-
公开(公告)号:US20120012998A1
公开(公告)日:2012-01-19
申请号:US12837717
申请日:2010-07-16
IPC分类号: H01L23/498 , H01L21/60 , H01L21/768
CPC分类号: H01L24/81 , H01L21/76877 , H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/742 , H01L25/0657 , H01L25/50 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/0347 , H01L2224/0361 , H01L2224/0401 , H01L2224/051 , H01L2224/05567 , H01L2224/056 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11472 , H01L2224/1161 , H01L2224/11849 , H01L2224/119 , H01L2224/13017 , H01L2224/13018 , H01L2224/13021 , H01L2224/13023 , H01L2224/13076 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/16058 , H01L2224/16148 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2225/06513 , H01L2924/00013 , H01L2924/00014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/3841 , H01L2224/13099 , H01L2224/05552 , H01L2924/00
摘要: Electromigration in microbump connections causes voids in the microbumps, which reduces the lifetime of an integrated circuit containing the microbump. Electromigration lifetime may be increased in microbumps by forming a copper shell around the solder. The copper shell of one microbump contacts the copper shell of a second microbump to enclose the solder of the microbump connection. The copper shell allows higher current densities through the microbump. Thus, smaller microbumps may be manufactured on a smaller pitch without suffering failure from electromigration. Additionally, the copper shell reduces shorting or bridging between microbump connections on a substrate.
摘要翻译: 微型接头中的电迁移会导致微胶囊中的空隙,从而降低了包含微型电池的集成电路的使用寿命。 通过在焊料周围形成铜壳,可能会在微胶囊中增加电迁移寿命。 一个微型块的铜壳接触第二个微型块的铜壳,以封闭微型接头的焊料。 铜壳允许通过微型块的更高的电流密度。 因此,可以以更小的间距制造较小的微胶片,而不会发生电迁移的故障。 此外,铜壳减少了衬底上的微型接头之间的短路或桥接。