-
公开(公告)号：US6095904A
公开(公告)日：2000-08-01
申请号：US595182
申请日：1996-02-01
申请人： Joseph R. Breivogel , Samuel F. Louke , Michael R. Oliver , Leopoldo D. Yau , Christopher E. Barns
发明人： Joseph R. Breivogel , Samuel F. Louke , Michael R. Oliver , Leopoldo D. Yau , Christopher E. Barns
CPC分类号： B24B37/105 , B24B37/26 , B24B57/02
摘要： A method and apparatus for polishing a thin film formed on a semiconductor substrate. A table covered with a polishing pad is orbited about an axis. Slurry is fed through a plurality of spaced-apart holes formed through the polishing pad to uniformly distribute slurry across the pad surface during polishing. A substrate is pressed face down against the orbiting pad's surface and rotated to facilitate, along with the slurry, the polishing of the thin film formed on the substrate.
摘要翻译： 一种用于抛光形成在半导体衬底上的薄膜的方法和设备。 用抛光垫覆盖的工作台围绕一个轴线旋转。 浆料通过穿过抛光垫形成的多个间隔开的孔进料，以在抛光期间均匀地分布浆料穿过垫表面。 衬底被向下压靠在轨道垫的表面上并且被旋转以促进与浆料一起对形成在衬底上的薄膜的抛光。
-
2.发明授权Orbital motion chemical-mechanical polishing apparatus and method of fabrication 失效轨道运动化学机械抛光装置及其制造方法
公开(公告)号：US5554064A
公开(公告)日：1996-09-10
申请号：US103412
申请日：1993-08-06
申请人： Joseph R. Breivogel , Samuel F. Louke , Michael R. Oliver , Leopoldo D. Yau , Christopher E. Barns
发明人： Joseph R. Breivogel , Samuel F. Louke , Michael R. Oliver , Leopoldo D. Yau , Christopher E. Barns
CPC分类号： B24B37/105 , B24B37/26 , B24B57/02
摘要： A method and apparatus for polishing a thin film formed on a semiconductor substrate. A table covered with a polishing pad is orbited about an axis. Slurry is fed through a plurality of spaced-apart holes formed through the polishing pad to uniformly distribute slurry across the pad surface during polishing. A substrate is pressed face down against the orbiting pad's surface and rotated to facilitate, along with the slurry, the polishing of the thin film formed on the substrate.
摘要翻译： 一种用于抛光形成在半导体衬底上的薄膜的方法和设备。 用抛光垫覆盖的工作台围绕一个轴线旋转。 浆料通过穿过抛光垫形成的多个间隔开的孔进料，以在抛光期间均匀地分布浆料穿过垫表面。 衬底被向下压靠在轨道垫的表面上并且被旋转以促进与浆料一起对形成在衬底上的薄膜的抛光。
-
公开(公告)号：US5547417A
公开(公告)日：1996-08-20
申请号：US210957
申请日：1994-03-21
IPC分类号： B24B53/007 , B24B53/017 , B24B53/00
CPC分类号： B24B53/017
摘要： A method of polishing a thin film formed on a semiconductor substrate. In a method of the present invention a polishing pad is rotated. A substrate is pressed against the rotating polishing pad so that the thin film to be polished is placed in direct contact with the polishing pad. During polishing, the polishing pad is continually conditioned by forming a plurality of grooves into the polishing pad. The grooves are formed by a conditioning block having a substantially planar bottom surface with a plurality of groove generating points extending from the substantially planar surface of the conditioning block. The grooves are generated by sweeping and rotating the conditioning block between an outer radius and an inner radius of the polishing pad.
摘要翻译： 一种抛光形成在半导体衬底上的薄膜的方法。 在本发明的方法中，抛光垫旋转。 将衬底压靠在旋转的抛光垫上，使待抛光的薄膜与抛光垫直接接触。 在抛光期间，通过在抛光垫中形成多个凹槽来不断地调节抛光垫。 凹槽由具有基本平坦的底表面的调节块形成，多个凹槽产生点从调节块的基本平坦的表面延伸。 通过在抛光垫的外半径和内半径之间扫掠并旋转调节块来产生凹槽。
-
4.发明授权
公开(公告)号：US5635083A
公开(公告)日：1997-06-03
申请号：US467546
申请日：1995-06-06
IPC分类号： B24B37/30 , B24B37/32 , B24B49/16 , H01L21/306 , H01L21/3105 , H01L21/321
CPC分类号： H01L21/3212 , B24B37/30 , B24B37/32 , B24B49/16 , H01L21/31053
摘要： A novel method and apparatus for uniformly polishing thin films formed on a semiconductor substrate. A substrate is placed face down on a moving polishing pad so that the thin film to be polished is placed in direct contact with the moving polishing pad. The substrate is forcibly pressed against the polishing pad with pneumatic or hydraulic pressure applied to the backside of the substrate during polishing. Additionally, a wear ring is placed on the polishing pad around and adjacent to the substrate and forcibly pressed onto the polishing pad with a downward pressure from a second source so that the wear ring is coplanar with the substrate in order to eliminate edge rounding effects.
-
公开(公告)号：US6106662A
公开(公告)日：2000-08-22
申请号：US93467
申请日：1998-06-08
申请人： Thomas Frederick Allen Bibby, Jr. , John A. Adams , Robert A. Eaton , Christopher E. Barns , Charles Hannes
发明人： Thomas Frederick Allen Bibby, Jr. , John A. Adams , Robert A. Eaton , Christopher E. Barns , Charles Hannes
IPC分类号： B24B37/013 , B24B49/12 , B24D7/12 , H01L21/304 , B24B5/00
CPC分类号： B24B37/013 , B24B49/12 , B24D7/12
摘要： An apparatus to generate an endpoint signal to control the polishing of thin films on a semiconductor wafer surface includes a through-hole in a polish pad, a light source, a fiber optic cable, a light sensor, and a computer. A pad assembly includes the polish pad, a pad backer, and a pad backing plate. The pad backer includes a pinhole and a canal that holds the fiber optic cable. The pad backer holds the polish pad so that the through-hole is coincident with the pinhole opening. A wafer chuck holds a semiconductor wafer so that the surface to be polished is against the polish pad. The light source provides light within a predetermined bandwidth. The fiber optic cable propagates the light through the through-hole opening to illuminate the surface as the pad assembly orbits and the chuck rotates. The light sensor receives reflected light from the surface through the fiber optic cable and generates reflected spectral data. The computer receives the reflected spectral data and calculates an endpoint signal. For metal film polishing, the endpoint signal is based upon the intensities of two individual wavelength bands. For dielectric film polishing, the endpoint signal is based upon fitting of the reflected spectrum to an optical reflectance model to determine remaining film thickness. The computer compares the endpoint signal to predetermined criteria and stops the polishing process when the endpoint signal meets the predetermined criteria.
-
公开(公告)号：US6083089A
公开(公告)日：2000-07-04
申请号：US909348
申请日：1997-08-11
IPC分类号： B24B37/30 , B24B37/32 , B24B49/16 , H01L21/306 , H01L21/3105 , H01L21/321 , B24B5/00
CPC分类号： H01L21/3212 , B24B37/30 , B24B37/32 , B24B49/16 , H01L21/31053
摘要： A novel method and apparatus for uniformly polishing thin films formed on a semiconductor substrate. A substrate is placed face down on a moving polishing pad so that the thin film to be polished is placed in direct contact with the moving polishing pad. The substrate is forcibly pressed against the polishing pad with pneumatic or hydraulic pressure applied to the backside of the substrate during polishing. Additionally, a wear ring is placed on the polishing pad around and adjacent to the substrate and forcibly pressed onto the polishing pad with a downward pressure from a second source so that the wear ring is coplanar with the substrate in order to eliminate edge rounding effects.
摘要翻译： 一种用于均匀研磨形成在半导体衬底上的薄膜的新方法和装置。 将基板面朝下放置在移动的抛光垫上，使得待抛光的薄膜与移动的抛光垫直接接触。 在抛光期间，基板被强制地压在抛光垫上，气压或液压施加到基板的背面。 此外，磨损环被放置在抛光垫周围并且与基底相邻并且以来自第二源的向下的压力被强制地压在抛光垫上，使得磨损环与基底共面以消除边缘圆化效应。
-
公开(公告)号：US4271761A
公开(公告)日：1981-06-09
申请号：US32305
申请日：1979-04-23
CPC分类号： F42B12/68
摘要： A high acceleration umbilical cable deployment system for enabling electrical communication between a ballistic projectile forebody and an afterbody. A cable coiled on a spool is housed within a ballistic casing having a drag funnel at the rear end. The cable is sandwiched between a foam plug and the drag funnel before it leaves the forebody and is secured in a strain relief at the apex of a funnel in the afterbody. On deployment, when the bodies are separated, energies that would tend to rupture the cable are expended by the funnels, plug and strain relief.
摘要翻译： 一种高速加速脐带部署系统，用于实现弹道射弹前体与后身之间的电气通信。 卷绕在线轴上的电缆被容纳在具有在后端的拖漏漏斗的弹道外壳内。 电缆在离开前体之前夹在泡沫塞和牵引漏斗之间，并固定在后身体漏斗尖端处的应变消除中。 在部署时，当物体分离时，容易破裂电缆的能量会被漏斗，堵塞和应变消除所消耗。
-
-
-
-
-
-
搜索结果
7 条记录 (耗时 0.013 秒)
