoid waste of materials. A packaging substrate and a fabrication method thereof are provided.

Abstract translation: 一种用于制造封装衬底的方法包括：堆叠两个金属层; 用辅助电介质层封装两个金属层; 分别在辅助电介质层上形成堆积结构; 并且沿着两个金属层之间的界面分离堆积结构，以形成两个封装基板。 由于辅助电介质层的粘合特性，在形成构造结构期间，两个金属层不可能彼此分离。 但是，在金属层周围的电介质层的部分被切割和去除之后，两个金属层可以容易地彼此分离。 可以将两个金属层图案化以形成布线层，金属凸块或支撑结构，以避免材料浪费。 提供了一种封装基板及其制造方法。

公开(公告)号：US20100225285A1

公开(公告)日：2010-09-09

申请号：US12585265

申请日：2009-09-10

Applicant: Ming Chiang Ting ,  Chun-Te Chiang ,  Chin Ming Liu ,  Ker Cheng Liu

Inventor： Ming Chiang Ting ,  Chun-Te Chiang ,  Chin Ming Liu ,  Ker Cheng Liu

IPC: G05F1/10

CPC classification number: G05F1/573 ,  H02J7/0073

Abstract: An adaptive power converter controller coupled to a load and a power converter circuit is provided. The adaptive power converter controller has an adaptive voltage sensing unit and a converting control circuit. The adaptive voltage sensing unit is coupled to the load and output a voltage sensing signal according to a load current and a load voltage from the load. The converting control circuit is utilized for receiving the voltage sensing signal and comparing the voltage level of the voltage sensing signal with a current sensing signal, which is corresponding solely to the load current, so as to decide whether the power converter circuit is controlled according to the voltage sensing signal or the current sensing signal.

Abstract translation: 提供耦合到负载和功率转换器电路的自适应功率转换器控制器。 自适应功率转换器控制器具有自适应电压感测单元和转换控制电路。 自适应电压感测单元耦合到负载，并根据负载电流和来自负载的负载电压输出电压感测信号。 转换控制电路用于接收电压检测信号，并将电压检测信号的电压电平与只对应负载电流相对应的电流检测信号进行比较，以便决定电源转换器电路是否根据 电压感测信号或电流感测信号。

公开(公告)号：US08168513B2

公开(公告)日：2012-05-01

申请号：US12780439

申请日：2010-05-14

Applicant: Chin-Ming Liu

Inventor： Chin-Ming Liu

IPC: H01L21/336

CPC classification number: H01L21/6835 ,  H01L21/4857

Abstract: A method for fabricating a packaging substrate includes: providing a base having a release film with two opposite surfaces, two first auxiliary dielectric layers enclosing the release film, and two metal layers disposed on the two first auxiliary dielectric layers, therewith an effective area defined on the two metal layers; forming an inner wiring layer from the two metal layers; forming on each of the two first auxiliary dielectric layers and the inner wiring layers a built-up structure having first conductive pads so as for two initial substrates to be formed on the opposite surfaces of the release film; removing whatever is otherwise lying outside the effective area; removing the release film; and forming dielectric layer openings in the two first auxiliary dielectric layers so as for two substrate bodies to be formed from the initial substrates, wherein a portion of the inner wiring layers are exposed to thereby function as second conductive pads.

Abstract translation: 一种用于制造封装衬底的方法，包括：提供具有两个相对表面的剥离膜的基底，包围隔离膜的两个第一辅助电介质层和设置在两个第一辅助介电层上的两个金属层，其中限定在 两层金属层; 从所述两个金属层形成内部布线层; 在两个第一辅助介电层和内部布线层中的每一个上形成具有第一导电焊盘的组合结构，以便形成在剥离膜的相对表面上的两个初始基板; 除去在有效区域之外的任何东西; 去除脱模膜; 以及在两个第一辅助电介质层中形成电介质层开口，以便由初始衬底形成两个衬底体，其中一部分内部配线层被暴露，从而起第二导电焊盘的作用。

公开(公告)号：US20100319966A1

公开(公告)日：2010-12-23

申请号：US12731480

申请日：2010-03-25

Applicant: Chin-Ming Liu

Inventor： Chin-Ming Liu

IPC: H05K1/03 ,  B32B37/00 ,  B32B38/10 ,  H05K1/11

CPC classification number: H05K13/00 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2203/0152 ,  H05K2203/1536 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for fabricating a packaging substrate includes: stacking two metal layers; encapsulating the two metal layers with assistant dielectric layers; forming built-up structures on the assistant dielectric layers, respectively; and separating the built-up structures along the interface between the two metal layers so as to form two packaging substrates. Owing to the adhesive characteristic of the assistant dielectric layers, the two metal layers are unlikely to separate from each other during formation of the built-up structures. But after portions of the dielectric layer around the periphery of the metal layers are cut and removed, the two metal layers can be readily separated from each other. The two metal layers can be patterned to form wiring layers, metal bumps, or supporting structures to avoid waste of materials. A packaging substrate and a fabrication method thereof are provided.

Abstract translation: 一种用于制造封装衬底的方法包括：堆叠两个金属层; 用辅助电介质层封装两个金属层; 分别在辅助电介质层上形成堆积结构; 并且沿着两个金属层之间的界面分离堆积结构，以形成两个封装基板。 由于辅助电介质层的粘合特性，在形成构造结构期间，两个金属层不可能彼此分离。 但是，在金属层周围的电介质层的部分被切割和去除之后，两个金属层可以容易地彼此分离。 可以将两个金属层图案化以形成布线层，金属凸块或支撑结构，以避免材料浪费。 提供了一种封装基板及其制造方法。

公开(公告)号：US20110037445A1

公开(公告)日：2011-02-17

申请号：US12652188

申请日：2010-01-05

Applicant: MING CHIANG TING ,  CHUN-TE CHIANG ,  CHIN MING LIU ,  KER CHENG LIU

Inventor： MING CHIANG TING ,  CHUN-TE CHIANG ,  CHIN MING LIU ,  KER CHENG LIU

IPC: G05F1/10

CPC classification number: G05F1/573 ,  H02J7/0073 ,  H02M3/156 ,  H02M2001/0025

Abstract: A power control circuit with wire compensation is provided. The power control circuit is applied in a power converter, which has an output coupled to a load through a power wire. The power control circuit has an adaptive sensing circuit and a controller. The adaptive sensing circuit is utilized for detecting an output voltage of the power converter and a current on the power wire and generating a feedback signal according to the output voltage and the current on the power wire. The controller is utilized for adjusting a level of the output voltage according to the feedback signal.

Abstract translation: 提供电线补偿电源控制电路。 功率控制电路被应用在功率转换器中，其具有通过电源线耦合到负载的输出。 功率控制电路具有自适应感测电路和控制器。 自适应感测电路用于检测功率转换器的输出电压和电源线上的电流，并根据输出电压和电源线上的电流产生反馈信号。 控制器用于根据反馈信号调节输出电压的电平。

公开(公告)号：US20100314037A1

公开(公告)日：2010-12-16

申请号：US12780439

申请日：2010-05-14

Applicant: Chin-Ming Liu

Inventor： Chin-Ming Liu

IPC: B32B38/10 ,  B32B38/04

CPC classification number: H01L21/6835 ,  H01L21/4857

Abstract: A method for fabricating a packaging substrate includes: providing a base having a release film with two opposite surfaces, two first auxiliary dielectric layers enclosing the release film, and two metal layers disposed on the two first auxiliary dielectric layers, therewith an effective area defined on the two metal layers; forming an inner wiring layer from the two metal layers; forming on each of the two first auxiliary dielectric layers and the inner wiring layers a built-up structure having first conductive pads so as for two initial substrates to be formed on the opposite surfaces of the release film; removing whatever is otherwise lying outside the effective area; removing the release film; and forming dielectric layer openings in the two first auxiliary dielectric layers so as for two substrate bodies to be formed from the initial substrates, wherein a portion of the inner wiring layers are exposed to thereby function as second conductive pads.

Abstract translation: 一种用于制造封装衬底的方法，包括：提供具有两个相对表面的剥离膜的基底，包围隔离膜的两个第一辅助电介质层和设置在两个第一辅助介电层上的两个金属层，其中限定在 两层金属层; 从所述两个金属层形成内部布线层; 在两个第一辅助介电层和内部布线层中的每一个上形成具有第一导电焊盘的组合结构，以便形成在剥离膜的相对表面上的两个初始基板; 除去在有效区域之外的任何东西; 去除脱模膜; 以及在两个第一辅助电介质层中形成电介质层开口，以便由初始衬底形成两个衬底体，其中一部分内部配线层被暴露，从而起第二导电焊盘的作用。