公开(公告)号：US20060049411A1

公开(公告)日：2006-03-09

申请号：US10848937

申请日：2004-05-18

申请人： Shuji Nakamura ,  Steven DenBaars ,  John Edmond ,  Chuck Swoboda ,  Umesh Mishra

发明人： Shuji Nakamura ,  Steven DenBaars ,  John Edmond ,  Chuck Swoboda ,  Umesh Mishra

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/465 ,  H01L33/0079 ,  H01L33/105 ,  H01L33/145 ,  H01L33/32 ,  H01L33/38 ,  H01L2933/0016

摘要： A method according to the present invention for fabricating high light extraction photonic devices comprising growing an epitaxial semiconductor structure on a substrate and depositing a first mirror layer on the epitaxial semiconductor structure such that the epitaxial semiconductor structure is sandwiched between the first mirror layer and the substrate. Flip-chip mounting the epitaxial semiconductor structure, with its first mirror and substrate on a submount such that the epitaxial semiconductor device structure is sandwiched between the submount and substrate. The substrate is then removed from the epitaxial structure by introducing an etch environment to the substrate. A second mirror layer is deposited on the epitaxial semiconductor structure such that the epitaxial semiconductor structure is sandwiched between the first and second mirror layers. A device according to the present invention comprising a resonant cavity light emitting diode (RCLED) mounted to a submount.

摘要翻译： 根据本发明的用于制造高光提取光子器件的方法，包括在衬底上生长外延半导体结构并在外延半导体结构上沉积第一镜面层，使得外延半导体结构夹在第一镜面层和衬底之间 。 倒装芯片将外延半导体结构安装，其第一反射镜和衬底位于基座上，使得外延半导体器件结构夹在底座和衬底之间。 然后通过向衬底引入蚀刻环境，从衬底去除衬底。 第二镜层沉积在外延半导体结构上，使得外延半导体结构夹在第一和第二镜层之间。 根据本发明的装置包括安装到底座的谐振腔发光二极管（RCLED）。

公开(公告)号：US07332365B2

公开(公告)日：2008-02-19

申请号：US10848937

申请日：2004-05-18

申请人： Shuji Nakamura ,  Steven DenBaars ,  John Edmond ,  Chuck Swoboda ,  Umesh Mishra

发明人： Shuji Nakamura ,  Steven DenBaars ,  John Edmond ,  Chuck Swoboda ,  Umesh Mishra

IPC分类号： H01L21/00 ,  H01L33/00

CPC分类号： H01L33/465 ,  H01L33/0079 ,  H01L33/105 ,  H01L33/145 ,  H01L33/32 ,  H01L33/38 ,  H01L2933/0016

摘要： A method according to the present invention for fabricating high light extraction photonic devices comprising growing an epitaxial semiconductor structure on a substrate and depositing a first mirror layer on the epitaxial semiconductor structure such that the epitaxial semiconductor structure is sandwiched between the first mirror layer and the substrate. Flip-chip mounting the epitaxial semiconductor structure, with its first mirror and substrate on a submount such that the epitaxial semiconductor device structure is sandwiched between the submount and substrate. The substrate is then removed from the epitaxial structure by introducing an etch environment to the substrate. A second mirror layer is deposited on the epitaxial semiconductor structure such that the epitaxial semiconductor structure is sandwiched between the first and second mirror layers. A device according to the present invention comprising a resonant cavity light emitting diode (RCLED) mounted to a submount.

摘要翻译： 根据本发明的用于制造高光提取光子器件的方法，包括在衬底上生长外延半导体结构并在外延半导体结构上沉积第一镜面层，使得外延半导体结构夹在第一镜面层和衬底之间 。 倒装芯片安装外延半导体结构，其第一反射镜和衬底位于基座上，使得外延半导体器件结构夹在基座和衬底之间。 然后通过向衬底引入蚀刻环境，从衬底去除衬底。 第二镜层沉积在外延半导体结构上，使得外延半导体结构夹在第一和第二镜层之间。 根据本发明的装置包括安装到底座的谐振腔发光二极管（RCLED）。